• 한국건축시공학회지
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• 제12권1호
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• pp.64-72
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• 2012

Recently, prepackaged-type surface preparation materials using redispersible polymer powders are widely used for interior and exterior finishing in the construction work. The purpose of this study is to evaluate the performance and the quality of prepackaged-type surface preparation materials using a VA/E/MMA terpolymer powder. Surface preparation materials using a VA/E/MMA terpolymer powder were prepared with shrinkage reducing agent contents of 0, 4 % and cellulose fiber contents of 0, 0.5, 1.0 %, and tested for drying shrinkage, strengths, adhesion in tension, crack and impact resistance, water absorption, permeability. As a result, prepackaged-type surface preparation materials show outstanding performance depending on the shrinkage reducing agent and cellulose fiber contents.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2017년도 추계 학술논문 발표대회
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• pp.30-31
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• 2017

The objective of this study is to evaluate the performance of polymer-modified surface preparation mortars with pozzolanic materials for corrosion prevention method in deteriorated sewage treatment structures. The prepackaged-type surface preparation mortars are prepared with a polymer-binder ratio of 10%, ground granulated blast furnace slag contents of 0, 15, 30%, a fly ash content of 15%. And, the specimens are tested for workability, adhesion in tension, water absorption, crack and impact resistance. As a result, the prepackage-type surface preparation mortars for sewage treatment structure are satisfied with quality requirements by KS F 4716, Japan sewage work agency(JS) and JIS A 6916 for surface preparation mortars.

• 접착 및 계면
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• 제23권4호
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• pp.101-107
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• 2022

Adhesive joints have many advantages such as weight savings, corrosion and fatigue resistance and now developed even withstand of high impact and dynamic loads. However, an adhesion has cumbersome and complicated surface preparation processes. The surface preparation step is critical in adhesive joint manufacturing in order to obtain the prescribed strength for adhesive joints. In this study, it was attempted to simplify and reduce the number of surface preparation steps, and abrasion and rapid adhesive application (ARAA) process is developed for an alternative solution. The abrasion processes are performed only for creating surface roughness in standard procedures (SP), although the abrasion processes cause surface activation itself. The results showed that there is no need the long procedures in laboratory or chemical agents for adhesion. After the abrasion process, the attracted and highly reactive fresh surface layer obtained, and its effect on bonding success is observed and analyzed in this research, in light of the essential physic and adhesion theories. Al 6061 aluminum adherends and epoxy-based adhesives were chosen for bonding processes, which is mostly used in light vehicle parts. The adherends were cleaned, treated and activated only with abrasion, and after the adhesive application the specimens were tested under quasi-static loading. The satisfied ARAA results were compared with that of the specimens fabricated by the standard procedure (SP) of adhesion processes of high impact loads.

• 한국건축시공학회지
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• 제18권6호
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• pp.559-567
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• 2018

외단열 마감 공법에서 사용되는 바탕조정재는 화재가 발생하는 경우 얇은 마감과 폴리머의 연소로 인해 표면부가 급속하게 붕괴되어 화재에 취약한 소재이다. 본 연구에서는 열적 성능이 우수한 팽창 흑연을 사용할 경우 바탕조정재의 성능을 개선할 수 있을 것으로 기대하였다. 실험결과, 팽창흑연을 사용한 바탕조정재는 부착강도 저하 및 물흡수계수 등의 감소가 발생하는 문제점이 있으나 플라이애시와 실리카흄을 사용하여 물리적 성능이 향상되는 것으로 나타났다. 팽창흑연을 사용한 바탕조정재는 복합 단열 시험체 표면의 페놀폼은 화염에 의한 표면 뚫림이 나타나지 않아 열원의 투과를 감소시킬 수 있을 것으로 나타났다.

• 한국표면공학회지
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• 제29권6호
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• pp.709-713
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• 1996

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

• 한국표면공학회지
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• 제53권1호
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• pp.29-35
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• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• The Journal of Advanced Prosthodontics
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• 제10권4호
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• pp.286-290
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• 2018

PURPOSE. Conventional resin-bonded fixed partial dentures (RBFPDs) are usually made with a two-retainer design. Unlike conventional RBFPDs, cantilever resin-bonded fixed partial dentures (Cantilever RBFPDs) are, for their part, made with a single-retainer design. The aim of this study was to compare the effect of tooth surface preparation on the bond strength of zirconia cantilever single-retainer RBFPDs. The objective is to evaluate the shear bond strength of these single-retainer RBFPDs bonded on 3 different amount of tooth surface preparation. MATERIALS AND METHODS. Thirty extracted bovine incisors were categorized to 3 groups (n=10), with different amounts of tooth surface preparations. Teeth were restored with single-retainer RBFPDs with different retainer surfaces: large retainer of $32mm^2$; medium retainer of $22mm^2$; no retainer and only a proximal connecting box of $12mm^2$. All RBFPDs were made of zirconia and were bonded using an adhesive system without adhesive capacity. Shear forces were applied to these restorations until debonding. RESULTS. Mean shear bond strength values for the groups I, II, and II were $2.39{\pm}0.53MPa$, $3.13{\pm}0.69MPa$, and $5.40{\pm}0.96MPa$, respectively. Statistical analyses were performed using a one-way ANOVA test with Bonferroni post-hoc test, at a significance level of 0.001. Failure modes were observed and showed a 100% adhesive fracture. CONCLUSION. It can be concluded that the preparation of large tooth surface preparation might be irrelevant. For zirconia single-retainer RBFPD, only the preparation of a proximal connecting box seems to be a reliable and minimally invasive approach. The differences are statistically significant.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.86.1-86.1
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• 2015

As the feature size of Si-based semiconductor shrinks to nanometer scale, we are facing to the problems such as short channel effect and leakage current. One of the solutions to cope with those issues is to bring III-V compound semiconductors to the semiconductor structures, because III-V compound semiconductors have much higher carrier mobility than Si. However, introduction of III-V semiconductors to the current Si-based manufacturing process requires great challenge in the development of process integration, since they exhibit totally different physical and chemical properties from Si. For example, epitaxial growth, surface preparation and wet etching of III-V semiconductors have to be optimized for production. In addition, oxidation mechanisms of III-V semiconductors should be elucidated and re-growth of native oxide should be controlled. In this study, surface preparation methods of various III-V compound semiconductors such as GaAs, InAs, and GaSb are introduced in terms of i) how their surfaces are modified after different chemical treatments, ii) how they will be re-oxidized after chemical treatments, and iii) is there any effect of surface orientation on the surface preparation and re-growth of oxide. Surface termination and behaviors on those semiconductors were observed by MIR-FTIR, XPS, ellipsometer, and contact angle measurements. In addition, photoresist stripping process on III-V semiconductor is also studied, because there is a chance that a conventional photoresist stripping process can attack III-V semiconductor surfaces. Based on the Hansen theory various organic solvents such as 1-methyl-2-pyrrolydone, dimethyl sulfoxide, benzyl alcohol, and propylene carbonate, were selected to remove photoresists with and without ion implantation. Although SPM and DIO3 caused etching and/or surface roughening of III-V semiconductor surface, organic solvents could remove I-line photoresist without attack of III-V semiconductor surface. The behavior of photoresist removal depends on the solvent temperature and ion implantation dose.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2005년도 생물공학의 동향(XVI)
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• pp.47-47
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• 2005

There are many different surface technologies currently applied for preparation of protein chips. However, it requires innovative surface chemistry for capture proteins to be immobilized on chip surface keeping their conformation and activity intact and their orientation right, while they bind tightly and densely in a given array spot. Proteogen has developed 'ProteoChip BP' coated with novel proprietary linker molecules $(ProLinker^{TM})$ for efficient and robust immobilizations of capture proteins by improving surface properties of molecular captures. It was demonstrated that $ProLinker^{TM}$ gave the best surface performance in preparation of protein microarray chip base plates among others currently available on the market. In particular, the $ProLinker^{TM}-based$ surface chemistry has demonstrated to provide excellent performance in preparation of 'Antibody Chip' for analysis of biomarkers as well as proteome expression profiles. The linker molecule has also shown to be well applicable for development of biosensors and micro-beads as well as protein microarray and nano-array. ProteoChip BP can be used either for preparation of high-density array by using a microarrayer or for preparation of 'Well-on-a-Chip' with low density array, which is better applicable for quantitative analysis of biomarkers or protein-protein interactions. The biomarker assay can be performed either by direct or sandwich methods of fluorescence immunoassay. Application of ProteoChip BP has been well demonstrated by the extensive studies of 1) tumor-marker assays, 2) new drug screening by using 'Integrin Chip' and 3) protein expression profile analysis. Some of experimental results will be presented.

• Macromolecular Research
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• 제10권5호
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• pp.291-295
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• 2002

Atomic force microscopy(AFM) was used to study the polyethylene(PE) surfaces grafted and immobilized with acrylic acid by Ar plasma treatment. The topographical images and parameters including RMS roughness and Rp-v value provided an appropriate means to characterize the surfaces. The plasma grafting and immobilization method were a useful tool for the preparation of surfaces with carboxyl group. However, the plasma immobilization method turned out to have a limitation to use as a means of preparation of PE surface with specific functionalities, due to ablation effect during the Ar plasma treatment process.