• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.1
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• pp.87-93
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• 2012

In this paper, we proposed a faulty pattern detection algorithm of TCP(Tape Carrier Package)/COF(Chip On Film), and implemented a real-time system for inspecting TCP/COF. Since TCP/COF has very high resolution having several micro meters, the human operator should visually inspect all the parts through microscope. In this work, we implement an inspection system to detect the faulty pattern, so the operator can visually inspect only the designated parts by the inspection system through the monitor. The proposed defects detection algorithm for TCP/COF packages is implemented by the pattern matching method based on subtracting the reference image from test image. To evaluate performance of the proposal system. we made various experiments according to type of CCD camera and light source as well as illumination projection method. From experimental results, it is confirmed that the proposed system makes it possible to detect effectively the defective TCP/COF film.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2008.04a
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• pp.174-175
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• 2008

본 논문에서는 반도체 패키징 기술의 일종인 TCP, COF의 제품 결함을 영상 처리를 이용하여 검출하는 알고리즘을 제시하고, 신뢰성을 확보 후 실제 검사 공정에 적용하는 방법론을 제시한다. 제안된 방법으로는 TCP, COF의 양품 패턴을 기준 영상으로 취득하고, 제품의 생산 과정에서 라인 스캔 카메라를 이용한 실시간 제품 영상을 취득한 후, 그레이 레벨 영상으로 변환하고, 노이즈를 제거하기 위한 다양한 필터를 적용한다. 그리고 기준 영상과 비교하기 위한 이진화와 라벨링을 통해 제품의 불량을 검출하여, 사용자에게 시각적으로 표현해 주게 된다. 마지막으로 TCP, COF의 다양한 불량 항목 중에서 10여 가지의 불량패턴을 대상으로 제안된 방법의 타당성을 검증하였다.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.153-154
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• 2007

본 논문에서는 반도체 패키징 기술의 일종인 TCP와 COF의 패턴 결함을 검출하는 영상 처리 알고리즘을 제안한다. 제안된 방법은 우선, TCP와 COF의 양품 패턴을 기준 영상으로 취득한다. 라인 스캐너에서 취득된 실시간 영상을 그레이로 변환한 후, 평균화 필터를 적용하고 임계값을 이용해서 검사하고자 하는 필름 영상의 이진화를 수행한다. 이진화 된 기준 영상과 검사하고자 하는 필름 영상을 이용해서 차영상을 구한 후에 라벨링을 하여 필름의 불량을 검출하게 된다. 제안된 패턴 매칭 방법이 TCP와 COF의 다양한 불량 항목 중에서 10여 가지의 불량 패턴을 대상으로 제안된 방법의 타당성을 검증하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.151-151
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• 2003

최근 휴대폰용 LCD, 컴퓨터용 TFT LCD, 가정용 PDP 등 평판 디스플레이 산업의 발달에 힘입어 평판 디스플레이 장치의 구동 칩 실장 부품인 TCP(tape carrier package), COF(chip on film) 제조 산업 또한 발전하고 있다. 이들 TCP, COF는 디스플레이 장치의 경박화에 따라 보다 가는 선폭의 회로가 요구되어지는데 이를 위해 회로를 구성하는 기본소재로 얇은 두께의 동박이 사용된다. 회로기판용 동박으로는 압연동박과 전해동박이 함께 사용되어 왔으나 박막의 제조가 어려운 압연동박의 단점과 면에 수직한 주상정 조직이 발달해 있어 일반 압연 동박에 비해 접착력이 뛰어나며 전류밀도 또는 티타늄 음극 드럼 회전 속도를 조절하여 두게 조절이 용이한 전해동박의 장점으로 인해 현재 압연동박의 전해동박으로의 대체가 증가하고 있다. 전해동박의 제조공정은 크게 제박 공정과 후처리 공정으로 나눌 수 있다. 전해동박은 먼저 드럼형태의 티타늄 음극과 불용성 납 양극으로 이루어진 제박기에 고 전류를 가하여 황산구리 용액 중 구리를 티타늄 음극에 석출시킴으로서 구리 원박을 제조한 후 접착력 향상을 위한 노듈 형성, 방식, 방청, 내열성 향상 등을 위한 여러 개의 단위 셀 조합으로 이루어진 후처리 공정을 거쳐 제조된다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.1018-1020
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• 2013

Conventionally, PCB fabrication processes detects simply electrical characteristics of TCP and COF by automatic manufacturing system and additionally, by introducing human visual detection, those are very ineffective in view of low cost implementation. So, this paper presents an efficient detection algorithm for short and protrusion-type defects based on reference images by using local binary pattern analysis. The proposed methods include several preprocessing techniques such as histogram equalizing, the compensation of spatial position and maximum distortion coordination Through several experiments, it is shown that the proposed method can improve the defect detection performance compared to the conventional schemes.

• Journal of the Semiconductor & Display Technology
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• v.4 no.4 s.13
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• pp.27-31
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• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.