• The Journal of the Acoustical Society of Korea
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• v.34 no.5
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• pp.371-376
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• 2015

In this study, we use 1:1, 1:2, and 1:4 scale zig-zag shape acoustic metamaterial structure to achieve broad and effective sound blocking at the subwavelength scale. The SPL(Sound Pressure Level) results show that the SPL loss of the scaled metamaterial slab in series is a superposition of individual SPL losses. Also, we show that the metamaterial tailors the material properties to achieve high impedance and high refractive index using effective medium theory. Our results show that broad and effective sound blocking is possible at the subwavelength scale just by scaling acoustic metamaterial.

• Elastomers and Composites
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• v.47 no.3
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• pp.254-258
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• 2012

Material characteristics and the prediction of life time of polyacrylic rubber (ACM) for automotive engine gasket were studied. Two kinds of ACM rubber compounds, having chlorine cure-site and carboxyl cure-site, were made with optimum formulations and the properties of each materials were examined. As a test results for the thermal properties and compression set, which are very important in the application for the automotive engine gasket, the compound using ACM with carboxyl cure-site was evaluated as having a better characteristics than that of ACM with chlorine cure-site. Arrhenius relationship based on time-temperature superposition principle (TTSP) was obtained through the accelerated heat aging test to predict the useful life-time for the compound using ACM with carboxyl cure-site.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Journal of radiological science and technology
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• v.28 no.4
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• pp.267-272
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• 2005

The effects of As addition in amorphous selenium (a-Se) films for digital X-ray conversion material have been studied using the moving photocarrier grating (MPG) technique. This method utilizes the moving interference pattern generated by the superposition of the two frequency shifted laser beams for the illumination of the sample. This moving intensity grating induces a short circuit current, jsc in a-Se:As film. The transport parameters of the sample are extracted from the grating-velocity dependent short circuit current induced in the sample along the modulation direction. The electron and hole mobility, and recombination lifetime of a-Se films with arsenic (As) additions have been obtained. We have found an increase in hole drift mobility and recombination lifetime, especially when 0.3% As is added into a-Se film, whereas electron mobility decreases with As addition due to the defect density. The transport properties for As doped a-Se films obtained by using MPG technique have been compared with X-ray sensitivity for a-Se:As device. The fabricated a-Se(0.3% As) device film exhibited the highest X-ray sensitivity out of 5 samples.