• 제목/요약/키워드: Submicron

검색결과 531건 처리시간 0.027초

Submicron 부유분진의 화학적 조성 및 분포에 관한 연구 (Studies on the Chemical Compositions and Distributions of Ambient Sumicron Aerosols)

  • 황인조;김동술
    • 한국대기환경학회지
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    • 제14권1호
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    • pp.11-23
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    • 1998
  • The purpose of this study was to survey chemical distribution of inorganic elements and ions in the submicron particles, to characterize qualitatively emitting sources by factor analysis, and finally to reveal existing patterns in terms of chemical compounds by a stepwise multiple regression analysis. Total of 141 samples were collected by a cascade impactor from 1989 to1996. Fifteen chemical species (Al, Ba, Cd, K, Pb, Cu, Fe, Ni, $Cl^-, NO_3^-, SO_4^{2-}, K^+, Mg^{2+}, Ca^{2+}, and Na^+$) were characterized by AAS and IC. The study showed that average seasonal levels of submicron particulate matters $(d_p<0.43 \mum)$ were 18.7 $\mug/m^3$ in spring, 15.5 $\mug/m^3$ in summer, 15.7 $\mug/m^3$ in fall, and 24.5 $\mug/m^3$ in winter, respectively. All of the anion concentrations in the particle were highest in the winter season. By applying a factor analysis, 5 source patterns were qualitatively obtained, such as sulfate related source, nitrate related source, oil burning source, calcium related source, and coal combustion source. Finally, when applying a stepwise multiple regression analysis, the results clearly showed that $Na^+ and Ca^{2+}, K^+ and Ca^{2+}, NO_3^-$ and relative humidity, $Cl^-$ and ambient temperature, $Ca^{2+} and Cl^-, Mg^{2+} and SO_4^{2-}, Na^+ and NO_3^-, and Ca^{2+} and NO_3^-$, respectively, are negatively contributed to each other. As a result of those statistical analysis, we could suggest that some chemical compounds in the submicron particles such as$NaNO_3, MgSO_4, Ca(NO_3)_2, and CaCl_2$ may not exist on the filter as final composing products; however, other compounds may possibly exist in the form of $Mg(NO_3)_2, CaSO_4, Na_2SO_4, K_2SO_4, MgCl_2, NaCl, and KCl$. Thus, it must be necessary to identify differences between the results of above statistical analysis and of the real world by laboratory experiments.

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Removal of Endotoxins and Nucleic Acids Using Submicron-sized Polymeric Particles

  • Kim, Chan Wha;Chokyun Rha
    • Journal of Microbiology and Biotechnology
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    • 제6권3호
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    • pp.189-193
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    • 1996
  • Submicron-sized polymeric particles (SSPP) were used to remove nucleic acids and endotoxins from cell lysates. The positively charged SSPP selectively adsorb nucleic acids and endotoxins and form complexes with them. The complexes can be easily removed by sedimentation or centrifugation. The removal of nucleic acids and endotoxins using SSPP also can be accomplished in the presence of cell and cell debris. Therefore, nucleic acids and endotoxins can be removed in an initial step of the down-stream processes. In bakers yeast and E. coli lysate systems, the level of DNA could be reduced more than three orders of magnitudes and endotoxins more than seven orders of magnitudes concurrently willi the cell debris removal process using SSPP.

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Al/TiN/Ti 전극의 Submicron contact에서의 전기적특성(2) (The Electrical properties of Al/TiN/Ti Contact at Submicron contact(2))

  • 이철진;엄문종;라용춘;김성진;성만영;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1069-1071
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    • 1995
  • The electrical properties of Al/TiN/Ti contact are investigated at submicron contacts. The contact resistance and contact leakage current are dependent on metallization, surface dopant concentration, semiconductor surface treatment and contact plug ion implantation. In this paper, the contact resistance and contact leakage current are studied according to surface dopant concentration, semiconductor surface treatment and contact plug ion implantation at 0.8 micron contact. The contact resistance and contact leakage current increases with increasing substrate ion concentration. HF cleaning represents high contact resistance but low contact leakage current while CDE cleaning represents low contact resistance but high contact leakage current. Contact plug ion implantation decreases contact resistance but increases contact leakage current. Specially, RTA represents good electrical properties.

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Al/TiN/Ti 전극의 Submicron contact에서의 전기적특성(1) (The Electrical properties of Al/TiN/Ti Contact at Submicron contact(1))

  • 이철진;엄문종;라용춘;성만영;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1013-1015
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    • 1995
  • The electrical properties of Al/TiN/Ti contact according to post anneal ins conditions are investigated at submicron contacts. $N^+$ contact resistance increases with increasing alloy temperature while $P^+$ contact resistance slightly decreases. The contact tentage current increases wi th increasing alloy temperature for both $N^+$ and $P^+$ contacts. The contact resistance and leakage current of $N^+$ contact increases with increasing alloy tide. $P^+$ contact resistance decreases with increasing alloy time but $P^+$ contact tentage current increases. The contact resistance and contact leakage current increases with increasing alloy cycles for both $N^+$ and $P^+$ contacts.

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A Case Study on Sintering Characteristics of Yttria Stabilized Zirconia Powder Prepared by Two-Fluid Spray Drying

  • Choi, Jin Sam;Kong, Young-Min
    • 한국세라믹학회지
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    • 제53권3호
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    • pp.332-337
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    • 2016
  • As a case study on yttria stabilized zirconia ceramics, the sintering characteristics of submicron powders and the granulation prepared by two-fluid spray drying of submicron particles were investigated. As-received powders of yttria stabilized zirconia particles were reduced to a uniform size of less than about 200 nm by repeated milling. Granulation size obtained by the two-fluid spray drying was affected by the organic matter and the primary particle size. Sintering behavior such as porosity, water absorption ratio, density, and transparency was influenced by processing conditions of the powder, and the discontinuous interfaces in a green body were reduced.

AI 합금의 Contact Hole Filling 에 관한 연구 (Filling the Submicron Contact Holes with Al Alloys)

  • 김용길
    • 한국진공학회지
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    • 제2권4호
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    • pp.474-479
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    • 1993
  • Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.

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초고집적 Submicron 박막금속화를 위한 Dielectric Overlayer의 Passivation 효과 (The Effects of Dielectric Passivation Overlayers for Submicron Thin Film Metallizations of ULSI Semiconductor Devices)

  • 김대일;김진영
    • 한국진공학회지
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    • 제3권1호
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    • pp.59-64
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    • 1994
  • 극소전자 디바이스의 고집적화와 더불어 박막배선의 선폭은 0.5$\mu$m이하까지 축소되며 초고집적 submicron 박막금속화가 진행되고 있다. 미세회로에 적용되어지는 배선재료는 인가되는 고전류밀도로 인하여 electromigration 에 의한 결함이 쉽게 발생한다는 단점이있다. 금속박막 전도체위의 dielectric overlayer는 electromigration 에 대한 passivation 효과를 보여 극소전자 디바이스의 평균수명을 향상시 킨다.본 연구에서는 박막금속화에서 dielectric overlayer의 passivation 효과를 알아보기 위하여 약 3000 $\AA$ 두께의 Al,Al-1%Si, Ag 그리고 Cu 박막배선위에 증착하여 SiO2절연보호막의 유무에 따른 박막배선 의 수명변화 및 신뢰도를 측정하였다. 박막배선에 인가된 전류밀도는 1x106 A/cm2와 1x107 A/cm2 이었다. SiO2 dielectric overlayer는 Al,Al-1%Si Ag. Cu 박막배선에서는 electromigration에 대한 보호막 혀과를 보이며 평균수명을 모두 향상시킨다. SiO2 passivation 효과는 Al, Ag, Cu 박막중 Cu 박막배선에서 가 장 크게 나타났다. SiO2 dielectric overlayer가 형성되지 않은 경우 Al 박막배선의 수명이 가장 긴 것으 로 나타났으나 SiO2 가 형성된 경우는 Cu 박막배선의 수명이 가장 길게 나타났다.

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단일 전하로 하전된 단일 섬유에서의 미세입자의 초기 집진효율에 관한 이론적 연구 (A Theoretical Study on the Initial Collection Efficiency of Submicron Particles by a Unipolar Charged Fiber)

  • 오용학;전기준;정용원
    • 한국대기환경학회지
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    • 제17권3호
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    • pp.259-268
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    • 2001
  • In this study, we have developed a simulation method to predict the initial collection efficiency of a unipolar charged fiber in the electret filters. The particle sizes considered were in the submicron range and thus Brownian motion of particles was also taken into consideration along with electrostatic forces acting on the particles. The simulation results were compared with other investigators experimental data on single fiber efficiency as well as with the calculated results using the existing correlations on single fiber efficiency. It has been shown that simulation results are in good agreement both with the experimental data with those predicted by the correlations.

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전기 집진기에서의 Submicron 입자의 집진 특성에 관한 연구-I. 전기적 특성 (A Study on the Collection Characteristics of Submicron Particles in an Electrostatic Precipitator - I. Electrical Characteristics)

  • 김용진;황태근;유주식
    • 설비공학논문집
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    • 제13권7호
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    • pp.572-578
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    • 2001
  • This study conducts a laboratory measurement on a cylindrical electrostatic precipitator(ESP) with a 30mm-diameter cylinder. Several kinds of test aerosols are generated with an atomizer and a diffusion dryer. The effects of applied voltage, flow state, gas velocity, and gas temperature on the electrical characteristics of the precipitator and onset of corona are experimentally investigated. The corona onset voltage is decreased, as diameter of discharge electrode wire becomes small or temperature of the precipitator increases. As the fluid velocity or particle load in the precipitator increases, the corona current is decreased.

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초정밀위치결정을 위한 델타스테이지의 최적 설계 및 컴퓨터 시뮬레이션에 관한 연구 (A Study on the Optimal Structural Design and Computer Simulation of Delta Stage for ultra Precision Positioning)

  • 김재열;김영석;송찬일;곽이구;한재호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.221-225
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    • 2001
  • Recently, high accuracy and high precision are required in various industrial fields that are composed of semiconductor manufacturing apparatus and ultra precision positioning apparatus and information system and so on. The positioning technology is a very important one among them. This technology has been rapidly developed, its field needs for positioning accuracy to high as submicron. It is expected that accuracy with 10 nm in precision working and accuracy with 1 nm in ultra precision working are reached at the beginning of 2000s. Recently, to accomplish this positioning technology, many researches are concerned about it and make efforts it. This paper contain design technology of ultra precision 2-axis(X-Y Delta) stage for materialize to positioning accuracy with submicron, where, Delta stage is design as optimum against load and disturbance. And computer simulation is performed for stability and dynamic characteristic of Delta stage.

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