• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.333-342
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• 2004

Tensile and low cycle fatigue (LCF) tests on prior cold worked 316L stainless steel were carried out at various temperatures from room temperature to 650$^{\circ}C$. At all test temperatures, cold worked material showed the tendency of higher strength and lower ductility compared with those of solution treated material. The embrittlement of material occurred in the temperature region from 300$^{\circ}C$ to 600$^{\circ}C$ due to dynamic strain aging. Following initial cyclic hardening for a few cycles, cycling softening was observed to dominate until failure occurred during LCF deformation, and the cyclic softening behavior strongly depended on temperature and strain amplitude. Non-Masing behavior was observed at all test temperatures and hysteresis energy curve method was employed to describe the stress-strain hysteresis loops at half$.$life. The prediction shows a good agreement with the experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Korean Recycled Construction Resources Institute
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• v.2 no.4
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• pp.354-359
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• 2014

The objective of this study is to examine the fatigue behavior in compression of normal-weight and lightweight concrete mixtures with high volume supplementary cementitious material(SCM). The selected binder composition was 30% ordinary portland cement, 20% fly-ash, and 50% ground granulated blast-furnace slag. The targeted compressive strength of concrete was 40 MPa. For the cyclic loading, the constant maximum stress level varied to be 75%, 80%, and 90% of the static uniaxial compressive strength, whereas the constant minimum stress level was fixed at 10% of the static strength. The test results showed that fatigue life of high volume SCM lightweight concrete was lower than the companion normalweight concrete. The value of the fatigue strain at the maximum stress level intersected the descending branch of the monotonic stress-strain curve after approximately 90% of the fatigue life.

• Aerospace Engineering and Technology
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• v.13 no.1
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• pp.10-19
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• 2014

We designed bearingless rotor hub system which replace mechanical hinge/bearing with composite beam component and conducted fatigue analysis for flexbeam and torque tube. Extension/bending/torsional stiffness was calculated from 2D section analysis using VABS and 2D section structure analysis was applied for strain calculation. S-N curve of each composite material was generated using Wohler equation and fatigue analysis was conducted on weakness section which was decided from static structure analysis. CAMRAD II was used for load analysis and load analysis result was applied HELIX/FELIX standard load spectrum to generate bearingless rotor system load spectrum which was used fatigue safe life analysis.

• Journal of Pharmacopuncture
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• v.19 no.1
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• pp.45-50
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• 2016

Objectives: The purpose of this study was to investigate the antifungal effect of bee venom (BV) and sweet bee venom (SBV) against Candida albicans (C. albicans) clinical isolates. Methods: In this study, BV and SBV were examined for antifungal activities against the Korean Collection for Type Cultures (KCTC) strain and 10 clinical isolates of C. albicans. The disk diffusion method was used to measure the antifungal activity and minimum inhibitory concentration (MIC) assays were performed by using a broth microdilution method. Also, a killing curve assay was conducted to investigate the kinetics of the anti-fungal action. Results: BV and SBV showed antifungal activity against 10 clinical isolates of C. albicans that were cultured from blood and the vagina by using disk diffusion method. The MIC values obtained for clinical isolates by using the broth microdilution method varied from $62.5{\mu}g/mL$ to $125{\mu}g/mL$ for BV and from $15.63{\mu}g/mL$ to $62.5{\mu}g/mL$ for SBV. In the killing-curve assay, SBV behaved as amphotericin B, which was used as positive control, did. The antifungal efficacy of SBV was much higher than that of BV. Conclusion: BV and SBV showed antifungal activity against C. albicans clinical strains that were isolated from blood and the vagina. Especially, SBV might be a candidate for a new antifungal agent against C. albicans clinical isolates.

• Journal of Aerospace System Engineering
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• v.1 no.2
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• pp.27-36
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• 2007

The Damage Tolerant Design is developed to help alleviate structural failure and cracking problems in aerospace structures. Recently, the Damage Tolerant Design is required and recommended for most of aircraft design. In this paper, the damage tolerant design is applied to tilt rotor UAV. First of all, the fatigue load spectrum for the tilt rotor UAV is developed and fatigue analysis is performed for the flaperon joint which has FCL (fatigue critical location). Tilt rotor UAV has two modes: helicopter mode when UAV is taking off and landing; fixed wing mode when the tilt rotor UAV is cruising. To make fatigue load spectrum, FELIX is used for helicopter mode. TWIST is used for fixed wing mode. Fatigue analysis of flaperon joint is performed using fatigue load spectrum. E-N curve approach is used for picking crack initiation point. The LEFM(Linear Elastic Fracture Method) is considered for analyzing crack growth or propagation. Finally, including the crack initiation and propagation, the fatigue life is evaluated. Therefore the Damage Tolerant Design can be done.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.61-68
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• 2002

Thermal shock testing was used to evaluate reliability that appeared in the solder joints of electronic devices when they were subjected to thermal cycling. Recently, mobile devices have come smaller and multi-functional, with the increasing need for high-density packaging, BGA or CSP has become the main trend for surface mounting technology, and therefore mechanical stress life for solder joints in BGA/CSP type packages has required. Reliability of BGA/CSP solder joints was evaluated with electric resistivity change of daisy chain pattern and stress-strain curve measured using strain gage attached on the surface of PCB under mechanical impact loading. In this report, applications of PCB Universal Testing Machine we have developed and experimental datum of SONY estimating dynamic behavior of mechanical stress in BGA/CSP solder joints are introduced.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.4
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• pp.477-486
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• 1986

본 연구에서는 SM20C를 모재로 하여 입경의 크기가 다른 3종의 복합조직강을 제작 동일한 분위기에서 저 및 고사이클 전영역에 걸쳐 피로특성을 검토하고져 한다. 제일보는 그 중 저사이클특성에 대한 보고이다. 일반적으로 저사이클 피로현상은 재 료가 탄소성 상태하에서 전위, 미소크랙, 보이드(void) 등의 인자가 복합적으로 작용 하여 발생함으로 변형률속도, 제어파형, 온도, 시험방법 및 분위기에 따라 많은 영향 을 받는다. 따라서 본 연구에서는 두가지 실험방법을 사용, 응력-변형율거동을 검토 복합조직강의 피로특성과 입경크기가 피로거동 및 강도에 미치는 영향을 비교 고찰하 였다.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.4
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• pp.437-442
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• 2014

The equipment or with a constant torque and a variable stress due to axial vibration such as the turbine-generator system in nuclear power plant show the fatigue fracture behavior. Thus this study whoul aim to measure the torsional stress and analyze the fatigue fracture behavior. To achieve this, we manufactured the equipment similar with turbine-generator system and applied various torsional vibration stress due to external load. In particular, the evaluation was conducted with the existing evaluation methods of the fatigue behavior of known stress-life, strain-life, crack growth assessment methods. With increasing the external load and independent methods tends to decrease the fatigue life was confirmed up to 10 times in 5 kV external load compared to without external load.