• Title/Summary/Keyword: Surface etching effect

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Effect of the Surface Roughness of ITO Thin Films on the Characteristics of OLED Device (ITO 박막의 표면 거칠기에 따른 OLED 소자의 특성)

  • Lee, Bong-Kun;Lee, Kyu-Mann
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.4
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    • pp.49-52
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    • 2009
  • We have investigated the effect of the surface roughness of TCO substrate on the characteristics of OLED (organic light emitting diodes) devices. In order to control the surface roughness of ITO thin films, we have processed photolithography and reactive ion etching. The micro-size patterned mask was used, and the etching depth was controlled by changing etching time. The surface morphology of the ITO thin film was observed by FESEM and atomic force microscopy (AFM). And then, organic materials and cathode electrode were sequentially deposited on the ITO thin films. Device structure was ITO/$\alpha$-NPD/DPVB/Alq3/LiF/Al. The DPVB was used as a blue emitting material. The electrical characteristics such as current density vs. voltage and luminescence vs. voltage of OLED devices were measured by using spectrometer (minolta CS-1000A). The current vs. voltage and luminance vs. voltage characteristics were systematically degraded with increasing surface roughness. Furthermore, the retention test clearly presented that the reliability of OLED devices was directly influenced with the surface roughness, which could be interpreted in terms of the concentration of the electric field on the weak and thin organic layers caused by the poor step coverage.

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Effect of surface roughness of AZO thin films on the characteristics of OLED device (AZO 박막의 표면 거칠기에 따른 OLED 소자의 특성)

  • Lee, B.K.;Lee, K.M.
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.4
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    • pp.25-29
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    • 2010
  • We have investigated the effect of surface roughness of TCO substrate on the characteristics of OLED (organic light emitting diodes) devices. In order to control the surface roughness of AZO thin films, we have processed photo-lithography and reactive ion etching. The micro-size patterned mask was used, and the etching depth was controlled by changing etching time. The surface morphology of the AZO thin film was observed by FESEM and atomic force microscopy (AFM). And then, organic materials and cathode electrode were sequentially deposited on the AZO thin films. Device structure was AZO/${\alpha}$-NPD/DPVB/$Alq_3$/LiF/Al. The DPVB was used as a blue emitting material. The electrical characteristics such as current density vs. voltage and luminescence vs. voltage of OLED devices were measured by using spectrometer. The current vs. voltage and luminance vs. voltage characteristics were systematically degraded with increasing surface roughness. Furthermore, the retention test clearly presented that the reliability of OLED devices was directly influenced with the surface roughness, which could be interpreted in terms of the concentration of the electric field on the weak and thin organic layers caused by the poor step coverage.

Effect of Ultrasound During Pretreatment on the Electrochemical Etching of Aluminum and Its Capacitance (초음파를 이용한 전처리가 알루미늄의 전기화학적 에칭 및 정전용량에 미치는 효과)

  • Jung, Insoo;Tak, Yongsug;Park, Kangyong;Kim, Hyungi;Kim, Sungsoo
    • Corrosion Science and Technology
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    • v.10 no.1
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    • pp.37-42
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    • 2011
  • Aluminum was electrochemically etched in acid solution and the surface area was magnified by the formation of etch pits. Etched aluminum was covered with a compact and dense dielectric oxide film by anodization and applied to the aluminum electrolytic capacitor electrode. Capacitance of aluminum electrolytic capacitor is closely related with surface area, which depends on size and number of etch pits. Size of etch pits need to be controlled because inside of the pits can be buried by the formation of dielectric oxide film. In this work, the effect of ultrasound pretreatment on the aluminum etch pit formation and capacitance were investigated. Additionally, the relationship between the second etching effect on pit size and capacitance was studied.

Effect of Deformation Energy on the Indentation Induced Etch Hillock (변형 에너지가 나노압입 유기 Hillock 현상에 미치는 영향)

  • Kim H. I.;Youn S. W.;Kang C. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.225-228
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    • 2005
  • The purpose of this study is to investigate effects of the plastic/elastic deformation energy on wet etching characterization on the surface of material by using the nanoindentation and HF wet etching technique. Indents were made on the surface of Pyrex 7740 glass by the hyperfine indentation process with a Berkovich diamond indenter, and they were etched in $50\;wt\%$ HF solution. After etching process, convex structure was obtained due to the deformation-induced hillock phenomena. In this study, effects of indentation process parameters (normal load, loading rate) on the morphologies of the indented surfaces after isotopic etching were investigated from an angle of deformation energies.

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The study of Ag etching effect by adding compound on the lead frame process (Lead frame 공정 중 화합물에 따른 Ag 에칭효과)

  • 이경수;박수길
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.859-862
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    • 2001
  • This study describes a selective Ag etching solution for use with pattern on the surface of copper. This etching solution uses potassium iodide and potassium sulfate as the ligand that coordinates to the metal ions and ferricyanide as the oxidant. The etching rate was depended on the concentration of co-ligands and time. But the etching rate wasn't depended on the pH(2∼6), and oxidant(K$_3$Fe(CN)$\_$6/). Complete etching of silver can be achieved rapidly within 90sec for 4.46${\mu}$m thick metal films when aqueous solutions containing K$_3$Fe(CN)$\_$6/, K$_2$S$_2$O$\_$8/ and KI was used. This etching solution was characteristic of anisotropic etching.

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Effect of the Thermal Etching Temperature and SiO2/Al2O3 Ratio of Flexible Zeolite Fibers on the Adsorption/desorption Characteristics of Toluene

  • Ji, Sang Hyun;Yun, Ji Sun
    • Korean Journal of Materials Research
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    • v.29 no.3
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    • pp.143-149
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    • 2019
  • To develop flexible adsorbents for compact volatile organic compound (VOC) air purifiers, flexible as-spun zeolite fibers are prepared by an electrospinning method, and then zeolite particles are exposed as active sites for VOC (toluene) adsorption on the surface of the fibers by a thermal surface partial etching process. The breakthrough curves for the adsorption and temperature programmed desorption (TPD) curves of toluene over the flexible zeolite fibers is investigated as a function of the thermal etching temperature by gas chromatography (GC), and the adsorption/desorption characteristics improves with an increase in the thermal surface etching temperature. The effect of acidity on the flexible zeolite fibers for the removal of toluene is investigated as a function of the $SiO_2/Al_2O_3$ ratios of zeolites. The acidity of the flexible zeolite fibers with different $SiO_2/Al_2O_3$ ratios is measured by ammonia-temperature-programmed desorption ($NH_3-TPD$), and the adsorption/desorption characteristics are investigated by GC. The results of the toluene adsorption/desorption experiments confirm that a higher $SiO_2/Al_2O_3$ ratio of the flexible zeolite fibers creates a better toluene adsorption/desorption performance.

Effect of Surface Roughness on Nitriding of Aluminum by Electron Cyclotron Resonance Plasma (ECR 플라즈마에 의한 알루미늄 질화처리시 표면조도의 영향)

  • 김진수;안재현;고경현;오수기
    • Journal of the Korean institute of surface engineering
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    • v.24 no.4
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    • pp.215-221
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    • 1991
  • Microstructure evolution during low temperature vapor deposition exhibits wel-developed columnar structure mainly owing to geometrical shadowing effect of surface roughness. It is concluded that this structure is concided with many theoretical models suggested so far. In case of aluminum nitride film deposition consisted of etching and nitriding step employing ECR plasma, the rougher the surface before etching, the finer and more cone-and-whisker structure can be developed. In turn, this fine structure affects the formation and growth of columnar as well as offers many sites available for mechanical lock-up. Conclusively, the formation of well-defined columnar structures depends on the initial surface roughness.

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Investigation of Improving Texturing Effect by Surface Saw Damage Etching Using Acidic Etchant for Silicon Solar Cells (산성 표면절삭결함 제거 공정에 의한 실리콘 태양전지의 텍스쳐링 효과 개선)

  • Park, Hayoung;Lee, Joon Sung;Kwon, Soonwoo;Yoon, Sewang;Lim, Heejin;Kim, Donghwan
    • Korean Journal of Metals and Materials
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    • v.46 no.12
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    • pp.835-840
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    • 2008
  • Texturing for crystalline silicon solar cells is one of the important techniques to increase conversion efficiency by effective photon trapping. Generally, incoming wafers or alkali etched wafers are used for texturing. From this conventional etching process, $7{\sim}10{\mu}m$-sized random pyramids are formed. In this study, acid etching for removal of saw damages was practiced before texturing. This improved the resulting surface morphology, which consisted of $2{\sim}4{\mu}m$-sized pyramids. Because these pyramids covered the surface much more extensively, we obtained reduction of optical losses on the surface. In order to compare with conventional texturing, FE-SEM is used for observing surface morphology and reflectance data is analyzed by UV-VIS spectrophotometer.

Effect of moisture and drying time on the bond strength of the one-step self-etching adhesive system

  • Lee, Yoon;Park, Jeong-Won
    • Restorative Dentistry and Endodontics
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    • v.37 no.3
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    • pp.155-159
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    • 2012
  • Objectives: To investigate the effect of dentin moisture degree and air-drying time on dentin-bond strength of two different one-step self-etching adhesive systems. Materials and Methods: Twenty-four human third molars were used for microtensile bond strength testing of G-Bond and Clearfil $S^3$ Bond. The dentin surface was either blot-dried or air-dried before applying these adhesive agents. After application of the adhesive agent, three different air drying times were evaluated: 1, 5, and 10 sec. Composite resin was build up to 4 mm thickness and light cured for 40 sec with 2 separate layers. Then the tooth was sectioned and trimmed to measure the microtensile bond strength using a universal testing machine. The measured bond strengths were analyzed with three-way ANOVA and regression analysis was done (p = 0.05). Results: All three factors, materials, dentin wetness and air drying time, showed significant effect on the microtensile bond strength. Clearfil $S^3$ Bond, dry dentin surface and 10 sec air drying time showed higher bond strength. Conclusions: Within the limitation of this experiment, air drying time after the application of the one-step self-etching adhesive agent was the most significant factor affecting the bond strength, followed by the material difference and dentin moisture before applying the adhesive agent.

THE ETCHING EFFECTS AND MICROTENSILE BOND STRENGTH OF TOTAL ETCHING AND SELF-ETCHING ADHESIVE SYSTEM ON UNGROUND ENAMEL (법랑질에 대한 total etching과 self-etching 접착제의 산부식 효과와 미세인장결합강도)

  • Oh, Sun-Kyong;Hur, Bock;Kim, Hyeon-Cheol
    • Restorative Dentistry and Endodontics
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    • v.29 no.3
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    • pp.273-280
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    • 2004
  • The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM). Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth. and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy. after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test. resin-bonded teeth were sectioned to give a bonded surface area of $1\textrm{mm}^2$. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM: 26.55 MPa, SE: 18.15 MPa, LP: 15.57 MPa. SM had significantly higher microtensile bond strength than 8E and PL (p < 0.05). but there was no significant differance between SE and PL.