• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1994.10a
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• pp.62-66
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• 1994

본 연구에서는 실제 사용되고 있는 TDX-10 교환기의 subrack과 보드에 대한 진동 특성과 이 보드가 subrack에 실장되었을 때 진동 특성을 연구하였으며, subrack이 rack에 실장되는 조건을 갖는 진동 시험용 jig를 제작하여 보드와 subrack을 실장한 후 강제 진동시의 진동 전달 특성을 알아보았다. 본 연구의 결과는 내진동 특성이 우수한 전자통신 시스템 설계와 CDMA 이동통신 시스템의 HINA subrack 구조설계와 같은 개발장비 환경시험의 기초 자료로 활용될 수 있을 것이다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.4
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• pp.497-503
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• 1997

In the present study, the cooling package using the heat pipe has been developed to improve the thermal performance in the point of cooling characteristics of the electronic chip placed to the subrack being readily assembled and disassembled in ATM switching system. As the preliminary experiments, the cooling performances between a conventional way using a cooling fin and a proposed method applying the heat pipe are compared and analyzed. The cooling performance at a simulated electronic component packaging a heat pipe module is approximately achieved up to $5.0W/cm^2$ heat flux and the allowable temperature at the heated chip is sustained in the range within $70^{\circ}C$. From the results, it is confirmed that temperature oscillations are also settled by inserted wick in the evaporator section. From the user's viewpoint, the method to assemble and disassemble the heat pipe easily has been devised.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Smart Media Journal
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• v.10 no.3
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• pp.54-59
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• 2021

Flight data acquired through flight instrumentation equipment during aircraft development play an important role in aircraft development and performance improvement. Therefore, as the reliability of flight instruments is required, inspection systems to check the soundness of flight instruments are very important. In this paper, we analyze the existing test system for flight data instrumentation equipment and present improvements in the hardware and software aspects of the test system. Based on this, we design and implement a test system with improved performance and present test results. Test system with improved performance improves cost savings, flexible application, and maintenance compared to the existing test system. Therefore, the robustness of the instrumentation equipment can be obtained, which can be expected to improve the reliability of flight data.

• The Transactions of the Korean Institute of Power Electronics
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• v.26 no.3
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• pp.222-226
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• 2021

To comply with CE marking requirements, the electromagnetic compatibility (EMC) and low-voltage directive (LVD) tests are conducted on the sub-racks of International Thermonuclear Experimental Reactor (ITER) AC/DC converters and bypass switches. The EMC tests consist of a series of tests, including the electromagnetic interference test, the electromagnetic field immunity test, and the rapid transient burst immunity test. In the LVD test, the electric shock protection test, the xcessive temperature limit and heat resistance of equipment tests, and the fire spread prevention test are performed. This work presents and reviews the European Directive for EMC/LVD and introduces the methods of EMC and LVD tests for the sub-racks of AC/DC converters and bypass switches. It also evaluates the test method and results to meet the European Directive requirements for CE marking. The sub-racks of ITER AC/DC converters and bypass switches successfully pass the EMC and LVD tests.