• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2010년도 춘계학술대회
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• pp.253-258
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• 2010

The paper reviews the methodologies of confirmatory data analysis(CDA) and exploratory data analysis(EDA) in statistical quality control(SQC), design of experiment(DOE) and reliability engineering(RE). The study discusses the properties of flexibility, openness, resistance and reexpression for EDA.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.43-44
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image is desired. But SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination. Based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factional design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• Journal of information and communication convergence engineering
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• 제3권4호
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• pp.191-194
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• 2005

SU-8 is a epoxy based photoresist designed for MEMS applications, where a thick, chemically and thermally stable image are desired. However SU-8 has proven to be very sensitive to variation in processing variables and hence difficult to use in the fabrication of useful structures. In this paper, negative SU-8 photoresist processed has been characterized in terms of delamination, based on a full factorial designed experiment. Employing the design of experiment (DOE), a process parameter is established, and analyzing of full factorial design is generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• 공업화학
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• 제31권2호
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• pp.138-146
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• 2020

통계학적 실험계획법(DOE)은 수십 년 동안 산업계에서 품질을 개선하기 위해 사용되어온 방법이다. 본 연구에서는 화학공학 분야에서 통계적 실험계획법이 적용된 사례 115건을 검토해 보았다. 모든 사례는 지난 10년간 주요 과학저널에 발표된 내용이다. 적용되는 설계 유형, 실험 규모, 반응 변수에 영향을 미치는 요인 및 수준의 수 및 적용 분야가 분석되었다. 무엇보다 통계학적 실험계획법에 관련된 연구논문이 점차 증가하는 것을 알 수 있었다.

• 한국전기전자재료학회논문지
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• 제18권1호
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• pp.24-29
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• 2005

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.711-714
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• 2004

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. However, it still has various problems to the CMP equipment, in particular, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the interaction between the various parameters such as turntable and head speed, down force and back pressure during CMP. Using statistical analysis techniques, a better understanding of the interaction behavior between the various parameters and the effect on removal rate, no-uniformity and ETC (edge to center) is achieved.

• 한국지하수토양환경학회지:지하수토양환경
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• 제12권5호
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• pp.73-85
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• 2007

본 연구에서는 액상에서 EGBE, DGBE, DBM, TGME의 효율적인 분석을 위해 이용되던 액상추출법을 대신할 수 있는 방법으로 GC/FID를 이용한 SPME법 실험 연구를 진행하였다. 그리고 실험계획법(DOE)을 사용하여 EGBE를 포함한 디젤첨가제 미량분석의 최적조건을 설명하였다. 실험은 통계분석결과 뿐만 아니라 요인 수의 최적화에 따른 중심합성설계에 의한 완전요인 설계법을 사용하였다. 반응표면분석은 추출 효율이 주 영향인 염농도, 흡착 온도, 흡착 시간과 sonication 시간에 따른 2차 다항식에 의해 설명될 수 있음을 보여주었다. 실험계획법(DOE)을 사용하는 것은 액상 시료에서 디젤첨가제의 정량분석을 개선하는 자료분석법이 될 것이다.

• 한국표면공학회지
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• 제40권4호
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• pp.165-169
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• 2007

Compared to conventional Indium Tin Oxide (ITO) film deposition methods, cesium (Cs) assisted sputtering offers higher film characteristics in terms of electrical, mechanical and optical properties. However, it showed highly non-linear characteristics between process input factors and equipment responses. Therefore, to maximize film quality, optimization of manufacturing process is essential and process characterization is the first step for process optimization. For this, we designed 2 level design of experiment (DOE) to analyze ITO film characteristics including film thickness, resistivity and transmittance. DC power, pressure, carrier flow, Cs temperature and substrate temperature were selected for process input variables. Through statistical effect analysis methods, relation between three types of ITO film characteristics and five kinds of process inputs are successfully characterized and eventually, it can be used to optimize Cs assisted sputtering processes for various types of film deposition.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2010년도 추계학술대회
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• pp.539-550
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• 2010

The study presents the application strategy and understanding of regression analysis with GLM(Generalized Linear Model) unifying with other statistical techniques such as correlation analysis and design of experiment(DOE). The quidelines proposed in this paper can be used for practioners to implement GLM and ANOVA(Analysis of Variance) for the DMAIC 5 steps of six sigma breakthrough.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.235-236
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• 2009