• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 접착 및 계면
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• 제7권4호
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• pp.60-64
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• 2006

In modern vehicle construction the search for means of weight reduction, improving durability, increasing comfort and raising body stiffness are issues of priority to the design engineer. The intelligent usage of many materials such as high strength steel, light-alloys and plastics enables a significant vehicle weight reduction to be achieved. The classical joining techniques used in the automobile industry need to be newly-evaluated since they often do not present workable solutions for such mixed-material connections, for example aluminium/steel. Calculation/simulation methods have made progress as a key factor for broader and more cost-effective implementation of structural bonding. This will lead to reduction of spotwelds and accelerate the car development. A special focus of the paper is the use of high strength steel grades. It will be shown that adhesive bonding is a key tool for yielding the potential of advanced high strength steel for low gauging without compromising the stiffness. The latest status of adhesive development has been described. Improvements with physical strength and glass temperature as well as of process relevant properties are shown. Also the situation regarding occupational hygiene is treated, showing that by further spotweld point reduction the emission around the working area can be even lowered against the current praxis. High performing lightweight design cannot longer do without high performing crash durable adhesives.

• 대한기계학회논문집
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• 제19권7호
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• pp.1651-1656
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• 1995

The adhesively bonded tubular single lap joint shows large nonlinear behavior in the loaddisplacement relation, because structural adhesives for the joint are usually rubber toughened, which endows adhesives with nonlinear shear properties. since the majority of load transfer of the adhesively bonded tubular single lap joint is accomplished by the nonlinear behavior of the adhesive, its torque transmission capability should be calculated incorporating nonlinear shear properties. However, both the analytic and numerical analyses become complicated if the nonlinear shear properties of the adhesive are included during the calculation of torque transmission capabilities. In this paper, in order to obtain the torque transmission capabilities easily, an iterative solution which includes the nonlinear shear properties of the adhesive was derived using the analytic solution with the linear shear properties of the adhesive. Since the iterative solution can be obtained very fast due to its simplicity, it has been found that it can be used in the design of the adhesively bonded tubular single lap joint.

• Journal of the Korean Wood Science and Technology
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• 제26권1호
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• pp.14-18
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• 1998

A low density polyethylene(LDPE) was examined as an additive in phenol-formaldehyde(PF) resin adhesive for bonding radiata pine plywood. The LDPE was supplied by the commercial manufacturer. The LDPE was compared to a commercial filler commonly used in structural plywood adhesives in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins Inc.. using plywood-type PF resin. A total of 48 three-ply plywoods. 6.3 mm nominal thickness and 30 by 30 em in size, were made at two press times (4 and 5 min). two press temperatures (150 and $160^{\circ}C$) and 30 minute assembly times for four adhesive mixing types. Evaluations of the LDPE addition were carried out by performance tension shear tests after two cycle boil aging tests on plywood per the U.S. Product Standard PS I-83. After accelerated-aging tests. plywoods were exhibited no delamination. The test results included tension shear strength and estimated wood failure values. The plywood test results support the use of polyethylene as an additive in plywood adhesives.

• Journal of the Korean Wood Science and Technology
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• 제26권3호
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• pp.48-52
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• 1998

Residues such as walnut, pinenut and peanut shells were used as a filler in adhesive for bonding radiata pine plywood. The nutshell residues were prepared by simply drying to 8% moisture content and grinding the dry material using a laboratory Wiley mill with a $75{\mu}m$ (200 mesh) screen. The nutshells residues were compared to a commercial filler commonly used in adhesives by the structural plywood and laminated veneer lumber industry in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins, Inc., using phenol-formaldehyde resin. For each filler type, three-ply plywoods, 6 mm nominal thickness and 30 by 30 cm in size, were fabricated at two press times (4 and 5 min) and around 30 minute assembly time. Evaluations of the nutshell residues were carried out by tension shear tests after cyclic boil tests on plywood. The results of the performance test included tension shear strength and wood failure. All plywoods made with the nutshell fillers were comparable to those made with the control filler. These results indicate that nutshell residues would be suitable as filler for plywood adhesives.

• Current Photovoltaic Research
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• 제5권3호
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• pp.95-99
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• 2017

The interconnecting shingled solar cells method shows extremely high ratio active area per total area and has the excellent potential for high power PV (photovoltaic). Compared to the conventional module, it can have much more active area due to busbar-free structure. The properties of ECA (electrically conductive adhesives) are significant to fabricate the shingled array PV since it should be used in terms of electric and structural connection. Various ECA were tried and characterized to optimize the soldiering conditions. The open circuit voltage of shingled array cells showed a three-fold increase and efficiency was also increased by 1.63%. The shingled array cells used in CE3103WLV showed the highest power and in CA3556HF the lowest curing temperature and very fast curing time.

• Current Photovoltaic Research
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• 제9권2호
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• pp.31-35
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• 2021

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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• pp.349-352
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• 2006

Pull-off test is generally used as a method of evaluating bond strength of FRP with concrete at the job site. However, pull-off test damages FRP composites and the maximum pull-off strength is limited up to tensile strength of concrete. Accordingly, it is required to set-up a test method that can simply evaluate bond performance of structural adhesive. This study suggested compression and bending test of epoxy resin as test methods that can indirectly evaluate performance of adhesive, as well as standardized test specification for different types of specifications from various countries. In this study, the section dimension of compression and bending test specimens is unified, and standard test specimen size is achieved by test results.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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• pp.353-356
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• 2006

Hardening of 2 component adhesive such as epoxy resin used in saturating FRP composite is triggered by mixing each component part within a batch. Chemical reactions occur explosively after a certain time after mixing the batch, viscosity and temperature rapidly increase. As a results, bond performance remarkably decreases and workability declines due to increase in viscosity. Therefore, adhesion should be completed before chemical hardening reaction is rapidly going on. This study examined pot life of structural adhesive for FRP composites by means of change in apparent viscosity and means of exothermic reaction temperature proposing in existing test standards. Result of each test method was compared and analyzed, and reasonable test method and evaluation method are suggested.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 봄학술 발표회 논문집(II)
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• pp.269-272
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• 2005

Epoxy resins are gradually becoming some of the most important and versatile polymers in modem civil engineering. Because epoxy resins have some unigue properties, such as toughness, versatility of viscosity and curing conditions, good handling characteristics, high adhesive strength, inertness, low shrinkage compared to most other thermo-setting resins and concrete, and resistance to chemicals, they have found many applications in construction castings, repair materials, road or bridge deck pavements, coatings, and as structural or non structural adhesives. In this applications, epoxy resins are widely used for polymer concretes, grouting materials, injection glues, and sealants. In this paper, characteristics of deformation of repair material after repaired have been investigated by viscosity of repair material and the width of crack. It is believed that flexural strength of epoxy resin with low viscosity is high because tensile strength is high and elongation at break is low, fracture energy is low.