• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.714-719
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• 2012

In this paper, the polishing force monitoring and the control method were implemented for the polishing machine with the airbag tool. Airbag tool has been known to be adaptable to the curvature variation such as the aspherical and the free-form surface. However, it was necessary to control the tool movement of vertical axis also because of the table rotational wobble and vibration. To solve it by the polishing force control, we installed another stepping motor to the z-axis. And the polishing force was measured with the load cell and controlled by the PID Labview controller. A few hundreds gram of the polishing force were well controlled under 0.8 second of the response time and 5% variation. An experiment was done to clean the edge burrs of the micro channel structure of width $87{\mu}m$ using the polishing force control.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.38-42
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• 2008

316L stainless steel welding tube was electrolytically polished and the inner surface characteristics of the tube were tested. Electro-polishing variables such as current, voltage, concentration of electrolyte and electropolishing time were changed to seek for optimum condition. These makes a optimum conditions for the electro-polishing as 4000 A, 9 V, 1.7 specific gravity of electrolyte, and 30 minute of electro-polishing time. It makes the surface roughness as Ra < $0.25{\mu}m$. XPS test resulted as the ratio of CrO/FeO equals or more to 3/1. AES test resulted as the thickness of CrO film of $38{\AA}$. DTA test resulted as the tube did not react with $N_2,\;H_2\;and\;O_2$ gas below 1073K. As summarize above results, the electro- polished 316L stainless steel welding tube satisfied the conditions to apply as a pipeline for semi- conductor production facility and clean room.

• Journal of the Korean institute of surface engineering
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• v.57 no.3
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• pp.140-154
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• 2024

As the trend towards miniaturization in semiconductor integration process, the limitations of interconnection metals such as copper, tungsten have become apparent, prompting research into the emergence of new materials like cobalt and emphasizing the importance of studying the corresponding process conditions. During the chemical mechanical polishing (CMP) process, corrosion inhibitors are added to the slurry, forming passivation layers on the cobalt surface, thereby playing a crucial role in controlling the dissolution rate of the metal surface, enhancing both removal rate and selectivity. This review investigates the understanding of the cobalt polishing process and examines the characteristics and behavior of corrosion inhibitors, a type of slurry additive, on the cobalt surface. Among the corrosion inhibitors examined, benzotriazole (BTA), 1,2,4-triazole (TAZ), and potassium oleate (PO) all improved surface characteristics through their interaction with cobalt. These findings provide important guidelines for selecting corrosion inhibitors to optimize CMP processes for cobalt-based semiconductor materials. Future research should explore combinations of various corrosion inhibitors and the development of new compounds to further enhance the efficiency of semiconductor processes.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.5
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• pp.76-81
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• 2014

The Engineering ceramics have some excellent properties as materials for modern mechanical and electrical components. It is, however, not easy to polish them efficiently because they are strong and hard. This study is carried out to obtain a mirror surface on engineering ceramics by surperfinishing with high efficiency. To achieve this, we conducted a series of polishing experiments using representative engineering ceramics, such as $Al_2O_3$, SiC, $Si_3N_4$ and $ZrO_2$, using diamond abrasive film from the perspective of oscillations peed, the rotational speed of the workpiece, contact roller hardness, contact pressure and feed rate. Furthermore, the polishing efficiency and characteristics for engineering ceramics are discussed on the basis of optimal polishing time and surface roughness. Our results confirmed that efficient superfinishing conditions and polishing characteristics of engineering ceramics can be determined.

• Restorative Dentistry and Endodontics
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• v.15 no.1
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• pp.67-80
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• 1990

This study was performed for elucidating the effects on surface polishing of composite resins. In this study, Silux(microfilled), Graft(hybrid), Bisfil- I (hybrid posterior) and Hi-pol(conventional) were used. Sixty specimens were made with 4 brands of composite resins and Optilux system in $2.0{\times}1.3{\times}1.0cm$ resin block which has a cavity with 0.5cm diameter and 0.5cm depth. Polishing was done with #600 sand paper and Soflex, Super-snap, Micron finishing system, or Composite polishing kit. Final polished surfaces were measured by roughness tester(Kasaka Lab. Ltd., Japan) and image analyser(Omnimet Image Analyser, Buehler, USA). The results were as follows, 1. The celluloid strip produced the smoothest surfaces. 2. Light curing microfilled composite resin, Silux, had smoother surface than any others. 3. The surfaces polished by Soflex were smoothest. 4. Aluminum oxide disk, Soflex and Super-Snap, made smoother surface than diamond bur, M.F.S., or silicon point, Composite polishing kit. 5. The roughness values of surface polished by M.F.S. composed of diamond burs, were less than those of Composite polishing kit made from silicone points.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.767-768
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.245-246
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• 2010

• Tribology and Lubricants
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• v.35 no.6
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.97-101
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• 1995

This paper describes a new surface finishing process which uses magnetic abrasive polishing. This is applied to automatic finishing of die & mold surface. Nowadays, most of die & mold meanufaturing procedures have been automated by the introduction of NC machine tool and CAD/CAM system. But the surface finishing of die & mold must be done by hand work of well-skilled workers. Though many attempts were tried in the past 15 years to eliminate this hand work, the automatic finishing of die & mold surface with 3D curvature has not been achieved yet. New magnetic abrasive finishing process is thought as one of the possible methods for the automation of 3D surface finishing. In order to improve the grindability of the method, ultra-high speed and 5-axis machining was introduce. The magnetic abrasive polishing which has adopted these methods was confirmend to improve the efficiencyof die & mold surface finishing.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.4
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• pp.719-741
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• 1997

This study was undertaken to compare by Atomic Force Microscope the effects of various finishing and polishing instruments on surface roughness of filling and veneering composite resins. Seven composite resins were studied : Silux Plus (3M Dental Products, U.S.A.), Charisma (Heraeus Kulzer, Germany), Prisma THP (L.D.Caulk, Dentsply, U.S.A.), Photoclearfil (Kuraray, Japan), Cesead (Kuraray, Japan), Thermoresin LC (GC, Japan), Artglass (Heraeus Kulzer, Germany). Samples were placed and polymerized in holes (2mm thick and 8.5mm in diameter) machined in Teflon mold under glass plate, ensuring excess of material and moulded to shape with polyester matrix strip. Except control group (Polyester matrix strip), all experimental groups were finished and polishied under manufacturer's instructions. The finishing and polishing procedure were : carbide bur (E.T carbide set 4159, Komet, Germany), diamond bur (composite resin polishing bur set, GC, Japan), aluminum-oxide disc (Sof-Lex Pop-On, 3M Dental Products, U.S.A.), diamond-particle disc (Dia-Finish, Renfert Germany), white stone bur & rubber point( composite finishing kit, EDENTA, Swiss), respectively. Each specimens were evaluated for the surface roughness with Atomic Force Microscope (AutoProbe CP, Park Scientific Instruments, U.S.A.) under contact mode and constant height mode. The results as follows : 1. Except Thermoresin LC, all experimental composite resin groups showed more rougher than control group after finishing and polishing(p<0.1). 2. A surface as smooth as control group was obtained by $Al_{2}O_{3}$ disc all filling composite resin groups except Charisma and all veneering composite resin groups except Thermoresin LC(p<0.05). 3. In case of Thermoresin LC, there were no statistically significant differences before and after finishing and polishing(p>0.1). 4. Carbide bur, diamond bur showed rough surfaces in all composite resin groups, so these were inappropriate for the final polishing instruments.