• Proceedings of the Korean Magnestics Society Conference
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• 2003.12a
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• pp.167-167
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• 2003

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.161-164
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• 1999

We have fabricated the direct-coupled planar type 1st-order SQUID gradiometers. The gradiometer consists of moats or slots in SQUID loop. It is made by YBa$_2Cu_3O_7$ thin films using pulsed laser deposition method on SrTiO$_3$ single crystal and bi-crystal substrates. We have studied the effects of slots and moats in SQUID loop by measuring the voltage modulation signals under uniform field and 1st-order gradient, and the noise properties under non-shielded environment.

• 한국초전도학회:학술대회논문집
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• v.13
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• pp.70-70
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• 2003

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.242-244
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• 1987

Using the energy trapping theory and the acoustic coupling theory. the Bandpass filter(center frequency = 10.7 MHz) of the fundamental thickness mode was made from the composition of $Pb_{0.96}Sr_{0.04}(Zr_{0.53}Ti_{0.47})O_3$+ 1wt% $Fe_2O_3$. Also, in the double mode monolithic filter, It was observed that as decreasing the size of the electrodes, or shortening the gap between two electrodes, the percent frequency separation was increased. Based on these. a 10.7 MHz uniwafer filter was made having the characteristics that bandwidth was 700 KHz and the percent frequency separation was 6 [dB] and selectivity was 29 [dB], end spurious response was 24 [dB] and insertion loss was 7 [dB].

• Journal of the Microelectronics and Packaging Society
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• v.2 no.1
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• pp.69-75
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• 1995

압전세라믹스를 제조하여 발음체 소자의 두께 직경등의 칫수 변화에 따른 압전발을 체 소자의 전기적 특성 및 압전세라믹스와 금속진동판의 상관관계를 조사하고 공명용 수지 case등을 고려하여 공진 주파수에서 효율좋은 음을 발생시킬수 있는 압전발음체를 설계하였 다. 본 실험에서 사용딘 압전세라믹스 (Pb0.95Sr0.05)(Zr0.53Ti0.47)O3+0.8wt%Nb2O5의 특성은 전 기기계 결합계수(KP)가 69%이며 기계적 품질계수(Qm)은 87 비유전율은 2100 tan$\delta$는 0.016이었다. 금속진동판의 공진주파수는 사용되는 재료의 stiffness와 관계가 있고 주파수 -impedance 특성은 재질의 음속, 밀도, Young율 등에 크게 의존하였다. 주파수 대역 2.0~ 2.2khz에서 공진시키기 위한 공명체의 설계에서 압전세라믹스의 외경과 두께가 각각 14mm, 0.1mm 이고 금속진동판의 그것이 각각 20mm, 0.1mmdlfEo 공명기는 방음공의 직경이 3.0mm, cavity의 직경이 18.5mm, cavity의 높이가 4.5mm의 구조로 설계되었을때가 최적조 건이었다.

• Proceedings of the Korean Magnestics Society Conference
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• 2008.06a
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• pp.101-101
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• 2008

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.375-375
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• 2009

For many large-scale applications of high-temperature superconducting materials, large critical current density($J_c$) in high applied magnetic fields are required. A number of methods have been reported to introduce artificial pinning centers(APCs) in $YBa_2Cu_3O_{7-\delta}$(YBCO) films for enhancement of their $J_c$. We report measurements of critical current in $YBa_2Cu_3O_{7-\delta}$ films deposited by PLD on $SrTiO_3$ substrates decorated with Au nanoparticles. Au nanoparticles were synthesized on STO substrates with self assembled monolayer. Microstructural analysis of the obtained YBCO films was performed by using cross-section transmission electron microscopy(TEM). Phase and textural analysis was done using X-ray diffraction. The surface morphology and surface roughness(Ra) of the layers was measured by atomic force microscopy(AFM).

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.146-150
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• 2000

Two methods have been investigated to fabricate good quality step-edge Josephson junctions on STO, MgO, and LAO single crystal substrates. One is the annealing of substrates at 1050$^{\circ}$C in 1 atmospheric oxygen after Ar-ion milling. The other is the cleaning of step-edge by using Ar ion milling. The step-edge is characterized with atomic force microscope (AFM) images. And YBCO thin films are deposited by using pulsed laser. The I-V properties of step-edge junctions are characterized. The yield rate of step-edge junction is increased by new fabrication methods.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.415-423
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• 1996

Thin film technologies for fabricating SQUIDs involve etching and deposition procedures with the proper substrate materials and $YBa_2Cu_3O_{7-d}$ (YBCO) as the high $T_c$ superconductor. YBCO were prepared on various substrates of MgO, $SrTiO_3$, and $LaAlO_3$ by using off-axis magnetron sputtering methods and annealing in-situ. The parameters of film fabrication processes had been optimized to yield good quality films in terms of the critical temperature $T_c$ and the critical current density $J_c$. The optimized processes yielded $T_C$>90K along with $J_c$>$10_6A$$extrm{cm}^2$ at 77K and>$2\times10_7A/Cm^2$ at 5K. We fabricated step-edge type dc-SQUIDs and directly coupled magnetometers, producing step edges on MgO(100) substrates by etching with Ar-ion beam, depositing YBCO material on them, then patterning them by using ion-milling technique. Circuitizing washer-shape SQUIDs to possess a pair of step-edge junctions of 2-5$\mu$ line width with a high angle>$50^{\circ}C$ , we examined their I-V characteristics thoroughly and Shapiro steps clearly as we irradiate microwaves of 8-20 GHz frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.477-477
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• 2008

For more than three decades, the gate dielectrics in CMOS devices are $SiO_2$ because of its blocking properties of current in insulated gate FET channels. As the dimensions of feature size have been scaled down (width and the thickness is reduced down to 50 urn and 2 urn or less), gate leakage current is increased and reliability of $SiO_2$ is reduced. Many metal oxides such as $TiO_2$, $Ta_2O_4$, $SrTiO_3$, $Al_2O_3$, $HfO_2$ and $ZrO_2$ have been challenged for memory devices. These materials posses relatively high dielectric constant, but $HfO_2$ and $Al_2O_3$ did not provide sufficient advantages over $SiO_2$ or $Si_3N_4$ because of reaction with Si substrate. Recently, $HfO_2$ have been attracted attention because Hf forms the most stable oxide with the highest heat of formation. In addition, Hf can reduce the native oxide layer by creating $HfO_2$. However, new gate oxide candidates must satisfy a standard CMOS process. In order to fabricate high density memories with small feature size, the plasma etch process should be developed by well understanding and optimizing plasma behaviors. Therefore, it is necessary that the etch behavior of $HfO_2$ and plasma parameters are systematically investigated as functions of process parameters including gas mixing ratio, rf power, pressure and temperature to determine the mechanism of plasma induced damage. However, there is few studies on the the etch mechanism and the surface reactions in $BCl_3$ based plasma to etch $HfO_2$ thin films. In this work, the samples of $HfO_2$ were prepared on Si wafer with using atomic layer deposition. In our previous work, the maximum etch rate of $BCl_3$/Ar were obtained 20% $BCl_3$/ 80% Ar. Over 20% $BCl_3$ addition, the etch rate of $HfO_2$ decreased. The etching rate of $HfO_2$ and selectivity of $HfO_2$ to Si were investigated with using in inductively coupled plasma etching system (ICP) and $BCl_3/Cl_2$/Ar plasma. The change of volume densities of radical and atoms were monitored with using optical emission spectroscopy analysis (OES). The variations of components of etched surfaces for $HfO_2$ was investigated with using x-ray photo electron spectroscopy (XPS). In order to investigate the accumulation of etch by products during etch process, the exposed surface of $HfO_2$ in $BCl_3/Cl_2$/Ar plasma was compared with surface of as-doped $HfO_2$ and all the surfaces of samples were examined with field emission scanning electron microscopy and atomic force microscope (AFM).