• Title/Summary/Keyword: Stress Range

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Endurance Life and Deformation Behavior under Thermo-mechanical Fatigue of Nb-added Heat Resistant Austenitic Stainless Steel (Nb 첨가 오스테나이트계 내열 스테인리스강의 열기계적 피로 수명 및 변형 거동)

  • Oh, Yong Jun;Park, Joong-Cheul;Yang, Won Jon
    • Korean Journal of Metals and Materials
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    • v.49 no.7
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    • pp.541-548
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    • 2011
  • Thermomechanical fatigue (TMF) behavior of heat resistant austenitic stainless steel was evaluated in the temperature range from 100$^{\circ}C$ to peak temperatures of 600 to 800$^{\circ}C$; The fatigue lives under TMF conditions were plotted against the plastic strain range and the dissipated energy per cycle. In the expression of the inelastic strain range versus fatigue life, the TMF data obtained at different temperature ranges were located close to a single line with a small deviation; however, when the dissipated energy per cycle, calculated from the area of the stress-strain hysteresis loops at the half of the fatigue life, was plotted against the fatigue life, the data showed greater scattering than the TMF life against the inelastic strain range. A noticeable stress relaxation in the stress-strain hysteresis curve took place at the peak temperatures higher than 700$^{\circ}C$, but all specimens in this study exhibited cyclic hardening behavior with TMF cycles. Recrystallization occurred during the TMF cycle concurrent with the formation of fine subgrains in the recrystallized region, which is considered to cause the cyclic hardening of the steel.

Effect of Cu2+ Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths (황산염용액으로부터 전기도금 된 FCCL용 Cu 필름의 특성에 미치는 Cu 이온농도 및 첨가제의 영향)

  • Shin, Dong-Yul;Park, Doek-Yong;Koo, Bon-Keup
    • Journal of the Korean institute of surface engineering
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    • v.42 no.5
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    • pp.191-196
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    • 2009
  • Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $Cu^{2+}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of electrodeposited Cu film. Current efficiency was nearly 100% at from 0.2M to 1.0 M $Cu^{2+}$ concentration. but it was linearly increased with $Cu^{2+}$ concentration at less than 0.2M. The residual stress was observed in range of 7.9 to 18.4 MPa and tensile stress mode. Dendritic and powdered form was obtained at below 0.1 M. As increased with $Cu^{2+}$ concentration in solution, the main peak in the XRD pattern shifted (111) and (220) from (200). In the other hand, all about 100% current efficiency observed in all additive concentration systems, and residual stress observed in range of 20.4 to 26.3 MPa tensile stress. The condition 5(Ultra make-up - 10 ml/l, Ulta A - 0.5ml/l, Ultr B - 0.5 ml/l) was good surface morphology, and fcc(111) peak in XRD patterns increased with increasing additive concentration.

Fatigue Strength Improvement and Fatigue Characteristics by TIG-Dressing on Weld Bead Toes (용접지단부 TIG처리에 의한 피로강도향상 및 피로특성)

  • Jung, Young Hwa;Kim, Ik Gyeom;Nam, Wang Hyone;Chang, Dong Huy
    • Journal of Industrial Technology
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    • v.20 no.A
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    • pp.169-178
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    • 2000
  • The 4-point bending tests have been performed In order to estimate the effect of TIG-dressing on fatigue strength and fatigue characteristics quantitatively for non load-carrying fillet welded joints subjected to pure bending. As a result of fatigue tests, fatigue strengths of as-welded specimens have satisfied the grade of fatigue strength prescribed in specifications of korea, AASHTO and JSSC. Fatigue strength at 2 million cycles of TIG-dressing specimens have increased compared with as-welded specimens. As the result of beachmark tests, fatigue cracks occurred at several points, where the radius of curvature and flank angle in the weld bead toes were low, and grew as semi-elliptical cracks, then approached to fracture. As a result of finite element analysis, stress concentration factor in weld bead toes has closely related to the flank angle and radius of curvature, and between these, the radius of curvature has more largely affected in stress concentration factor than flank angle. As a result of fracture mechanics approaches, the crack correction factor of test specimens has largely affected on stress gradient correction factor in case a/t is below 0.4. From the relations between stress intensity factor range estimated from FEM analysis and fatigue crack growth rate, fatigue life has been correctly calculated.

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Fatigue Crack Growth Behavior of 7075-T6Al Alloy under Simple Stepped Variable Amplitude Loading Conditions (7075-T6Al 합금에 있어서 변동하중진폭 하에서의 피로균열성장거동)

  • 신용승
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.6 no.4
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    • pp.80-88
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    • 1997
  • An experimental investigation of the fatigue through crack growth behavior under simple stepped variable loading condition has been performed using Al7075-T651. Experiments were carried out by using cantilever bending type specimens, with chevron notches on a small electro-magnetic test machine. Tensile overloads have a retarding effect on the fatigue crack growth rates, therefore tensile overloads were used for the beneficial effect on the fatigue life. While in most cases compressive overloads have only a vanishing effect on crack growth rates, some experiments with single edge crack tension specimens reveal a marked growth retardation. The stress ratios used in this investigations varies from R=0.32 to 0.81, from R=0.04 to 0.76, from R=-0.15 to 0.73, and from R=-0.33 to 0.68 and the peak load for each case was not varied. The crack growth and crack closure were measured by Kikukawa's compliance method with a strain gauge mounted on the backside of each specimens. The results obtained are as follows. When the stepped variable load was applied, the smaller the stress ration was, the larger the delayed retardation of the crack growth rate was. The fatigue crack growh rate data obtained for through cracks were plotted well against the effective stress intensity factor range from 4.0 to 20.0MP{a^{SQRT}m}. It was found that the effective stress intensity factor range ratio was related well to the opening stress intensity factor, the maximum stress intensity factor, and crack length.

A Study on Residual Stress Characteristics for Joint of Soft Rock in Ring Shear Tests (링 전단시험기를 이용한 연암의 절리에 대한 잔류강도 특성에 관한 연구)

  • 권준욱;김선명;윤지선
    • Proceedings of the Korean Geotechical Society Conference
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    • 2000.03b
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    • pp.281-288
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    • 2000
  • In this study, we tried to determine failure criteria for joints of soft rock using ring shear test machine. The residual stress fellowing shear behavior was determined by the result of ring shear test and direct shear test. Ring shear test with the specimens which cover a large deformation range was adapted to measure a residual stress, and was possible to present the peak stress to present the peak stress to the residual stress at the same time. Residual stress is defined a minimal stress of specimens with a large displacement and the result of the peak residual stress is shown by a size of displacement volume. Therefore, the residual stress in soil was decided by shear stress of maximum shear stress - shear displacement(angle) based on the test result of a hyperbolic function ((equation omitted), a, b = experimental constant). In this study, it was proved that the residual stress of rock joint can be determined by using of this method.

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Sintering Temperature Effect on Electrical and Dielectric Stability of ZPCCL-Based Varistors (소결온도가 ZPCCL계 바리스터의 전기적, 유전적 안정성에 미치는 영향)

  • Nahm, Choon-Woo
    • Korean Journal of Materials Research
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    • v.16 no.8
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    • pp.466-472
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    • 2006
  • The electrical, dielectric properties, and its stability of ZPCCL-based varistors were investigated for different sintering temperatures in the range of $1230{\sim}1300^{\circ}C$. As the sintering temperatures increased, the varistor voltage decreased in the range of $777.9{\sim}108$ V/mm, the nonlinear coefficient decreased in the range of $77.9{\sim}7.1$, and the leakage current increased in the range of $0.3{\sim}50.6\;{\mu}A$. The stability of electrical and dielectric characteristics was obtained from sintering temperature of $1260^{\circ}C$. the varistors sintered at $1260^{\circ}C$ marked the high electrical and dielectric stability, with $%{\Delta}{V_{1mA}=+1.9%,\;%{\Delta}{\alpha}=-10.6%,\;%{\Delta}I_L=+20%\;and\;%{\Delta}tan\;{\delta}=+9.9%$ for DC accelerated aging stress state of $0.95V_{1mA}/150^{\circ}C$/24 h.

단일 과대하중에의한 크랙지연 거동에 관한 연구

  • 송삼홍;권윤기
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.04b
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    • pp.328-332
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    • 1993
  • Single overload tests are carried out for SS41. Specimens are used hollow type and solid type that stress condition prevail plane stress and plane strain at surface crack. According to the crack initiation and propagation period, single overload applies to three regime and overload ratios change into 1.5, 2.0. Crack retardation zones at initation range aren't different in both specimens respectively, however at propagation range come into large scale in hollow specimen. Delayed load cycles come into large scale in solid type. And the more the overload ratio increase, the larger the retardation zone increase but the magnitude doesn't exactly equal to the expected from the overload ratio.

A study on the creep mechanism of Al 7075 alloy (Al 7075 합금 의 크리이프 변형 기구 에 관한 연구)

  • 백남주;강대민;백성관
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.9 no.4
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    • pp.395-402
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    • 1985
  • The apparent activation energy Q$_{c}$ and the applied stress exponent n have been determined during creep of Al 7075 alloy over the temperature range of 90.deg. C to 320.deg. C (0.4-0.65T$_{m}$) and stress range of 1.85 kgf/mm$^{2}$ to 21 kgf/mm$^{2}$, respectively in order to investigate the creep behavior. Constant load creep tests were carried out in the experiment. At round the temperature of 200.deg. C-240.deg. C and under the stress level 8.13-9.55kgf/mm$^{2}$ and again at around the temperature of 280.deg. C-320.deg. C and under the stress level of 1.85-2.55kgf/mm$^{2}$, the creep behavior obeyed for the creep deformation was nearly equal to that of the volume self diffusion of pure aluminum (34kcal/mole). But at around the temperature of 90.deg. C and under the stress level of 10-21kgf/mm$^{2}$, the creep behavior did not obey a simple power-law relation and the apparent activation enrgy, Q$_{c}$ was 26.01 kcal/mole. From the above facts, at around the temperature of 200.deg. C-240.deg. C and 280.deg. C-320.deg. C, the creep deformation for Al 7075 alloy seemed to be controlled by dislocation climb but at 90.deg. C, by cross slip over the range of experimental stress conditions.tions.

The Characteristics of Creep for Dispersion Strengthened Copper (분산강화 동합금의 Creep 특성)

  • Park, K.C.;Kim, G.H.;Mun, J.Y.;Choi, J.H.
    • Journal of the Korean Society for Heat Treatment
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    • v.14 no.4
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    • pp.220-227
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    • 2001
  • The static creep behaviors of dispersion strengthened copper GlidCop were investigated over the temperature range of $650{\sim}690^{\circ}C$ (0.7Tm) and the stress range of 40~55 MPa (4.077~5.61 $kg/mm^2$). The stress exponents for the static creep deformation of this alloy was 8.42, 9.01, 9.25, 9.66 at the temperature of 690, 677, 663, and $650^{\circ}C$, respectively. The stress exponent, (n) increased with decreasing the temperature and became dose to 10. The apparent activation energy for the static creep deformation, (Q) was 374.79, 368.06, 361.83, and 357.61 kg/mole for the stress of 40, 45, 50, and 55 MPa, respectively. The activation energy (Q) decreased with increasing the stress and was higher than that of self diffusion of Cu in the dispersion strengthened copper. In results, it can be concluded that the static creep deformation for dispersion strengthened copper was controlled by the dislocation climb over the ranges of the experimental conditions. Larson-Miller parameter (P) for the crept specimens for dispersion strengthened copper under the static creep conditions was obtained as P=(T+460)(logtr+23). The failure plane observed for SEM slightly showed up transgranular at that experimental range, however, universally it was dominated by characteristic of the intergranular fracture.

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Effects of Ni Concentration on Residual Stress in Electrodeposited Ni Thin Film for 63Ni Sealed Source (63Ni 밀봉선원용 Ni 전기도금 박막에서 Ni 농도가 잔류응력에 미치는 영향)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of the Korean institute of surface engineering
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    • v.50 no.1
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    • pp.29-34
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    • 2017
  • Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of $Ni^{2+}$ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface morphology and microstructure of Ni films were studied. In the case of $0.2M\;Ni^{2+}$ concentration, current efficiency was decreased to about 65 % with increasing saccharin concentration, but, in the case of $0.7M\;Ni^{2+}$ concentration, it was shown more than 90 % with the increase of saccharin concentration. Residual stress of Ni thin film was appeared to be about 400 MPa up to 0.0244 M saccharin concentration at the $0.2M\;Ni^{2+}$ concentration and surface morphology with severe cracks was observed in the range of 0.0487~0.0975 M saccharin concentration. Residual stress of Ni thin films was measured to be about 750 MPa without saccharin addition and 114~148 MPa at the range of 0.0097~0.0975 M saccharin concentration for the $0.7M\;Ni^{2+}$ concentration. Relatively low residual stress values (114~148 MPa) of the Ni films at the range of 0.0097~0.0975 M saccharin concentration may be resulted from codeposition of S from saccharin. Ni films at $0.7M\;Ni^{2+}$ concentration showed smooth surface morphology and were independent of saccharin concentration. Ni films at $0.7M\;Ni^{2+}$ concentration consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks and the intensities of FCC(111) and FCC(200) peaks increased with increasing saccharin concentration. Also, the average grain size decreased with increasing saccharin concentration from about 30 nm to about 15 nm.