• Title/Summary/Keyword: Surface Mount

Search Result 199, Processing Time 0.022 seconds

Corrosion Behavior of Ti-6Al-4V Alloy after Plasma Electrolytic Oxidation in Solutions Containing Ca, P and Zn

  • Hwang, In-Jo;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2016.11a
    • /
    • pp.120-120
    • /
    • 2016
  • Ti-6Al-4V alloy have been used for dental implant because of its excellent biocompatibility, corrosion resistance, and mechanical properties. However, the integration of such implant in bone was not in good condition to achieve improved osseointergraiton. For solving this problem, calcium phosphate (CaP) has been applied as coating materials on Ti alloy implants for hard tissue applications because its chemical similarity to the inorganic component of human bone, capability of conducting bone formation and strong affinity to the surrounding bone tissue. Various metallic elements, such as strontium (Sr), magnesium (Mg), zinc (Zn), sodium (Na), silicon (Si), silver (Ag), and yttrium (Y) are known to play an important role in the bone formation and also affect bone mineral characteristics, such as crystallinity, degradation behavior, and mechanical properties. Especially, Zn is essential for the growth of the human and Zn coating has a major impact on the improvement of corrosion resistance. Plasma electrolytic oxidation (PEO) is a promising technology to produce porous and firmly adherent inorganic Zn containing $TiO_2(Zn-TiO_2)$coatings on Ti surface, and the a mount of Zn introduced in to the coatings can be optimized by altering the electrolyte composition. In this study, corrosion behavior of Ti-6Al-4V alloy after plasma electrolytic oxidation in solutions containing Ca, P and Zn were studied by scanning electron microscopy (SEM), AC impedance, and potentiodynamic polarization test. A series of $Zn-TiO_2$ coatings are produced on Ti dental implant using PEO, with the substitution degree, respectively, at 0, 5, 10 and 20%. The potentiodynamic polarization and AC impedance tests for corrosion behaviors were carried out in 0.9% NaCl solution at similar body temperature using a potentiostat with a scan rate of 1.67mV/s and potential range from -1500mV to +2000mV. Also, AC impedance was performed at frequencies ranging from 10MHz to 100kHz for corrosion resistance.

  • PDF

Path Tracking System for Small Ships based on IMU Sensor and GPS (소형선박을 위한 IMU 센서와 GPS 기반의 경로 추적 시스템)

  • Jo, Yeonsu;Lee, Sukhoon;Jeong, Dongwon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2021.10a
    • /
    • pp.18-20
    • /
    • 2021
  • In order to prevent collision accidents of ships, which has been increasing recently, research on artificial intelligence-based autonomously operated ships (Maritime Autonomous Surface Ship, MASS) is underway. However, most of the studies related to autonomous ships mainly target medium-to-large ships due to the size and cost of the autonomous navigation system, and the sensors used here have a problem in that it is difficult to mount them on small ships. Therefore, this paper provides a path tracking system equipped with GPS and IMU sensors for autonomous operation of small ships. GPS and IMU sensors are utilized to determine the exact position of the vessel, which allows the proposed system to manually control the small vessel model to create a path and then when the small vessel travels the same path. Use the Pure Pursuit algorithm to follow the path. As a result, In this research, it is expected that a lightweight and low-cost sensor can be used to develop an autonomous operation system for small ships at low cost.

  • PDF

Daesoon Jinrihoe's Geumgangsan Toseong Training Temple Complex as Appraised through the Hyeonggi Theory in Fengshui (풍수 형기론(形氣論)으로 본 대순진리회 금강산토성수련도장)

  • Shin, Young-dae
    • Journal of the Daesoon Academy of Sciences
    • /
    • v.36
    • /
    • pp.35-78
    • /
    • 2020
  • This study aims to reveal the overall Fengshui figuration and geomantic features of Daesoon Jinrihoe's Geumgangsan (Mt. Geumgang) Toseong Training Temple Complex from the Hyeonggi (Energy of Form) Theory in Fengshui. This study first looked at the mountain landscape viewable from the surface, examined the influence of Qi (Energy) flowing inside it, comprehended the flow of its vitality in terms of its strengths and weaknesses, and gauged the depth of the energy produced from mountain streams to determine fortune and misfortune. There is a special significance to this site due to Sangje's teaching that "⋯ it will be prosperous with 12,000 Dotonggunja (Dao-empowered Sages)," and it is also known as a efficacious grounds for cultivation among ascetics due to it housing the royal mausoleum of Dojeon (interpreted by some as Maitreya). Concerning this, this study explores the geomantic symbolism and growth-supporting land of Geumgangsan Toseong Training Temple Complex as it corresponds to Fengshui theory, and in keeping with this, the topography and conditions are likewise examined. The mountain range and its energy pathways (veins) harmonize with the pure water energy coming from the East Sea. The mountain terrain of Mount Geumgang, and the geomantic location, topography, and energy pathways that influence Daesoon Jinrihoe Geumgangsan Toseong Training Temple Complex are all explored. The Baekdudaegan Mountain Range extends through Mount Geumgang to Sinseonbong Peak, and one range extends to Geumgangsan Toseong Training Temple Complex whereas the other range extends through Sangbong Peak down to Misiryeong Valley and Mount Seorak. Thus, this study demonstrates that Daesoon Jinrihoe has always strongly considered the relationship between its temple complexes and their surrounding environment. The order has always selected locations that exhibit optimal conditions which suit the construction of sacred spaces. The determinations in this paper were made through an academic approach that drew upon various theories of Fengshui while examining Daesoon Jinrihoe's Geumgangsan Toseong Training Temple Complex. The in-depth analysis was specifically based on Hyeonggi Fengshui. At the same time, this study also looked into the surroundings of Geumgangsan Toseong Training Temple Complex. In particular, the mountains and flow of nearby bodies of water were comprehensively examined to show how the surrounding topography corresponds to the principles of Fengshui. An integral approach combining all major theories of Fengshui revealed that Geumgangsan Toseong Training Temple Complex starts from Sinseonbong Peak, and its energy flows through the main mountain range, going through numerous geographical changes of yin and yang. When the range flows down, the water flows accordingly, and where the water whirls, the mountains are shaped accordingly. Eventually, this energy reaches Geumgangsan Toseong Training Temple Complex. From the organic relationship between mountains and bodies of water, which can be said to be the essence of the order of nature, it can be judged that the most prominent geomantic feature of Geumgangsan Toseong Training Temple Complex corresponds to traditional theories of Fengshui in that it forms a configuration wherein optimal water energy supports the Virtuous Concordance of Yin Yang and harmonizes the Blue Dragon with the White Tiger.

Conservation of the Old Hat

  • Im Sung-Kyung;Han Myung-Sook
    • The International Journal of Costume Culture
    • /
    • v.7 no.2
    • /
    • pp.151-157
    • /
    • 2004
  • This research is to conservate the old hat and restore its shape and place it on a supportive form in a stable protective container. The hat is a homemade construction, utilizing three different machine made laces, and two cotton net fabrics. The exterior, particularly the top crown piece, as well as the lace along the brim's edge has been generally soiled and discolored. Inside the crown, the cotton net has broken threads, and thread loss in several areas. The paper covering the two wires is very weak, and has discolored the lace in the areas of contact. The plastic buckles of the velvet ribbon have also discolored the areas where there is contact. The wash/bleach bath procedure was very effective. Virtually all of the light brown surface discoloration stains were removed. The darker brown spots, particularly concentrated around the two paper covered wires and assumed to be rust, were $90\%$ removed by the treatment. The brown spots apparently were due to the degradation of the paper covering, and not caused by the wire itself. The buckram foundation lost about $50\%$ of its stiffness, but this was not a major concern due to the fact that this hat should remain it its mount, which has been designed to serve for both storage and exhibition purposes.

  • PDF

Pattern recognition of SMD IC using wavelet transform and neural network (웨이브렛 변환과 신경회로망을 이용한 SMD IC 패턴인식)

  • 이명길;이준신
    • Journal of the Korean Institute of Telematics and Electronics S
    • /
    • v.34S no.7
    • /
    • pp.102-111
    • /
    • 1997
  • In this paper, a patern recognition method of surface mount device(SMD) IC using wavelet transform and neural network is proposed. We chose the feature parameter according to the characteristics of coefficient matrix which is obtained from four level discrete wavelet transform (DWT). These feature parameters are normalized and then used for the input vector of neural network which is capable of adapting the surroundings such as variation of illumination, arrangement of objects and translation. Experimental results show that when the same form of feature pattern, as is used for learning, is put into neural network and gained 100% rate ofrecognition irrespective of SMD IC kinds, location and variation of illumination. In the case of unused feature pattern for learning, the recognition rate is 85.9% under the similar surroundings, where as an average recognition rate is 96.87% for the case of reregulated value of illumination. Proosed method is relatively simple compared with the traditional space domain method in extracting the feature parameter and is also well suited for recognizing the pattern's class, position and existence. It can also shorten the processing tiem better than method extracting feature parameter with the use of discrete cosine transform(DCT) and adapt the surroundings such as variation of illumination, the arrangement and the translation of SMD IC.

  • PDF

Development of Surface-mount-type Crown-shaped Lens for Reducing Glare Effect of Light-emitting Diode Light Source (LED 광원의 눈부심 현상을 감소시키기 위한 표면 실장형 CR 렌즈 개발)

  • Park, Yong Min;Bang, Hyun Chul;Seo, Young Ho;Kim, Byeong Hee
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.23 no.1
    • /
    • pp.64-68
    • /
    • 2014
  • This paper introduces the use of a crown-shaped (CR) lens to effectively diffuse the light from a light-emitting diode (LED) without any loss in the light intensity, in contrast to polymer-bulb-type diffusers. The diffusion lens was designed based on the Snell's law, which describes the physical path of a ray passing through the boundary between different media. CR lenses were fabricated by polydimethylsiloxane (PDMS) casting and UV-embossing processes, which used a pre-designed metal mold and UV-curable resin, respectively. Through experiments and optical evaluations, it was verified that the newly proposed CR lens not only decreased the vertical light strength and glare effect from an LED light source but also improved the diffusion characteristics while maintaining the quality of the LED's light intensity.

BGA to CSP to Flip Chip-Manufacturing Issues

  • Caswell, Greg;Partridge, Julian
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.8 no.2
    • /
    • pp.37-42
    • /
    • 2001
  • The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

  • PDF

The New Thick-Film Hybrid Converters For Halogen and Fluorescent Lamps

  • Gondek, J.;Dzialek, K.;Kocol, J.;Kawa, B.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.8 no.2
    • /
    • pp.43-48
    • /
    • 2001
  • Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.

  • PDF

A Study on the Rx/Tx Switch Module with integrated Low Pass Filter (LPF가 집적화된 Rx/Tx 스위치 모듈에 관한 연구)

  • Song Jae-Sung;Min Bok-Ki;Jeong Soon-Jong;Kim In-Sung
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.54 no.5
    • /
    • pp.185-189
    • /
    • 2005
  • This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages

  • Kim, Keun-Soo;Kim, Tae-Seong;Min Yoo;Yoo, Hee-Yeoul
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.11 no.1
    • /
    • pp.43-47
    • /
    • 2004
  • We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas & moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

  • PDF