• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.10 no.5
• /
• pp.25-30
• /
• 2001

The purpose of this investigation is experimentally to clarify the machinability and optimum tool geometry on milling of hardened STD11 steel. In the finish process office milling of high hardened STD11 steel by CBN tool, the optimum tool shape is suggested, which can minimize the tool fracture and chipping by impact. It is measured that cutting farce, tool wear and surface roughness generated during single-insert face milling using various geometric CBN tools. It has been found that the optimal chamfer angle of CBN tool is about -$25^{\circ}C$ and the suitable chandler width is 0.2mm. The nose radius of tool is the most excellent at 1.2mm in the viewpoint of tool wear and surface roughness.

• Proceedings of KOSOMES biannual meeting
• /
• 2018.06a
• /
• pp.169-169
• /
• 2018

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.63-69
• /
• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.9 no.5
• /
• pp.157-164
• /
• 2000

A machine tool generally has some serious stability problems in the form of tool chatter during the cutting process. Chatter vibration deteriorates the surface finish, reduce tool and machine life, accelerates machine tool system component wear, and may lead to an unacceptable noise sound in the working environment. In this study, the behavior of spectral density of AE signal and principal cutting force signal in order to monitor the chatter vibration in the cutting process has been investigated. From the results, the reliability of proposed monitoring method has been confirmed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1998.06b
• /
• pp.60-66
• /
• 1998

The horizontal cold chamber pressure die casting produces a variety of net shape, complicate-geometry castings with desired mechanical properties. dimensional tolerance, and surface finish. However, top quality castings can be achieved only when optimal performance of thecold chamber (shot sleeve )and plunger is maintained druing the molten metla injection phase of the process. Unforturately, inreality , shot sleeves deteriorate fast and sometimes fail catastrophically due to incorrect design. These early and unexpected failures of shot sleeves cost die casters money and productiivity. To prevent promature failures of shoe sleeves major faulure mechanisms were investigated. with the aid of analyticla solutions robust design criteria for shot sleeves have been developed. The data directly obtained from failed shot sleeves in the die casting industry for automotive parts, support a strong correlation between design and filures. by applying these design criterial we expected premature faulures of shot sleeves can be avoided in die casting industry.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.7 no.3
• /
• pp.118-125
• /
• 1998

Chip control is a major problem in automatic machining process, especially in finish turning operation. In this case, chip breaker is one of the important factors to be determined. As unbroken chips are grown. these deteriorate the surface roughness. and proces automation can not be carried out. In this study to get rid of chip curling problem while turning internal hole. optimal chip breaker is selected from the experiment. The experiment is planned with Taguchi's method that is based on the orthogonal arrary of design factors. From the response table. cutting speed, feedrate, depth of cut and tool geometry turn to be major factors affecting chip formation. Then, optimal chip breaker is selected. and this is verified as good enough for chip control from the experiment.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.20 no.4
• /
• pp.382-385
• /
• 2011

There is an immense need to obtain nanometric surface finish on optical glass owing to the advantage of improved performance of the components. But owing to brittleness and hardness, optical glass is one of the materials that is difficult to ultra-precision turning. According to the hypothesis of ductile mode machining, regardless of their hardness and brittleness, will undergo a transition from brittle to ductile machining region below a critical undeformed chip thickness. Below this threshold, it is suggested that the energy required for plastic formation. Thus, plastic deformation is the predominant mechanism of material removal in machining these materials in this mode. An experimental study is conducted diamond cutting for machining BK7 glass. The investigation presents the feasibility of achieving nanometric surface and the understanding the mechanism of cutting glass, proving the cutting edge radius effect.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1999.08a
• /
• pp.412-422
• /
• 1999

Scale defects generated on the strip surface in a tandem finishing mill line are collected from the strip trapped among the production mills by freezing the growing scale on the strip by the melt glass coating and shutting down the line simultaneously. The samples observed of its cross sectional figure showed the process of scale defect formation where the defects are formed at the base metal surface by thicker oxidized scale during each rolling passes. The properties of the oxidized layer growth both at rolling and inter-rolling are detected down sized rolling test simulating carefully the rolling condition of the production line. The thickness of the oxidized layer at each rolling pass are simulated numerically. The critical scale thickness to avoid the defect formation is determined through the expression of mutual relation between oxidized layer thickness and the lanks of the strip called quality for the scale defects. The scale growth of scale less than the critical thickness and also to keep the bulk temperature tuning the water flow rate and cooling time appropriately. Two units of Inerstand Cooler are designed and settled among the first three stands in the production line. Two units of scale defect is counted from the recoiled strip and the results showed distinct decrease of the defects comparing to the conventionaly rolled products.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.13-19
• /
• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.15 no.4
• /
• pp.83-91
• /
• 2006

At present, industry and researchers are looking for ways to reduce the use of lubricants because of ecological and economical reasons. Therefore, metal cutting is to move toward dry cutting or semi-dry cutting. One of the technologies is known as MQL(Minimum Quantity Lubrication) machining. This research presents an investigation into MQL machining with the objective of deriving the optimum cutting conditions for the turning process of SM4SC. To reach these goals several finish turning experiments were carried out, varying cutting speed, feed rate, oil quantity and so on, with MQL and flood coolant. The surface roughness and cutting force results of tests were measured and the effects of cutting conditions were analyzed by the method of Analysis of Variance(ANOVA). From the experimental results and ANOVA, this research proposed optimal cutting conditions to improve the machinability in MQL turning process.