• 한국표면공학회지
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• 제27권2호
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• pp.65-73
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• 1994

Effects of deposition parameter on the ionic conductivity and structural change of the Lithium borosili-cate solid electrolyte films, prepared by rf sputtering using 7$LI_2O-3B_2O_3-1SiO_2$ single phase target and also a mosaic target enriched with $LI_2O$, were analyzed by measuring AC impedance and IR absorption spectra for the films. Thed solid electrolyte film deposited from the single phase target exhibited very low ionic conductivi-ty of $10^{-10}{\Omega}^{-1}cm{-1}$ at room temperature, a result of low $Li^+$ ion content(7.52 at%) in the film. The $Li^+$ con-ductivity for the films deposited from the mosaic target, however, significantly increased to $10^{-7}{\Omega}^{-1}cm{-1}$ due to both an increased $Li^+$content (14.75 at %) and a structural change of the films. The increased ionic conduc-tivity of the film appears to be associated with an easiness of ionic mobility by structural change of glassy film from a some close packed network structure to a open one. These structural changes of film were found to be closely related to the increase in the peak intensity at~$960cm^{-1}$ of IR absorption spectra for the glassy films. With increasing either argon pressure from 3 to 21 mtorr or rf power from 2 to 3 W/$cm^2$, the $Li^+$ conduc-tivity for the films significantly increased to an order of $10^{-6}{\Omega}^{-1}cm{-1}$ due to an increase in openness of film structure, as confirmed by both an increase in the IR absorption peak intensity at ~$960cm^{-1}$ and a resultant reduction of activation energy for mobility of $Li^+$ ion.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.159-160
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• 2012

지난 30년 동안 플래시 메모리의 주류 역할을 하였던 부유 게이트 플래시 메모리는 40 nm 기술 노드 이하에서 셀간 간섭, 터널 산화막의 누설전류 등에 의한 오동작으로 기술적 한계를 맞게 되었다. 또한 기존의 비휘발성 메모리는 동작 시 높은 전압을 요구하므로 전력소비 측면에서도 취약한 단점이 있다. 그러나 이러한 문제점들을 기존의 Si기반의 소자기술이 아닌 새로운 재료나 공정을 통해서 해결하려는 연구가 최근 활발하게 진행되고 있다. 특히, 플래시 메모리의 중요한 구성요소의 하나인 터널 산화막은 메모리 소자의 크기가 줄어듦에 따라서 SiO2단층 구조로서는 7 nm 이하에서 stress induced leakage current (SILC), 직접 터널링 전류의 증가와 같은 많은 문제점들이 발생한다. 한편, 기존의 부유 게이트 타입의 메모리를 대신할 것으로 기대되는 전하 포획형 메모리는 쓰기/지우기 속도를 향상시킬 수 있으며 소자의 축소화에도 셀간 간섭이 일어나지 않으므로 부유 게이트 플래시 메모리를 대체할 수 있는 기술로 주목받고 있다. 특히, TBM (tunnel barrier engineered memory) 소자는 유전율이 큰 절연막을 적층하여 전계에 대한 터널 산화막의 민감도를 증가시키고, 적층된 물리적 두께의 증가에 의해 메모리의 데이터 유지 특성을 크게 개선시킬 수 있는 기술로 관심이 증가하고 있다. 본 연구에서는 Si3N4/Ta2O5를 적층시킨 staggered구조의 tunnel barrier를 제안하였고, Si기판 위에 tunnel layer로 Si3N4를 Low Pressure Chemical Vapor Deposition (LPCVD) 방법과 Ta2O5를 RF Sputtering 방법으로 각각 3/3 nm 증착한 후 e-beam evaporation을 이용하여 게이트 전극으로 Al을 150 nm 증착하여 MIS- capacitor구조의 메모리 소자를 제작하여 동작 특성을 평가하였다. 또한, Si3N4/Ta2O5 staggered tunnel barrier 형성 후의 후속 열처리에 따른 전기적 특성의 개선효과를 확인하였다.

• Current Photovoltaic Research
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• 제3권3호
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• pp.101-105
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• 2015

ZnO is gathering great interest for large square optoelectrical devices of flat panel display (FHD) and solar cell as a transparent conductive oxide (TCO). Herewith, Mg and IIIA (Al, In) co-doped ZnO films were prepared on SLG substrate using RF magnetron sputtering system. The effect of variation of atomic weight % of Mg and ZnO have been investigated. The atomic weight % Al and In are of 3% and kept constant throughout. The numbers of samples were prepared according to their different contents, which are $M_{3%}AZO_{94%}$, $M_{4%}AZO_{93%}-(MAZO)$ and $M_{3%}IZO_{94%}$, $M_{4%}IZO_{93%}-(MIZO)$ respectively. A RF power of 225 W and working pressure of 6 m Torr was used for the deposition at $300^{\circ}C$. All of the two thin film show good uniformity in field emission scanning electron microscopy image. $M_{3%}AZO_{94%}$ thin film shows overall better performance among the all. The film shows the best lowest resistivity, carrier concentration, mobility and Sheet resistance and is found to be are of $8.16{\times}10^{-4}{\Omega}cm$, $4.372{\times}10^{20}/cm^3$, $17.5cm^2/vs$ and $8.9{\Omega}/sq$ respectively. Also $M_{3%}AZO_{94%}$ thin film shows the relatively high optical band gap energy of 3.7 eV with high transmittance more than 80% in visible region required for the better solar cell performance.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1424-1426
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• 1997

저전압 구동이 가능한 교류구동형 박막전기발광소자를 구현하기 위해 높은 유전상수를 가지며 특히 광학적 굴절률이 발광박막과 유사하여 광학적 특성 개선에도 효과적인 것으로 알려져 있는 $Ta_2O_5$를 제조하였다. $Ta_2O_5$박막은 rf-magnetron sputtering방법으로 형성하였으며 기판온도, working pressure, 박막의 두께에 따른 전기적인 특성을 조사하였다. 10mTorr에서 제조된 $Ta_2O_5$박막은 $22{\sim}26$의 비유전율을 보였고, 유전손실은 $0.007{\sim}0.03(1kHz{\sim}10kHz)$의 값을 보였다. $100^{\circ}C$에서 제조된 박막의 전하저장용량은 $7.9{\mu}C/cm^2$이었다. 제조된 박막의 항복전압은 인가 전압의 극성에 의존하며, 전류특성은 기판온도와 200nm와 300nm의 두께에서는 $V^{1.95}{\sim}V^{2.35}$에 비례하는 space charge limited current특성을 보였고, 400nm에서는 Poole Frenkel특성을 보였다. 이상의 결과로 TFEL소자에 응용에 적합한 $Ta_2O_3$ 박막은 $200^{\circ}C$에서 증착되고 200nm와 300nm인 것으로 나타났으며, 제조된 MIS구조(ITO-$Ta_2O_5$-ZnS-Al)의 ACTFEL소자에서의 전도전하는 각각 $13uC/cm^2$, $8.3uC/cm^2$로 조사되었다.

• 한국수소및신에너지학회논문집
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• 제22권5호
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• pp.649-655
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• 2011

Methane direct cracking can be utilized to produce $CO_x$ and $NO_x$-free hydrogen for PEM fuel cells, oil refineries, ammonia and methanol production. We present the results of a systematic study of methane direct cracking using a mixed conducting oxide, Y-doped $BaZrO_3$ ($BaZr_{0.85}Y_{0.15}O_3$), membrane. In this paper, dense $BaZr_{0.85}Y_{0.15}O_3$ membrane with disk shape was successfully sintered at $1400^{\circ}C$ with a relative density of more 93% via addition of 1 wt% ZnO. The ($BaZr_{0.85}Y_{0.15}O_3$) membrane is covered with Pd as catalyst for methane decomposition with an DC magnetron sputtering method. Reaction temperature was $800^{\circ}C$ and high purity methane as reactant was employed to membrane side with 1.5 bar pressure. The $H_2$ produced by the reaction was transported through mixed conducting oxide membrane to the outer side. In addition, it was observed that the carbon, by-product, after methane direct cracking was deposited on the Pd/ZnO-$BaZr_{0.85}Y_{0.15}O_3$ membrane. The produced carbon has a shape of sphere and nanosheet, and a particle size of 80 to 100 nm.

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.303-308
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• 2011

The Gallium-doped ZnO(GZO) film deposited at a temperature of $200^{\circ}C$ and a pressure of 10 mtorr has an optical transmittance of 89.0% and a resistivity of $2.0\;m{\Omega}{\cdot}cm$ because of its high crystallinity. Effect of $Al_2O_3$ oxide buffer layers on the optical and electrical properties of sputtered ZnO films were intensively investigated for developing the electrodes of opto-electronic devices which demanded high optical transmittance and low resistivity. The use of $Al_2O_3$ buffer layer could increase optical transmittance of GZO film to 90.7% at a wavelength of 550 nm by controlling optical spectrum. Resistivity of deposited GZO films were much dependent on the deposition condition of $O_2/(Ar+O_2)$ flow rate ratio during the buffer layer deposition. It is considered that the $Al_2O_3$ buffer layer could increase the carrier concentration of the GZO films by doping effect of diffused Al atoms through the rough interface.

• 한국자기학회지
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• 제23권1호
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• pp.7-11
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• 2013

본 연구에서는 $TiO_2$/Co/Pd 구조의 다층박막을 마그네트론 스퍼터링으로 GaAs(100), MgO(100), MgO(111), Si(100), glass와 같은 다양한 종류의 기판에 대해 제작하여 수직 자기 이방성에 대해서 연구하였다. 산소 분압 등의 $TiO_2$ 층의 증착 조건과 기판의 종류에 따른 Co/Pd 층의 수직 자기 이방성을 측정하였다. 그 결과, $TiO_2$ 층이 5 nm 이하 일 때는 기판의 종류에 영향을 받지만, 그 이상의 두께에 대해서는 MgO(111)을 제외한 기판의 영향이 크지 않음을 확인하였고, 이는 $TiO_2$ 씨앗층의 성장조건과 계면의 거칠기, 결정방향 등과 관련이 있음을 발견하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.41-43
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• 1999

Among the feffoelectric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, SrBi$_2$Ta$_2$$O_{9}$ thin film is appropriate to memory capacitor materials for its excellent fatigue endurance. However, very few studies on etch properties of SBT thin film have been reported although dry etching is an area that demands a great deal of attention in the very large scale integrations. In this study, the a SrBi$_2$Ta$_2$$O_{9}$ thin films were etched by using magnetically enhanced inductively coupled Ar/CHF$_3$ plasma. Etch properties, such as etch rate, selectivity, and etched profile, were measured according to gas mixing ratio of CHF$_3$(Ar$_{7}$+CHF$_3$) and the other process conditions were fixed at RF power of 600 W, dc bias voltage of 150 V, chamber pressure of 10 mTorr. Maximum etch rate of SBT thin films was 1750 A77in, under CHF$_3$(Ar+CHF$_3$) of 0.1. The selectivities of SBT to Pt and PR were 1.35 and 0.94 respectively. The chemical reaction of etched surface were investigated by X-ray photoelectron spectroscopy (XPS) analysis. The Sr and Ta atoms of SBT film react with fluorine and then Sr-F and Ta-F were removed by the physical sputtering of Ar ion. The surface of etched SBT film with CHF$_3$(Ar+CHF$_3$) of 0.1 was analyzed by secondary ion mass spectrometer (SIMS). Scanning electron microscopy (SEM) was used for examination of etched profile of SBT film under CHF$_3$(Ar+CHF$_3$) of 0.1 was about 85˚.85˚.˚.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.154-157
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• 2003

$TiO_2$ thin films were fabricated by RF magnetron sputtering system at by controlling deposition times, ratios of $Ar:O_2$ partial presser ratio and substrate conditions. And the surface, cross-section morphology, microstructure, and composition ratio of the films were analyzed by FE-SEM, TEM and XPS. Besides, the optical absorption and transmittance of the $TiO_2$ films were measured by a UV-VIS-NIR Spectrophotometer, and photocatalytic properties were studied by G${\cdot}$C Analyzer & Data Analysis system. As the result, when $TiO_2$ thin film was made at deposition time of 120[min] and $Ar:O_2$ ratio of 60:40, the best structural and optical properties among many thin films could be accepted. The best results of properties were as follows: thickness; 360~370[nm), grain size; 40[nm], gap between two peak binding energy; $5.8{\pm}0.05[eV]$ ($2_{p3/2}$ peak and $2_{p1/2}$ peak of Ti was show at $458.3{\pm}0.05[eV]$ and $464.1{\pm}0.05[eV]$ respectively), binding energy; $530{\pm}0.05[eV]$, optical energy band gap; 3.4[eV].

• 센서학회지
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• 제5권3호
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• pp.87-92
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• 1996

Pb과잉인 PLT 타겟을 이용하여 MgO(100) 단결정 기판위에 고주파 마그네트론 스펏터링법으로 PLT박막을 제조하였으며, c-축 배향에 따른 물리적 및 전기적 특성을 조사하였다. PLT박막의 c-축 배향성은 제조조건에 따라 변화하며, 본 연구에서의 제조조건은 기판온도가 $640^{\circ}C$, 분위기압이 10 mTorr, $Ar/O_{2}$비가 10 및 고주파 전력밀도가 $1.7 W/cm^{2}$이었다. 이러한 조건에서 제조된 PLT 박막은 표면에서의 Pb/Ti 비가 1/2, 저항률이 $8{\times}10^{11}{\Omega}{\cdot}cm$ 및 비유전률이 110 이었다. PLT박막을 이용하여 초전형 적외선 센서를 제조하였으며, 제조된 적외선 센서의 피크 대 피크 전압은 450 mV, 신호대 잡음비는 7.2 였다.