• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1991-1993
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• 2002

This paper presents the PDMS surface characteristic change after the plasma process and the electroosmotic flow control technique for the two-dimensional focusing in the micro channels made of PDMS and glass. The channels are fabricated by plastic molding and micromachining technique. To observe the surface characteristic change as time elapses, we measure the contact angle of water on the surface and the velocity of the electroosmotic flow in a channel. The electric field adequate for focusing of a core flow in a confluence channel is obtained by the experiment. The computer simulation is performed to obtain the width and the depth of the core flow for several junction angles of the confluence channel.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.487-494
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• 2000

This paper describes the design, fabrication and experiments of surface-micromachined aluminum micromirror array with hidden pin-joints. Instead of the conventional elastic spring components as connection between mirror plate and supporting structure, we used pin-joint composed of pin and staples to support the mirror plate. The placement of pin-joint under the mirror plate makes large active surface area possible. These flexureless micromirrors are driven by electrostatic force. As the mirror plate has discrete deflection angles, the device can be ap;lied to adaptive optics and digitally-operating optical applications. Four-level metal structural layers and semi-cured photoresist sacrificial layers were used in the fabrication process and sacrificial layers were removed by oxygen plasma ashing. Static characteristics of fabricated samples were measured and compared with modeling results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.47-50
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• 2005

In this study, micro mirror array for small form factor optical pick-up was replicated by micro UV-molding. First, mold for micro mirror array was fabricated using micromachining. Also, to analyze the characteristics of the surface quality, flatness of replicated mirror surface were measured by white light scanning inteferometry system. The results show that the micro mirror array with a sufficient surface quality can be obtained by polymer replication process.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.57-62
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• 2003

Nano-bending method is presented to measure the Poisson's ratio of thinfilms for MEMS (Micro-Electro-Mechanical Systems) applicaiton. The douvle-ring specimen is designed and fabricated based on the surface micromachining process to facilitate the measurement of the Poisson's ratio. The Poisson's ratio can be obtained through analyzing the linear load-displacement relationship of the double ring specimen subjected to nano-indenter loading. The Present nano-bending mehod is an in-situ measurement approach due to the compatibility to the surface micromachining process. The Poisson's ratio is locally obtained at the location of the double ring specimen with micro dimension. To validate the nano-bending method, the Poisson's ratio of LPCVD (Low Pressure Chemical Vapor Deposition) poly-silicon with thickness of 2.3㎛ is investigated. Experimental results reveal that the Poisson's ratio of the poly-silicon film is 0.2569. The standard deviation of the nano-bending measurement for the stiffness of double ring specimens is 2.66%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.246-250
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• 2003

In this study, two new types of micro-grippers in which micro-fingers are actuated by piezoelectric multi-layer benders and stacks are introduced for the manipulation of micrometer-sized objects. First, we constructed a 3-chopstick-mechanism tungsten gripper, which is composed of three chopsticks: two are designed to grip micro-objects, and tile third is used to help grasp and release the objects through overcoming especially electrostatic force among some surface effects including electrostatic, van der Waals forces and surface tension. Second, a 2-chopstick-mechanism silicon micro-gripper that uses an integrated force sensor to control the gripping force was developed. The micro-gripper is composed of a piezoelectric multilayer bender for actuating the gripper fingers, silicon fingertips fabricated by use of silicon-based micromachining, and supplementary supports. The micro-gripper is referred to as a hybrid-type micro-gripper because it is composed of two main components; micro-fingertips fabricated using micromachining technology to integrate a very sensitive force sensor for measuring the gripping force, and piezoelectric gripper finger actuators that are capable of large gripping forces and moving strokes. The gripping force signal was found to have a sensitivity of 667 N/V. To the design of each of components of both of the grippers. a systematic design approach was applied, which made it possible to establish the functional requirements and design parameters of the micro-grippers. The micro-grippers were installed on a manual manipulator to assess its performance in tasks such as moving micro-objects from one position to a desired position. The experiment showed that the micro-grippers function effectively.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.1
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• pp.34-42
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• 2007

Powder blasting technique has been considered one of the most appropriate micro machining methods for hard and brittle materials, since the productivity is high and the heat layers caused by material removal are very thin. Recent development of special purposed parts, such as the parts for semiconductor processing, the parts for LCD, sensors for micro machine fabrication and so on, has been expanded. Thus, it is essential to develop powder blasting technologies for micromachining of hard and brittle materials such as glass, ceramics and so on. In this paper, the characteristics of powder blasted glass surface were tested under various blasting parameters. Finally, we proposed a predictive model for powder blasting process using the neural network and the response surface method. Detail analysis of the simulation results is carried out and the performance of two predictive models is compared.

• Journal of Electrical Engineering and Technology
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• v.3 no.2
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• pp.271-275
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• 2008

The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.7
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• pp.346-350
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• 2001

We present a surface-micromachined polysilicon capacitive accelerometer using unevenly distributed comb electrodes. The unique features of the accelerometer include a perforated proof-mass and the inner and outer comb electrodes with uneven electrode gaps. The perforated proof-mass reduces stiction between the structure and the substrate and the unevenly distributed electrodes shorten the electrode length required for a given sensitivity. The polysilicon accelerometer has been fabricated by the conventional 6-mask surface-micromachining process and showes a sensitivity of 1.03mV/g with a hybrid detection circuitry.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.8
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• pp.620-627
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• 1998

For chemical microsensors such as humidity and gas sensors, it is essential to obtain a single pore with a large inner surface and straight structure. In this paper, cylindrical macroporous silicon layers have been formed of p-silicon substrate by anodization in HF-ethanol-water solution with an applied current. The pores grew normal to the (100) surface and were uniformly distributed. The pore diameter was approximately $1.5~2{\mu}m$ with a depth of $20~30{\mu}m$ and the pores were not interconnected, which are in sharp contrast to the porous silicon reported previouly for similarly doped p-Si. Porous silicon diaphragms 18 to $200{\mu}m$ thick were formed by anistropic etching in TMAH solution and then anodization. The fabrication of macroporous silicon and free-standing diaphragms is expected to offer applications for microsensors, micromachining, and separators.