• Title/Summary/Keyword: System Packaging

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WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.53-58
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    • 2003

  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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A Study on the Waste Reduction of Parcel Delivery Packaging (택배 유통포장 폐기물 감량화 방안 연구)

  • Oh, Jae Young;Jo, Hyun Jun;Suh, Sang Uk;Lee, Ga Eun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.25 no.2
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    • pp.23-29
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    • 2019

  • The volume of parcel delivery is steadily increasing with the rapid growth of the global online e-commerce market. However, a large amount of packaging materials used for these parcel delivery is finally causing environmental problems as waste. The rapid increase of these packaging waste has been making many countries to research ways to reduce the generation of distribution packaging waste. In this study, we have measured the empty space ratio for 131 packagings of parcel delivery purchased through the several domestic online stores in order to investigate the present situation in connection with the degree of excessive or overpack in korean parcel delivery packagings, so that 64 packagings were exceeded 50% in the empty space ratio. And we have suggested ways to reduce the generation of distribution packaging waste raised by e-commerce-based parcel delivery through analyzing the previous research and case studies ; one is to optimize and minimize the packaging design by safe transit test(field-to-lab test), another is to develop a reusable & returnable transport packaging and system applicable in the domestic supply chain, the other is to regulate directly with a policy.

  • https://doi.org/10.20909/kopast.2019.25.2.23 인용 PDF KSCI

MEMS Packaging Technology and Micro Sensors (MEMS Packaging 기술 및 마이크로센서)

  • 최상언
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.09a
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    • pp.55-85
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    • 2000

  • MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

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