• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2550-2552
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• 1998

The stiction phenomena poses a design constraint in surface micromachining by reducing the releasable size of the microstructure. This problem occurs during the fabrication process of surface micromachined microstructures during the wet etch of sacrificial layers. For the prevention of the sticking problem, the microsctructure is released by sublimation after the substitution of the sacrificial layer etchant with a sublimation material heated above its melting temperature. In the sublimation drying method, the sublimation materials such as p-dichlorobenzene, t-butyl alcohol, and cyclohexane are used. In this paper, a method for designing a sublimation drying system is developed, and its performance is experimentally evaluated.

• 전기학회논문지
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• 제66권6호
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• pp.962-967
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• 2017

The Diamond-Like-Carbon (DLC) coating is a new carbon-based amorphous material. Carbon ions in the plasma are electrically accelerated and collide with the substrate to form a thin film. This film has similar properties to diamonds such as high surface hardness, low coefficient of friction, corrosion resistance and durability that do not react with acids and bases. Also, since there is no thermal deformation, it can be printed at room temperature. and coated on almost all materials such as paper, polymer, ceramics and various metals even aspheric lens it is possible to mirror surface coating with excellent surface roughness. In this paper, we have analyzed the DLC film formed by Filtered Arc Ion Plating (Filtered AIP) process.

• Tribology and Lubricants
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• 제17권4호
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• pp.312-320
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• 2001

In magnetic hard disk drives, higher areal recording density requires reduction of head-disk spacing. To overcome the increase of stiction associated with reduction of head-disk spacing, a padder slider, which adds pads to slider's air bearing surface, can be one of the practical solution for sub 20 nm flying height, and even for near contact recording. This study investigated the tribological characteristics of a padder slider. A padder slider took off slowly but showed less friction force than a normal slider. The hot/dry CSS test and drag test indicated that pad wear of a padder slider was negligible. The tribological performance of disk is an important factor to be considered. In particular, less carbon overcoat layer of the disk will result in higher stiction and wear in slider/disk interface. In conclusion, a padder slider shows encouraging tribological performances for practical use in HDD.

• 한국재료학회지
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• 제15권3호
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• pp.149-154
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• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• 한국재료학회지
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• 제15권11호
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• pp.705-710
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• 2005

NIL (nanoimprint lithography) technique has demonstrated a high potential for wafer size definition of nanometer as well as micrometer size patterns. During the replication process by NIL, the stiction between the stamp and the polymer is one of major problems. This stiction problem is moi·e important in small sized patterns. An antistiction layer prevents this stiction ana insures a clean demolding process. In this paper, we were using a TCP (transfer coupled plasma) equipment and $C_4F_8$ as a precursor to make a Teflon-like antistiction layer. This antistiction layer was deposited on a 6 inch silicon wafer to have nanometer scale thicknesses. The thickness of deposited antistiction layer was measured by ellipsometry. To optimize the process factor such as table height (TH), substrate temperature (ST), working pressure (WP) and plasma power (PP), we were using a design of experimental (DOE) method. The table of full factorial arrays was set by the 4 factors and 2 levels. Using this table, experiments were organized to achieve 2 responses such as deposition rate and non-uniformity. It was investigated that the main effects and interaction effects between parameters. Deposition rate was in proportion to table height, working pressure and plasma power. Non-uniformity was in proportion to substrate temperature and working pressure. Using a response optimization, we were able to get the optimized deposition condition at desired deposition rate and an experimental deposition rate showed similar results.

• 대한전자공학회논문지SD
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• 제37권6호
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• pp.9-16
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• 2000

본 논문은 다결정실리콘의 점착방지를 위한 새로운 화학적 방법에 의한 코팅방법을 제시하였고 그 특성을 확인하였다. 이 코팅방법은 최근에 사용되어지고 있는 Octadecyltrichlorosilane (OTS) 나 1H,1H2H,2H-perfluorodecyltrichlorosilane (FDTS) 같은 Monoalkyltrichlorosilanes (MTS, $RSiCl_3$) 계열의 물질 대신에 Dialkyldichlorosilanes (DDS, $R2SiCl_2$) 계열의 물질을 이용하여 다결정실리콘의 표면을 바꾸는 방법이다. 이 DDS 계열의 화학물질 중에서 Dichlorodimethylsilane (DDMS, $(CH_3)2SiCl_2$)는 쉽게 구할 수 있고 다결정실리콘의 표면을 친수성에서 소수성으로 간단하고 빠른 방법으로 바꿀 수 있는 장점이 있다. 본 논문에서는 DDMS 코팅된 다결정실리콘으로 만들어진 외팔보를 3 mm길이까지 제작하여 점착현상이 전혀 일어나지 않았음을 확인하였고 이를 실제 구조물에 적용하였다.

• 대한기계학회논문집B
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• 제24권8호
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• pp.1056-1061
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• 2000

Particles existing in a hard disk drive are known as a major source of TA(thermal asperity). Researchers have investigated how particles induce the TA phenomena, but have not verified yet the reason why and how particles are generated in a HDD. The objective of this study is to investigate why and how particles are generated, and in what condition, the largest number of particles is generated. The number of particles generated in a HDD was measured over the landing zone after various rest times of slider and during various motions and positions of slider. It is found that the large number of particles was generated when the HDD was turned on after a long rest time of slider and that a few of particles were continuously generated when the slider flied over the disk surface. It is thought that the number of particles generated in a HDD was related to the rest time of slider because the rest time of slider increased stiction, and that there were intermittent contacts between the slider and the disk surface when the slider flied over the disk surface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.187-188
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• 2005

In this paper, big free standing metal structures for electrostatic MEMS switches are easily fabricated using photoresist sacrificial layer. The entire process sequence, through the removal of the sacrificial layer, is kept below 150 $^{\circ}C$ to avoid curing problem of photoresist sacrificial layer. Metal structure is fabricated by thermal evaporator and a self test electrode is fabricated underlying metal suspended structure for testing by electrostatic force. The new wet release process is considered using methanol rinse, general wet release process cause stiction problem by capillary force during drying, and the yield is dramatically improved than previous wet release process using DI water rinse. The fabrication becomes much simpler and cheaper with use of a photoresist sacrificial layer.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1996년도 춘계학술발표회논문집(1)
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• pp.425-432
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• 1996

Integrated performance test of Chemical and Volume Control System (CVCS) was successfully performed in 1994. However, an extensive effort to correct hardware and software problems in the letdown line was required mainly due to the lack of adequate simulation code to predict the test accurately. Although the LTC computer code was used during the YGN 3'||'&'||'4 NSSS design process, the code can not satisfactorily predict the test due to its insufficient letdown line modeling. This study developed a numerical model to simulate the letdown test by modifying the current LTC code, and then verified the model by comparing with the test data. The comparison shows that the modified LTC computer code can predict the transient behavior of letdown system tests very well. Especially, the model was verified to be able to predict the "Stiction" phenomena which caused instantaneous fluctuations in the letdown backpressure and flowrate. Therefore, it is concluded that the modified LTC computer code with the ability of calculating the "Stiction" phenomena wi11 be very useful for future plant desist and test predictions.predictions.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.41-46
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• 2017

This study aims to select suitable co-solvents and to obtain optimal process conditions in order to improve process efficiency and productivity through experimental results obtained under various experimental conditions for the etching and rinsing process using liquid carbon dioxide and supercritical carbon dioxide. Acetone was confirmed to be effective through basic experiments and used as the etching solution for MEMS-wafer etching in this study. In the case of using liquid carbon dioxide as the solvent and acetone as the etching solution, these two components were not mixed well and showed a phase separation. Liquid carbon dioxide in the lower layer interfered with contact between acetone and Mems-wafer during etching, and the results after rinsing and drying were not good. Based on the results obtained under various experimental conditions, the optimum process for treating MEMS-wafer using supercritical CO2 as the solvent, acetone as the etching solution, and methanol as the rinsing solution was set up, and MEMS-wafer without stiction can be obtained by continuous etching, rinsing and drying process. In addition, the amount of the etching solution (acetone) and the cleaning liquid (methanol) compared to the initial experimental values can be greatly reduced through optimization of process conditions.