• Corrosion Science and Technology
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• v.6 no.1
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• pp.29-32
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• 2007

The final goal of this study is to develop the core technologies applicable to the design, operation and maintenance of welds in nuclear structures. This study includes predicting microstructure changes and residual stress for welded parts of nuclear power plant components. Furthermore, researches are performed on evaluating fatigue, corrosion, and hydrogen induced cracking and finally constructs systematically integrated evaluation system for structural integrity of nuclear welded structures. In this study, metallurgical and mechanical approaches have been effectively coordinated considering real welding phenomena in the fields of welds properties such as microstructure, composition and residual stress, and in the fields of damage evaluations such as fatigue, corrosion, fatigue crack propagation, and stress corrosion cracking. Evaluation techniques tried in this study can be much economical and effective in that it uses theoretical/semi-empirical but includes many additional parameters that can be introduced in real phenomena such as phase transformation, strength mismatch and residual stress. It is clear that residual stress makes great contribution to fatigue and stress corrosion cracking. Therefore the mitigation techniques have been approached by reducing the residual stress of selected parts resulting in successful conclusions.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.3
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• pp.273-279
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• 2011

The yield strength of particle-reinforced composites increases as the size of the particle decreases. This kind of length scale has been mainly attributed to the geometrically necessary dislocation punched around the particle as a result of the mismatch of the thermal expansion coefficients of the particle and the matrix when the composites are cooled down after consolidation. In this study, two dislocation-punching theories that can be used in continuum structural modeling are assessed numerically. The two theories, presented by Shibata et al. and Dunand and Mortensen, calculate the size of the dislocationpunched zone. The composite yield strengths predicted by finite element analysis were qualitatively compared with experimental results. When the size of the particle is less than $2{\mu}m$, the patterns of the composite strength are quite different. The results obtained by Shibata et al. are in qualitatively better agreement with the experimental results.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.6
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• pp.39-44
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• 2005

Due to mismatch of thermal expansion coefficients between aluminum sheet and glass/epoxy sheet, thermal residual stresses generally appear in the FML. These stresses will affect the yield and fatigue strength of the FML. The numerically determined residual stresses in the Fiber-Metal-Laminates(FML) have been compared to the residual stresses measured from the curvature and tensile test methods. These two experimental methods have been developed for assessing the influence of residual stress in FML. Post-stretching process has been applied to remove the thermal residual stress and reverse the stress distribution. After post-stretching process, the residual stress has been measured from experiments. The results obtained show that analytical and experimental data are well agreed. The thermal residual stress can be removed by post-stretching process and it will increase the yield strength of FML.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.745-751
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• 2011

This study proposes finite element modeling of dislocation punching at cooling after consolidation in order to calculate the strength of particle-reinforced aluminum composites. The Taylor dislocation model combined with strain gradient plasticity around the reinforced particle is adopted to take into account the size-dependency of different volume fractions of the particle. The strain gradients were obtained from the equivalent plastic strain calculated during the cooling of the spherical unit cell, when the dislocation punching due to CTE (Coefficient of Thermal Expansion) mismatch is activated. The enhanced yield stress was observed by including the strain gradients, in an average sense, over the punched zone. The tensile strength of the SiCp/Al 356-T6 composite was predicted through the finite element analysis of an axisymmetric unit cell for various sizes and volume fractions of the particle. The predicted strengths were found to be in good agreement with the experimental data. Further, the particle-size dependency was clearly established.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.1
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• pp.45-52
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• 2002

It has been known that tensile residual stresses occurring by the thermal expansion coefficient mismatch between fiber and matrix is a cause of the weak strength of metal matrix composites(MMCs). In order to solve this problem, TiNi alloy fiber was used as a reinforced material in TiNi/A16001 shape memory alloy composite in this study. TiNi alloy fiber improves the tensile strength of the composite by causing compressive residual stress in matrix on the basis of its shape memory effect. Pre-strain was imposed to generate the compressive residual stresses inside the TiNi/A16001 shape memory alloy composites. AE technique was used to quantify the microscopic damage behavior of the composite at high temperature. The effect of applied pre-strains on the AE behavior was also evaluated.

• Journal of the Korean Society for Nondestructive Testing
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• v.17 no.2
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• pp.89-99
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• 1997

Although discontinuously reinforced metal matrix composite(MMC) is one of the most promising materials for applications of aerospace, automotive industries, the thermal residual stresses developed in the MMC due to the mismatch in coefficients of thermal expansion between the matrix and the fiber under a temperature change has been pointed out as one of the serious problem in practical applications. There are very limited nondestructive techniques to measure the residual stress of composite materials. However, many difficulties have been reported in their applications. Therefore it is important to establish analytical model to evaluate the thermal residual stress of MMC for practical engineering application. In this study, an elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two-dimensional in-plane fiber misorientation. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. This model is more general than past models to investigate the effect of parameters which might influence thermal residual stress in composites. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for in-plane fiber misorientation. Fiber volume fraction, aspect ratio, and distribution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distribution type for in-plane misorientation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.67-72
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• 2010

The fracture toughness for the LBB analysis of piping is generally determined by the J-integral according to ASTM E1820. However, since this evaluates a base metal, the fracture toughness for narrow gap welding can be differently than the real value. This study evaluated the plastic  factor of the narrow gap welding part of a nuclear piping with SA508 Cl.1a and SA312 TP316. Also, it performed the fracture toughness test for the narrow gap welding part and applied the new plastic $\eta$ factor equation by Huh, et al. and then compared the results with those according with the ASTM standard.