• Journal of the Korean Society for Precision Engineering
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• v.18 no.4
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• pp.182-189
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• 2001

TiCN based submicron cermet and similar ISO grad of the conventional cermets with TiCN of different particle size were produced by PM process, and their microstructure, mechanical properties and cutting performance were compared. The microstructure of submicron cermet was more homogeneous and showed much finer microstructure, resulting in better hardness and fracture toughness. The submicron cermet tools achieved excellent cutting performance such as wear resistance and toughness in comparison with two grades of the conventional cermets in millimg test. The relationship between microstrucure, mechanical properties and cutting performance of these cermet tools was discussed. The submicron cermet tools revealed for their potential to wide application range and interrupt cutting because of their superior wear resistance and toughness combinations.

• Journal of Powder Materials
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• v.15 no.6
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• pp.482-488
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• 2008

The indentation technique has been one of the most commonly used techniques for the measurement of the mechanical properties of materials due to its experimental ease and speed. Recently, the scope of indentation has been enlarged down to the nanometer range through the development of instrumentations capable of continuously measuring load and displacement. In addition to testing hardness, the elastic modulus of submicron area could be measured from an indentation load-displacement (P-h) curve. In this study, the hardness values of the constituent phases in Ti($C_{0.7}N_{0.3}$)-NbC-Ni cermets were evaluated by nanoindentation. SEM observation of the indented surface was indispensable in order to separate the hardness of each constituent phase since the Ti($C_{0.7}N_{0.3}$)-based cermets have relatively inhomogeneous microstructure. The measured values of hardness using nanoindentation were ${\sim}20$ GPa for hard phase and ${\sim}10$ GPa for binder phase. The effect of NbC addition on hardness was not obvious in this work.