• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.538-541
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• 2003

Ultra-precision machining was carried out on a electroless nickel materials using single crystal diamond tools. The effects of the cutting velocity, the tool length, the tool nose radius, the feed rate and depth of cut on the surface roughness were studied. In this paper, the cutting condition for getting nano order smooth surface of electroless nickel have been examined experimentally by the ultra-precision machine and single crystal diamond tools. And also. the surface roughness was measured by the three dimension

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.

• Design & Manufacturing
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• v.2 no.1
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• pp.33-38
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• 2008

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. Precision turning with single-diamond tools has a long history of development for fabrication of optical quality surfaces since the advent of aerostatic rotary spindles and precise linear motion guide ways. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $0.6{\mu}m$ P-V and a surface roughness of $0.006{\mu}m$ Rmax.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.22-27
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• 2010

The usage of ultra-precision machining is increasing by the manufacturing of precision optical elements such as camera lens, laser printer, CD player, DVD and microscope parts etc.. The WC alloy material is in wide use by mold core to improve the productivity and accuracy in manufacturing those precision parts. The WC alloy mould core can be machined effectively by the parallel grinding process which is an excellent technique for manufacturing of surface profile hard to machining materials such as the hardened metal alloy, Ceramics, Glass and so on. Magnetic assisted polishing as a final polishing process has also been utilized to obtain ultra-precision mirror surface with the elimination of traces presented on ground surface. It is able to deduce the optimal ultra-precision machining conditions of the WC alloy material from the experiment and analyses results.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.1
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• pp.57-62
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• 2009

Recently, with the increasing lightness and miniaturization of high resolution camera phones, the demand for aspheric glass lens has increased because plastic and spherical lens are unable to satisfy the required performance. An aspheric glass lens is fabricated by the high temperature and pressure molding using a tungsten carbide molding core, so precision grinding technology for the molding core surface are required. This paper reports a development of feedrate control grinding method for aspherical molding core using parallel grinding method. A plane molding core was ground using conventional and feedrate control grinding method. The performance of the feedrate control method was evaluated by measurement of surface roughness. The result indicated that the average surface roughness was reduced to 1.5 nm, which is more efficient than the conventional grinding method.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.69-74
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• 2020

In this study, we proposed a method for surface profiling aspheric lens molds using a precision displacement sensor with a spatial scanning mechanism. The precision displacement sensor is based on the confocal principle using a broadband light source, providing a 10 nm resolution over a 0.3 mm measurable range. The precision of the sensor, depending on surface slope, was evaluated via Allan deviation analysis. We then developed an automatic surface profiling system by measuring the cross-sectional profile of a lens mold. The precision of the sensor at the flat surface was 10 nm at 10 ms averaging time, while 200 ms averaging time was needed for identical precision at the steepest slope at 25 deg. When we compared the measurement result of the lens mold to a commercial surface profiler, we found that the accuracy of the developed system was less than 90 nm (in terms of 3 sigmas of error) between the two results.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.1
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.53-60
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• 1998

In this study, it is experimented to find factors effecting surface roughness using the system of experiments. in the mirror surface finishing system. (1) The film feed and oscillation frequency in $40{\mu}m$ abrasive film, grinding speed in $30{\mu}m$, and machining time in $15{\mu}m$15 are the main factors effecting the surface roughness. (2) Applying the optimal finishing condition to $40{\mu}m$, $30{\mu}m$, $15{\mu}m$ abrasive finishing film in sequence, it is possible to obtian about Ra 10 nm surface roughness on SM45C workpiece. (3) Application of the system of experments to the micro abrasive grain film finishing was very effective method in the extraction of main factor and optimal condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.1049-1052
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• 1997

The pupose of this study on the surface finishing is to examine the performance of brushing as a means of reducing the surface roughness of the precision theaded shafts in ball screw assemblies. Ball screws provide superior performance compared to other types of screw feeds in terms of static and dynamic rolling resistance,backlash,and wear characteristics. The Reduction of the surface roughness of the lead shaft in ball screw assembiles is essential for precision movement,high speed/low noise tracel, and for low wear/long life. To reduce machine dependent errors that would influence the surface roughness compared with other lapping or polishing techniques,experiments will be performed using special wire brushes to polish precision ground shafts. The best results were obtained using the Al /sab 2/O /sab3/ brushes, with the Al /sab 2/O /sab3/ #500 grit brush producing a surface finish of approximately 0.7 .mu.m, and the Al /sab 2/O /sab3/ #600 grit producing a surface finish of approximately 0.8 .mu.m. Both of these results were produced at the highest wheel polishing speed of 3520 rpm. The SiC #500 brush produced a surface roughness of approximately 1 .mu.m at 3520 rpm.