• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korea Computer Industry Society
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• v.2 no.9
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• pp.1147-1154
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• 2001

In this paper, we make plans for facilities, the 8-VSB DTV transmission system, installed in the near future, based on presently NTSC TV operating it. First of all we estimate transmission power for analog NTSC, digital 8-VSB terrestrial broadcasting and the effective condition of optimal receiving power result from it. It's also to estimate optimal receiving condition by using Longley-Rice's Field Strength calculating method that is to guess a profile between transmitting station and many receiving points. The 8-VSB DTV Propagation aims to high-speed transmission rates of 19.39Mbps datum to enable HDTV(High Definition Television) at NTSC 6MHz bandwidth. First of all, an optimization of field strength between transmission station and receiver must deal with considerable. Because of these reasons, 8-VSB DTV transmission needs effective extension for NTSC TV service coverage. Finally we present the transmitting output that is expected in changing NTSC VHF to DTV UHF for maintaining the transmitting output of NTSC TV that is equal to 8-VSB DTV in service coverage.

• Journal of Satellite, Information and Communications
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• v.11 no.2
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• pp.23-28
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• 2016

In this paper, we proposed the novel algorithm which controls the resolution of the HDMI(High Definition Multimedia Interface) by the channel estimation from WiFi-AP(Access Point) in the ISM(Industry-Science-Medical) band. The 2.4 and 5 GHz channel models are widely used since they have identical RF property as RSSI(Received Signal Strength Indication). Especially, the performance degradation of signal-transmission and streaming of WiFi will be occurred by the co-channel interference between AP(Access Point) and increased number of smart devices. Therefore, the optimization scheme of video format timing was designed by HDMI-CEC(Consumer Electronics Control) which considers the transmission speed of radio channel. The HDMI resolution, video quality of home-gateway and digital TV and the decision of PIP position can be maintained by the protocols between smart devices and DLNA(Digital Living Network Alliance) via proposed technique.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.24-30
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• 2013

Today, the modification of carbon foam for high performance remains a major issue in the environment and energy industries. One promising way to solve this problem is the optimization of the pore structure for desired properties as well as for efficient performance. In this study, using a sol-gel process followed by carbonization in an inert atmosphere, hollow spherical carbon foam was prepared using resorcinol and formaldehyde precursors catalyzed by 4-aminobenzoic acid; the effect of carbonization temperature and re-immersion treatment on the pore structure and characteristics of the hollow spherical carbon foam was investigated. As the carbonization temperature increased, the porosity and average pore diameter were found to decrease but the compression strength and electrical conductivity dramatically increased in the temperature range of this study ($700^{\circ}C$ to $850^{\circ}C$). The significant differences of X-ray diffraction patterns obtained from the carbon foams carbonized under different temperatures implied that the degree of crystallinity greatly affects the characteristics of the carbon form. Also, the number of re-impregnations of carbon form in the resorcinol-formaldehyde resin was varied from 1 to 10 times, followed by re-carbonization at $800^{\circ}C$ for 2 hours under argon gas flow. As the number of re-immersion treatments increased, the porosity decreased while the compression strength improved by about four times when re-impregnation was repeated 10 times. These results imply the possibility of customizing the characteristics of carbon foam by controlling the carbonization and re-immersion conditions.

• Journal of the Korean Institute of Gas
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• v.12 no.3
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• pp.24-30
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• 2008

In this paper, the stress and strain characteristics of a helmet shell structure have been analyzed by using the finite element method and Taguchi's design method as functions of the material properties, the thickness of a helmet, the thickness and the number of a bead frame. The optimized design of the helmets for a firefighter and a gas worker is very important for increasing the strength safety and an impact energy absorption capacity of a helmet shell due to an impulsive external force. Thus, the optimized design data of the helmet indicated that the uniform thickness of a helmet shell may be reduced for reducing the total weight of a helmet and increasing the strain energy absorption rate, but the thickness and the number of a bead frame would be increased for increasing the impact strength of the helmet.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.9
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• pp.4462-4466
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• 2013

In optical system, the signal and additive noise for statistical properties of a variety of ways to evaluate the performance of the system is essential for the optimization. In this paper, performance analysis of spectrum-sliced optical system in the optical pre-amplifier in the receiver the received signal by including the error limits for the bit that is, the bit error rate (BER: Bit Error Rate) required to maintain the average optical power represents the number of photons per bit is included in this paper to digital form, noticeable signal the receiver to calculate the sensitivity of the method for the calculation was performed. The general strength of the transmission of the modulated signal and digital signal transmission was required for the comparison of optical power. As shown in Figure 3, the general strength of the digital signal transmission system for transmitting a modulated signal compared with the case is improved by at least 10dB.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of the Korea Institute of Military Science and Technology
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• v.22 no.3
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• pp.299-310
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• 2019

Increase of combat capability through the lightweighting of vehicles has been internationally issued. One of the methods for lightening is applying high hardness armor(HHA) steel which is outstanding ballistic performance and protection performance compared to weight. Development of HHA steel is currently completed in America, United Kingdom, Australia and Germany. It is used for not only combat vehicle, but also various combat device. Korea is developing new material of HHA steel according to this trend. When such HHA steel is applied to structure, welding process is used for connection of the structure. Cracks from hydrogen embrittlement and cold cracking are easily generated in welds of HHA steel and it greatly affects the strength of all structure. Decrease of strength from welding defect is critical to combat capability. Therefore, welding process optimization is important for performing the role of structure. In this study, international welding technology is reviewed through scientific research paper and patent.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.45-49
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• 2019

Herein we developed the hot extrusion technology to prepare n-type Bi-Te-Se-based thermoelectric materials with high reliability. Starting ingot was fabricated via melt-solidification process, then pulverized it into powders (${\sim}30{\mu}m$) by using high energy ball milling. By optimization of mold design and temperature-pressure conditions for hot extrusion, dense extrudate of 1.8 mm in diameter with high 00l orientation could be obtained from disc-shape compacted powders (20 mm in diameter). High power factor ${\sim}4.1mW/mK^2$ and enhanced mechanical strength ~50 MPa were simultaneously observed at 300 K.