• Title/Summary/Keyword: Stack mold

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Development of 2 Level × 4 Cavity Stack Mold for Plastic Container (플라스틱 용기 성형을 위한 스택금형 제작에 관한 연구)

  • Jung, Woo-Chul;Heo, Young-Moo;Shin, Kwang-Ho;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.1 no.1
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    • pp.33-37
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    • 2007
  • In recent, the demand of high-productivity injection mold increases because of the growth of international packaging market. The increase of productivity leads to the large-sized injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the existing machine and device is studied in advanced countries actively. In this study, as the preliminary research of stack mold development, the stack mold which has 2 Level ${\times}4$ Cavity is designed and manufactured. Besides, the motion and structural analysis are executed to verify the stability of developed stack mold.

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Development of 2-level Stack Mold for Functional Packaging (기능성 용기 2-level 스택 금형 개발)

  • Shin J.S.;Hwang S.H.;Kim Y.J.;Jung K.J.;Heo Y.M.;Yoon G.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.575-576
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    • 2006
  • Recently, the demand of high-productivity injection mold increases since the consumption of packaging grows in the world. Stack mold is composed of more than two molds and it has very high productivity and economic efficiency. In advanced country, stack mold which has $4Level{\times}96cavity$ was developed already but, in occasion of domestic mold industry, there is no study of stack mold. In this study, stack mold which has $2Level{\times}4cavity$ is developed for securing the technique of manufacturing high-productivity mold.

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Development of large-capacity stack mold for the high-performance household case (고기능성 생활용기 성형을 위한 대용량 스택금형 개발)

  • Shin, Jang-Soon;Kim, Eu-Jin;Jung, Gui-Jae;Hwang, Soon-Hwan;Heo, Young-Moo;Yoon, Gil-Sang;Jung, Woo-Chul;Seo, Tae-Il
    • Design & Manufacturing
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    • v.2 no.3
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    • pp.28-31
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    • 2008
  • In recent, the demand of high-productivity injection mold is increased because of the growth of international packaging market which is induced by an increase of population. The increase of productivity leads to the large-capacity injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the exsiting machine and device has researched in advanced countries actively. In this paper, as the preliminary research of stack mold development, the stack mold which has 2 level ${\times}4$ cavity was designed and fabricated. Besides, the motion and structural analysis were performed to verify the stability of developed stack mold.

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A Study on Filling Balance of Semi-stack Mold for Molding Simultaneously Different Products (이종제품 동시성형을 위한 세미스택 몰드의 균형충전에 관한 연구)

  • Lee, Hui-Chul;Lee, Hee-Jin;Kim, Kyung-Ho;Hwang, Jae-Young;Kim, Young-Sik;Ryu, Ho-Yeun
    • Design & Manufacturing
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    • v.8 no.2
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    • pp.50-55
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    • 2014
  • Recently, semi-stack mold have been developed for satisfying the various elements required in the mold industry. The mold is possible using with general-purpose injection molding machine by weight reduction through the improvement of the mold structure. In order to do that, tension core, spiral cooling system and half runner system were applied. It is effective for increased productivity and decreased of loss to the materials. However, the mold is required the filling balance in order to improve the quality and efficiency. Thus this study performed that optimum design and analysis of semi-stack mold for filling balance.

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Die and mold technology of in-mold labeling in functional packaging (기능성 생활용기 인 몰드 라벨링 금형 성형 기술)

  • Kim, Yu-Jin;Jung, Gui-Jae;Gong, Sung-Ho;Shin, Jang-Soon;Yoon, Gil-Sang;Jung, Woo-Chul;Kim, Gun-Hee;Seo, Tae-Il
    • Design & Manufacturing
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    • v.2 no.6
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    • pp.17-22
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    • 2008
  • Recently, the demand of high-productivity injection mold increases since the consumption of packaging grows in the world. Stack mold is composed of more than two molds and it has very high productivity and economic efficiency. In advanced country, stack mold which has was developed already but, in occasion of domestic mold industry, there is no study of stack mold. In this study, die and mold of in-mold labeling was developed for securing the technique of manufacturing high-productivity mold.

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Development of stack mold for weather strip injection molding of vehicle (자동차용 웨더스트립의 성형을 위한 스택몰드 개발)

  • Han, Seong-Ryeol;Jun, Seung-Kyeong;Kim, Jun-Hyeong;Jung, Yeong-Deu
    • Design & Manufacturing
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    • v.2 no.1
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    • pp.51-56
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    • 2008
  • Recently, the demand of high-productivity injection mold increases since the consumption of packaging grows in the world. Stack mold is composed of more than two molds and it has very high productivity and economic efficiency. In this study, stack mold was developed to improve productivity of vehicle fixed weather strip with TPV materials and to investigate the characteristic of injection molding using CAE.

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Effects of Mold Variable and Main Alloying Element on the Mechanical Properties of Ductile Cast Iron Poured into Shell Stack Mold (쉘 적층 주조 구상흑연주철의 기계적 성질에 미치는 주형 변수 및 주 합금 원소의 영향)

  • Kim, Hyo-Min;Kwon, Min-Young;Chun, Byung-Chul;Kwon, Do-Young;Kim, Gi-Yeob;Kwon, Hae-Wook
    • Journal of Korea Foundry Society
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    • v.40 no.2
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    • pp.25-33
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    • 2020
  • The effects of mold variable and main alloying element on the mechanical properties of ductile cast iron poured into shell stack mold were investigated. The strength and hardness of with the smaller cross-section of the diameter of 6.25mm were higher than those of 12.50mm. On the other hand, the elongation of the former was lower than that of the latter. The strength and hardness of the specimens obtained from the center layer in the 5-story stack mold were the lowest and those for other specimens were increased with increased distance from the center. The elongation of those were the highest of all. The strength and hardness of the specimens obtained from the center layer were decreased the elongation was increased with the increased number of layers. The strength and hardness were increased and the elongation was decreased roughly with the increased amounts of reaidual magnesium and carbon content added, respectively. The strength and hardness were increased and the elongation was decreased roughly with the increased amounts of silicon content added to 2.45wt% and rather decreased with that to 2.85wt%. The effect of silicon content showed the opposite tendency to those of residual magnesium and carbon content.

Mold-Flow Simulation in 3 Die Stack Chip Scale Packaging

  • Rhee Min-Woo
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.67-88
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    • 2005
  • Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

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Chip stack height measurement of semiconductor using slit beam (슬릿빔을 이용한 반도체의 칩 적층 높이 측정)

  • Shin, Gyun-Seob;Cho, Tai-Hoon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2009.10a
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    • pp.422-424
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    • 2009
  • In this paper, we studied methods that measure chip stack height using slit beam in mold equipment among semiconductor manufacture equipments. We studied two methods to improve chip stack height measurement performance. First, it is relation of camera exposure time and height measurement repeatability. Second we could improve measurement performance applying method of least mean square method for measurement error minimization about PCB(Printed Circuit Board) flexure phenomenon.

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Introduction to Plastic Injection Molds (사출성형용 금형의 기능 및 구조에 대한 고찰)

  • 허영무
    • Transactions of Materials Processing
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    • v.11 no.8
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    • pp.641-650
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    • 2002
  • For the production of complicated plastic parts in a cycle, a mold is needed.. The basic tasks of a mold are accommodation and distribution of the resin, shaping and cooling the melt and ejection of the molding. To achieve these goal a mold has several important parts and we classified types of molds. The 6 different major functions of a mold are explained and several types of molds are shown in her. I hope these explanation will help to understand injection molds for a design engineer.