• Korean Journal of Materials Research
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• v.21 no.3
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• pp.161-167
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• 2011

The stress-strain responses and oxidation properties of cold-rolled Zr-1.5Nb-O and Zr-1.5Nb-O-S alloys were studied. The U.T.S. (ultimate tensile strength) of cold-rolled Zr-1.5Nb-O-S alloy with 160 ppm sulfur (765 MPa) were greater than that of Zr-1Nb-1Sn-0.1Fe alloy (750 MPa), achieving an excellent mechanical strength even after the elimination of Sn, an effective solution strengthening element. The addition of sulfur increased the strength at the expense of ductility. However, the ductile fracture behavior was observed both in Zr-Nb-O and Zr-Nb-O-S alloys. The beneficial effect of sulphur on the strengthening was observed in the cold rolled Zr-1.5Nb-O-S alloys. The activation volume of cold-rolled Zr-1.5Nb decreased with sulfur content in the temperature region of dynamic strain aging associated with oxygen atoms. Insensitivity of the activation volume to the dislocation density and the decrease of the activation volume at a higher temperature where the dynamic strain aging occurs support the suggestion linking the activation volume with the activated bulge of dislocations limited by segregation of oxygen and sulfur atoms. The addition of sulfur was also found to improve the oxidation resistance of Zr-Nb-O alloys.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• Analytical Science and Technology
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• v.5 no.2
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• pp.203-211
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• 1992

Fracture behavior and martensite substructure of Ni-36.5at.%Al alloy were investigated with the addition of vanadium which is known as scavenging element of grain boundary. The fracture surfaces were examined by scanning electron microscopy and the EDX spectrometer was applied for composition analysis of fracture surfaces. The substructure of martensite was studied by transmission electron microscopy. By addition of vanadium, fracture surfaces show mixed modes of intergranular and transgranular fracture and more Al content is found on the grain boundaries. For Ni-36.5at.%Al alloy, the planar faults observed in the martensite plates are the internal twins. By increasing the vanadium content, the modulated structure with stacking faults and dislocations dominates while the twinned martensite disappears. The stacking fault is determined to be extrinsic due to the substitution of V for Al. It is concluded that the segregation of sulfur on the high-energy state stacking fault area suppresses the intergranular fracture.