• 펄프종이기술
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• 제30권1호
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• pp.7-17
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• 1998

With the advent of CLSM in the end of 1980s, it has been applied to the field of pulp and paper science in various ways. This study showed the potentials of CLSM In analyzing a change of pulp fiber and paper properties before and after mechanical treatment. In particular, a quantification of internal fibrillation has been done using cross-sectional images of fibers and image analysis technique, then evaluated the effects of fiber wall delamination on fiber and paper properties. It showed that the delaminated fibers were closely associated to development of the interfiber bonding in a fiber network. The CLSM made it possible to investigate a density profile along the sheet thickness, which was created by some papermaking processes like pressing, drying and calendering. Through the attempt to observe the forming procedure of a fiber network during handsheet making, the CLSM images showed that the pressing stage was considered greatly to contribute to generation of interfiber bonding with removing a free water and partly a bound water between fibers. In addition, the CLSM could be used to illustrate not only a surface profile of paper showing the extent of smoothness or roughness, but also a density profile in a B-direction of the network. Finally it became evident that the CLSM could be used as an excellent tool to predict development in fiber and paper properties before and after mechanical treatment during papermaking processes.

• 한국결정성장학회지
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• 제26권2호
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• pp.67-73
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• 2016

The degradation behaviors of TiN coating layers under thermo-mechanical stress were investigated in terms of comparison of finite element analysis (FEA) and experimental data. The coating specimen was designed to quarter cylinder model, and the pulsed laser ablation was assumed as heat flux condition. The FEA results showed that heat accumulation at the center of the laser-ablated spot occurred and principle stress was concentrated at the lower region of the coating layer. The microstructural observation revealed that surface melting and decrease of the coating thickness occurred in the TiN/Inconel 617 and the interfacial cracks formed in the TiN/Si. The delamination was caused by the mechanical stress from the center to the outside of the ablated spot as the FEA results expected. It was considered that the improvement of the thermal shock resistance was attributed to higher thermal conductivity of Si wafer than that of Inconel 617.

• 한국해양공학회지
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• 제22권6호
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• pp.35-40
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• 2008

The effect of counterpart roughness on abrasive wear characteristics of side plate materials of FRP ship, which were composed of glass fiber and unsaturated polyester resin composites, were investigated at ambient temperature by pin-an-disc friction test. The friction coefficient, wear rate and cumulative wear volume of these materials against SiC abrasive paper were determined experimentally. The wear rate of these materials decreased rapidly with sliding distance and then maintained a constant value. It was increased as counterpart roughness was rougher in a wear test. The cumulative wear volume tended to increase nonlinearly with sliding distance and depended on applied load and sliding speed for these composites. It could be verified by SEM photograph of fracture surface that major failure mechanisms were overlapping layers, microcutting, deformation of resin, delamination, and cracking.

• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.213-217
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Smart Structures and Systems
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• 제3권4호
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• pp.439-454
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• 2007

In this paper a damage imaging technique using pre-stack migration is developed using Lamb (guided) wave propagation in composite structures for imaging multi damages by both numerical simulations and experimental studies. In particular, the paper focuses on the experimental study using a finite number of sensors for future practical applications. A composite laminate with a surface-mounted linear piezoelectric ceramic (PZT) disk array is illustrated as an example. Two types of damages, one straight-crack damage and two simulated circular-shaped delamination damage, have been studied. First, Mindlin plate theory is used to model Lamb waves propagating in laminates. The group velocities of flexural waves in the composite laminate are also derived from dispersion relations and validated by experiments. Then the pre-stack migration technique is performed by using a two-dimensional explicit finite difference algorithm to back-propagate the scattered energy to the damages and damages are imaged together with the excitation-time imaging conditions. Stacking these images together deduces the resulting image of damages. Both simulations and experimental results show that the pre-stack migration method is a promising method for damage identification in composite structures.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.121-126
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• 2000

Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2004년도 정기학술대회
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• pp.147-151
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• 2004

In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

• 대한치과기공학회지
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• 제33권1호
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• pp.15-23
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• 2011

Purpose: Thy yttria tetragonal zirconia polycrystalline(Y-TZP) is a good structural ceramic for dental restoration. But it have a problem that delamination of veneering ceramic from the Y-TZP core materials. The problem generally occur at the interface, thus this study was conducted to evaluate the interface of Y-TZP using scanning electron microscopy(SEM). Methods: To investigate this aspect, high-resolution SEM observations were made of polished and etched (HF content gel) cross-sections of the interface area. Dry and moist veneering porcelain powders were built up on the zirconia base. Results: The extent of this surface faceting is dependent upon the moisture content of the porcelain powder and the firing temperature. More moisture and higher final heating temperature accelerates the observed faceting of the Y-TZP grains at the interface to the veneering ceramic. Conclusion: These changes of the Y-TZP grains indicate that destabilization of the tetragonal phase of zirconia occurs at the interface during veneering with ceramic. It may result in a reduction of the stability of the zirconia and interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Corrosion Science and Technology
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• 제6권1호
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• pp.18-23
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• 2007

DLC coatings have been deposited onto substrate of STS 316L and Ti alloy using r.f. PACVD (plasma-assisted chemical vapor deposition) with a mixture of $C_{6}H_{6}$ and $SiH_{4}$ as the process gases. Corrosion performance of DLC coatings was investigated by electrochemical techniques (potentiodynamic polarization test and electrochemical impedance spectroscopy) and surface analysis (scanning electron microscopy). The electrolyte used in this test was a 0.89% NaCl solution of pH 7.4 at temperature $37^{\circ}C$. The porosity and protective efficiency of DLC coatings were obtained using potentiodynamic polarization test. Moreover, the delamination area and volume fraction of water uptake of DLC coatings as a function of immersion time were calculated using electrochemical impedance spectroscopy. This study provides the reliable and quantitative data for assessment of the effect of substrate on corrosion performance of Si-DLC coatings. The results showed that Si-DLC coating on Ti alloy could improve corrosion resistance more than that on STS 316L in the simulated body fluid environment. This could be attributed to the formation of a dense and low-porosity coating, which impedes the penetration of water and ions.