• Journal of Powder Materials
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• v.4 no.4
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• pp.268-274
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• 1997

Characteristics of plasma nitriding and nitrocarburizing for steam treated sintered steels were studied. Fe-0.8%C powder containing Ni, Cu were sintered at 112$0^{\circ}C$ and steamed at 52$0^{\circ}C$. Temperature of plasma nitriding and nitrocarburizing was varied from 50$0^{\circ}C$ to $600^{\circ}C$. Gas mixture of nitriding was set at $N_2$ : $H_2$ =80:20 (vol.%), but $CH_4gas$ was added 1~2 vol.% for nitrocarburizing. Steam treatment for sintered steels brought not only the formation of oxide layer but also decarburizing near the surface. Decrease in hardness near the surface resulted from the formation of ferrite due to decarburizing. Thus, the low hardness was recovered not with plasma nitriding but with plasma nitrocarburixing. Wear resistance properties of steamed specimens and ni-trocarburized specimens were better than those of nitrided specimens according to the pin-on-disk wear test. On the other hand, the fatigue life of steamed specimen was shorter than that of nitrocaiburized specimen.

• Progress in Superconductivity
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• v.3 no.2
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• pp.188-192
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• 2002

To introduce flux pinning center in HTS-BSCCO system, nano-size MgO particles were uniformly distributed within the Bi-2223 grain by partial hydration of MgO. The existing method MgO doped Bi-2223 used nato-size MgO powders, which resulted in agglomeration during mixing or grain growth during heat-treatment due to the high surface energy of the fine particles. By hydration of the MgO surface, the agglomeration of the MgO powders was avoided and the size of remaining MgO core was controlled by changing hydration medium and time. The thin film obtained by spin coating of (Bi_$1.8/Pb_{0.4}$)$Sr_2$$_{Ca}$$2.2/Cu_3$ $O_{y}$ nitrate solution mixed with hydrated MgO showed the even distribution of nano-size MgO particles in the Bi-2212 grains.s.s.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.1-8
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• 2003

In general, the microstructure in thin films was known to evolve in similar manner according to the energy striking the condensing film at similar homologous temperature, Th for the materials of the same crystal structure. The fundamental factors affecting particle energy are a function of processing parameters such as working pressure, bias voltage, target/sputtering gas mass ratio, cathode shape, and substrate orientation. In this study, Al, Cu, Pt films of the same crystal structure of face centered cubic (FCC) have been prepared under various processing parameters. The influence of processing variables on the microstructures and residual stress states in the films has been studied.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.43-50
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• 2014

By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.4
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• pp.298-306
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• 1994

This study was performed to investigation the effect of austempering temperature on the mecanical properties and fracture Characteristic of the ductile cast iron with contains Cu and Mo. The obtained results of this study were as follows; Microstructure of austemped ductile cast iron obtained by austempering were low bainite with some martensite at $250^{\circ}C$, mixture of low and upper bainite at $300^{\circ}C$ and upper bainite at $350^{\circ}C$. With increasing austempering temperature, yield strength, tensile strength and hardness decreased, while the elongation and impact absorption energy increased. With increasing austempering temperature, fracture toughness value increased and mainly controlled by bolume fraction of retained austenite. The volume fraction of retained austenite increased and the fracture surface obtained fibrous and dimple with increasing austempering temperature.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.429-437
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• 1994

Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Journal of the Korean Society of Clothing and Textiles
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• v.27 no.3_4
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• pp.364-372
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• 2003

In this study, the characteristics of catechol tannin and pyrogallol tannin contained in Pteridium aquilinum were analysed by It spectrum. Silk fabrics were dyed with Pteridium aquilinum extracts using various mordants, and their dyeing properties were discussed. Additionally the fastness the water digestion, perspiration liquid digestion and light irradiation were investigated. IR spectrum of catechol tannin showed bands of O-H at $3417cm^{-1}$, C-H at $2930cm^{-1}$, C=0 at $1722cm^{-1}$, C=C at $1644cm^{-1},\;CH_2\;at\;1402cm^{-1}$. And IR spectrum of pyrogallol tannin showed bands of O-H at $3409cm^{-1}$, C-H at $3003cm^{-1}\;and\;2933cm^{-11}$, C=0 at $1701cm^{-1}$, C=C at $1582cm^{-11},\;CH_2\;at\;1410cm^{-1}$, CO at carboxylic acid and carboxylic acid ester at $1287cm^{-1}\;and\;1135cm^{-1}$. The maximum absorption wavelength of the extracts appeared at 270.0nm and 311.5nm. The optimum conditions for dyeing silk fabric with Pteridium aquilinum extracts were $80^{\circ}C$, 60min. Surface color of the silk fabric dyed with Pteridium aquilinum extracts was 2.7Y Surface color of the pre-mordanted fabrics with Al, Cu and Fe were 4.3Y, 2.5Y and 4.7Y, respectively. And Surface color of the post-mordanted fabrics with Al, Cu and Fe were 3.7Y, 2.8Y and 0.2GY. The water fastness and the alkaline perspiration fastness were improved in the Al-mordanted silk fabrics. By acidic and alkaline perspiration treatment, ${\Delta}E of the unmordanted fabrics was lower than hat of pre- and post- mordanted fabrics. Also after 40hour irradiation, ${\Delta}E of the unmordanted fabrics was lower than that of pre- and post- mordanted fabrics.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.661-668
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• 2010

Cu(In,Ga)$Se_2$(CIGS) photovoltaic thin films were electrodeposited on Mo/glass substrates with an aqueous solution containing 2 mM $CuCl_2$, 8 mM $InCl_3$, 20 mM $GaCl_3$ and 8mM $H_2SeO_3$ at the electrodeposition potential of -0.6 to -1.0 V(SCE) and pH of 1.8. The best chemical composition of $Cu_{1.05}In_{0.8}Ga_{0.13}Se_2$ was found to be achieved at -0.7 V(SCE). The precursor Cu-In-Ga-Se films were annealed for crystallization to chalcopyrite structure at temperatures of 100-$500^{\circ}C$ under Ar gas atmosphere. The chemical compositions, microstructures, surface morphologies, and crystallographic structures of the annealed films were analyzed by EPMA, FE-SEM, AFM, and XRD, respectively. The precursor Cu-In-Ga-Se grains were grown sparsely on the Mo-back contact and also had very rough surfaces. However, after annealing treatment beginning at $200^{\circ}C$, the empty spaces between grains were removed and the grains showed well developed columnar shapes with smooth surfaces. The precursor Cu-In-Ga-Se films were also annealed at the temperature of $500^{\circ}C$ for 60 min under Se gas atmosphere to suppress the Se volatilization. The Se amount on the CIGS film after selenization annealing increased above the Se amount of the electrodeposited state and the $MoSe_2$ phase occurred, resulting from the diffusion of Se through the CIGS film and interaction with Mo back electrode. However, the selenization-annealed films showed higher crystallinity values than did the films annealed under Ar atmosphere with a chemical composition closer to that of the electrodeposited state.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.