• The Journal of the Petrological Society of Korea
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• v.3 no.1
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• pp.20-33
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• 1994

Some of the seven types of subgrain boundaries (Means and Ree, 1988) in octachloropropane samples show distinctive deformation patterns during their development. Type II subgrain boundaries migrate to accommodate the deformation difference between adjacent grains. The formation of Type III requires a rigid-body roation of grains to reduce misorientation of adjacent grains. Type I, IV, V and VI develop either in static or dynamic condition. Type VII form only in static environments after deformation. Ribbon grains can develop via Type III or Type IV process. The orientation pattern and density of subgrain boundaries are more or less stable through a post-deformation heating. Subgrain boundary orientations are symmetric with respect to the grain-shape foliation in pure shear. In simple shear, their maximum inclines toward the direction of shear.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.3
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• pp.127-137
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• 1993

The changes of lamellar(${\alpha}_2+{\gamma}$) structure of TiAl intermetallic compound which is a high potential, high temperature aerospace material was investigated by heat treatment. The lamellar structure was short and made subgrain in prior a grains after homogenizing at 1523 K. It became longer and finer, and the subgrain went out during subsequent isothermal heatteating at 1273 K. The yield, fracture strength and strain to fracture if the heat treated specimens was increased and the hardness of them was decreased a little in the finer lamellar structure, because fine lamellar interface, sugrain boundary and grain boundary may block initiation and propagation of crack.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.184-190
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• 1995

IN 617 was crept under stresses of 107 and 180 MPa with monotonic deformation to strains of $\varepsilon$= 0.03 - 0.30 at 1073K. In order to determine the distances between the subgrain boundaries, the deformed specimens were examined at magnifications of one hundred thousand times by TEM. In cases . where TEM observations were not possible, subgrain angles($\theta$_{s}=sin^{-1}$(b/s))were measured by Kikuchi diffraction lines. The $\theta$_{k}$ converted from s values measured directly by TEM agreed very well with those measured from Kikuchi lines. Therefore, it was found that the $\theta$_{k}$ values could be used in obtaining s, especially in cases where it is impossible to measure s by TEM.

• Korean Journal of Materials Research
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• v.10 no.11
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• pp.725-731
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• 2000

Recrystallization behaviors of cold-worked and $\beta$-quenched Zr-Zn alloys were investigated by the microhardness tests and microscopic examinations. The recrystallization of the $\beta$-quenched alloys was retarded in comparison with that of the cold-worked alloys, suggesting that the stored energy of the cold-worked alloys is larger than that of the $\beta$-quenched alloys. Although initial hardness for the cold-worked and the $\beta$-quenched specimens had an equal value, the recrystallization behaviors were observed to be quite different. Based on the transmission electron microscope(TEM) studies, it was suggested that the recrystallization of the cold-worked specimen would have occurred by subgrain coalescence while that of $\beta$-quenched specimen by strain-induced grain boundary migration.

• Applied Microscopy
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• v.21 no.2
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• pp.57-66
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• 1991

The main purpose of this paper was to investigate the change of rapidly solidified microstructures and dispersoid behavior according to heat-treatment in the Al-Fe-V-Si-(Mn) alloys. It was found that (111) preferred orientation identified by X-ray diffraction and fine subgrain/large grain were observed in the rapidly solidified Al-Fe-V-Si-(Mn) alloys. Cell boundary of the zone A was composed of the microcrystalline, whereas that of the zone B was amorphous. Decomposition of the Al-Fe-V-Si-(Mn) alloys occurred at about $300^{\circ}C$. These alloys exhibited excellent thermal stability at the elevated temperature. Microstructure of the zone B was more stable than that of the zone A. The spherical dispersoid and 5-fold symmetry phase was also more thermally stable than the amorphous structure of cell boundary.

• Korean Journal of Metals and Materials
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• v.48 no.4
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• pp.297-304
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• 2010

The microstructure and hardness of $CO_2$ laser welds were investigated in the Ti-stabilized ferritic stainless steel 409L. The observed specimen was welded in a fully penetrated condition in which the power was 5 kW and the welding speed 5 m/min. The grain structure near the bond line of the laser welds was produced by epitaxial growth. The grain size was the largest in the fusion zone, and HAZ showed nearly the same grain size as that of the base metal. The HAZ microstructure consisted of subgrains and precipitates that were less than 100 nm in size and that were located along the subgrain boundaries. On the other hand, the hardness was the highest in the fusion zone due to the large amount of small precipitates present. These were composed of TiN, Ti(C,N) and $TiO_2$+Ti(C,N). The hardness decreased continuously from the fusion zone of the base metal. The HAZ hardness was slightly greater than that of the base metal due to the existence of subgrains and precipitates in the subgrain boundary.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.429-436
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• 2001

The effect of welding condition on the microstructures of the weld metal in A7N01 welded by $CO_2$ laser was investigated. The number of ripples was increased with decreasing power and increasing welding speed. In the bead without ripple lines, the subgrain microstructures distribution from the fusion line toward the center of the bead were in the order of cellular, dendritic and equiaxed dendrite. However, in the bead with ripple lines, cellular and dendritic were formed between the fusion boundary and the ripple line. Inaddition, those structures were also observed between the ripple line. Equiaxed dendrites were formed only at the center line region. Cellular and dendritics formed near the ripple line were larger than those formed near the fusion boundary. The cooling rates estimated by the dendrite arm spacing were in the range of 200 to 1150oC/s. Cooling rate was increased with decreasing the power and increasing the welding speed. Mg and Zn segregated at the boundaries of cellulars and dendritics, Mg was segregated more than Zn. The segregation of Mg and Zn decreased with increasing cooling rate. Hardness of the weld metal was lower than that of the base metal in all welding conditions and increased as the cooling rate increased.

• Journal of the Korean Ceramic Society
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• v.31 no.2
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• pp.147-154
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• 1994

The imperfections of LiTaO3 crystals grown from the Pt-Rh and the Ir crucible were investigated with X-ray diffraction, optical and electron microscope. The growth direction was <100>h and the plane parallel to the plane connecting two main growth ridges was (012)h which would be the main cleavage plane. The dislocation density in the specimen cut parallel to (012)h plane increased with polishing time and the inverted ferroelectric microdomains were induced based on this dislocations. Such imperfections as 180$^{\circ}$ domains, microcracks, dislocations and stacking faults. could be found in the LiTaO3 crytals. The crystal contaminated with lots of Rh form Pt-Rh crucible during the crystal growing under air atmosphere contained more imperfections. The main cleavage plane and subgrain boundary parallel to its growing axis might be the main source of reducing the mechnical strength during the wafering process.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• Electronic Materials Letters
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• v.14 no.6
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.