• Title/Summary/Keyword: Sputtering Deposition

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Analysis of Ion Beam-Solid Interactions for Nano Fabrication (나노 패터닝을 위한 이온빔-고체 상호작용 분석)

  • Kim H.B.;Hobler G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.581-584
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    • 2005
  • Ion beam processing is one of the key technologies to realize mastless and resistless sub 50nm nano fabrication. Unwanted effects, however, may occur since an energetic ion can interact with a target surface in various ways. Depending on the ion energy, the interaction can be swelling, deposition, sputtering, re-deposition, implantation, damage, backscattering and nuclear reaction. Sputtering is the fundamental mechanisms in ion beam induced direct patterning. Re-deposition and backscattering are unwanted mechanisms to avoid. Therefore understanding of ion beam-solid interaction should be advanced for further ion beam related research. In this paper we simulate some important interaction mechanisms between energetic incident ions and solid surfaces and the results are compared with experimental data. The simulation results are agreed well with experimental data.

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Fabrication of the Electroluminescence Devices with Al electrode deposited by DC sputtering (DC 스퍼터링 증착에 의한 AI 전극을 갖는 전계발광소자 제작)

  • 윤석범
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.5
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    • pp.376-382
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    • 2000
  • We successfully fabricated OLED(Organic Light Emitting Diodes) with Al cathodes electrode deposited by the DC magnetron sputtering. The effects of a controlled Al cathode layer of an Indium Tin Oxide (ITO)/blended single polymer layer (PVK Bu:PBD:dye)/Al light emitting diodes are described. The PVK (Poly(N-vinylcarbazole)) and Bu-PBD (2-(4-biphenyl-phenyl)-1,3,4-oxadiazole) are used hole transport polymer and electron transport molecule respectively. We found that both current injection and electroluminescence output are significantly different with a variable DC sputtering power. The difference is believed to be due to the influence near the blended polymer layer/cathode interface that results from the DC power and H$\sub$2//O in a chamber. And DC sputtering deposition is an effective way to fabricate Al electrodes with pronounced orientational characteristics without damage occurring to metal-organic interface during the sputtering deposition.

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Deposition for PET Fabric of Macban Stone with RF Sputtering (RF Sputtering을 이용한 맥반석의 PET 직물에의 증착)

  • Lee, Hye-Ryeon;Choi, Soon-Hwa
    • Fashion & Textile Research Journal
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    • v.8 no.1
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    • pp.129-133
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    • 2006
  • To develope a high value-added fiber products which is useful in the human body physiology, the Macban stone was deposited on the PET fabric by sputtering and its effects were investigated. Then, a Macban stone target was prepared for sputtering treatment and treated on the PET fabric by RF sputtering process. After treatment, surface observation by SEM, far-infrared emissivity and emissive power, the fastness to washing and light, bacteriostatic rate, electrostatic, drape stiffness, and breaking strength of PET fabric were investigated. From these investigation, the following conclusions were obtained. 1) The Macban stone was able to deposit on the PET fabric, by the RF sputtering treatment which is eco-friendly dry textile finishing. 2) The far-infrared emissivity and emissive power of sputtered PET fabrics were increased. 3) When PET fabric was treated by sputtering with Macban stone, the amount of deposited Macban stone increased with increasing treatment time and it was deposited on the fabric surface firmly. 4) The bacteriostatic rate of sputtered PET fabrics was about 20%. 5) The electrostatic charge of fiber surface was reduced by sputtering. 6) The fastness washing to light of dyed fabric were improved by the deposition of Macban stone, but the breaking strength was not changed by sputtering. 7) The drape stiffness of sputtered PET fabrics increased with increasing treatment time.

Effect of O2 Partial Pressure on AlOx Thin Films Prepared by Reactive Ion Beam Sputtering Deposition

  • Seong, Jin-Wook;Yoon, Ki-Hyun;Kim, Ki-Hwan;Beag, Young-Whoan;Koh, Seok-Keun
    • Journal of the Korean Ceramic Society
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    • v.41 no.5
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    • pp.364-369
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    • 2004
  • The barrier and optical properties of AlO$_{x}$ thin films on polycarbonate deposited by Reactive Ion Beam Sputtering (RIBS) were investigated at different oxygen partial pressure. We measured the deposition rate of AlO$_{x}$ thin films. As the oxygen partial pres-sure increased, the deposition rate increased then decreased. The changes of deposition rate are associated with the properties of deposited films. The properties of deposited AlO$_{x}$ thin films were studied using X-ray Photoelectron Spectroscopy (XPS), Scan-ning Electron Microscopy (SEM), and Atomic Force Microscopy (AFM). Optimum deposition parameters were found for fabricat-ing aluminum oxide thin films with high optical transparency for visible light and low Oxygen Transmission Rate (OTR). The optical transmittance of AlO$_{x}$ thin film deposited on polycarbonate (PC) showed the same value of bare PC.bare PC.

Comparison of Yittria Stabilized Zirconia Electrolytes(YSZ) for Thin Film Solid Oxide Fuel Cell by Atomic Layer Deposition and Sputtering (원자층 증착법과 스퍼터링을 이용한 고체산화물 연료전지용 YSZ 전해질에 관한 연구)

  • Tanveer, Waqas Hassan;Ha, Seung Bum;Ji, Sanghoon;Cha, Suk Won
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.84.2-84.2
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    • 2011
  • In this research, two thin film deposition techniques, Atomic Layer Deposition and Sputtering are carried out for the fabrication of Yittria Stabilized Zirconia electrolyte for thin film Solid Oxide Fuel Cell. Zirconium to Yittrium ratio for both cases is about 1/8. Scanning Electron Microscope(SEM) image shows that the growth rate per hour for Atomic Layer Deposition is faster than for sputtering. X-ray Photo-electron Spectroscopy(XPS) shows that the peaks of both Zirconia and Yittria shift towards higher bending energy for the case of Atomic Layer deposition and thus are more strongly attached to the substrate. Later, Nyquist plot was used to compare the conductivity of Yittria Stabilized Electrolyte for both cases. The conductivity at $300^{\circ}C$ for Atomic Layer Deposited Yittria Stabilized Zirconia is found to be $5{\times}10^{-4}S/cm$ while that for sputtered Yittria Stabilized Zirconia is $2{\times}10^{-5}S/cm$ at the same temperature. The reason for better performance for Atomic Layered YSZ is believed to be the Nano-structured layer fabrication that aids in along the plane conduction as compared to the columnarly structured Sputtered YSZ.

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Effect of Sulfurization on CIGS Thin Films by RF Magnetron Sputtering Using a Cu(In1-xGax)Se2 Single Target

  • Jung, Sung Hee;Chung, Chee Won
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.675-675
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    • 2013
  • CIGS thin films have received a great attention as a promising material for solar cells due to their high absorption coefficient, appropriate bandgap, long-term stability, and low cost production. CIGS thin films have been deposited by various methods such as co-evaporation, sputtering, spray pyrolysis and electro-deposition. In this study, Cu(In,Ga)Se2(CIGS) thin films were prepared using a single quaternary target by rf magnetron sputtering. The effect of sulfurization on the structural, compositional and electrical properties of the films was examined in order to develop the deposition process. An optimal sulfurization process will be selected for the preparation of CIGS thin films with good structural, optical and electrical properties by applying various sulfurization processes. In addition, the electrical properties of CIGS thin films were investigated by post-deposition annealing process. The carrier concentration of CIG(SSe) thin films after sulfurization was increased from $10^{14}cm^{-3}$ to $10^{16}cm^{-3}$ and the resistivity was increased from 10 ${\Omega}cm$ to $10^3$ ${\Omega}cm$. It is confirmed that CIG(SSe) thin films prepared at optimal deposition condition have similar atomic ratio to the target value after sulfurization.

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Effects of Sputter Deposition Rate on the Thin Film Property (Sputtering 성막속도가 박막의 특성에 미치는 영향)

  • Lee, Ky-Am
    • Journal of the Korean Vacuum Society
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    • v.2 no.2
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    • pp.152-160
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    • 1993
  • In this study, we have investigated the influence of sputtering conditions (Ar pressure input powers, substrates) on coercivity and microstructures of GdFe, Co, CoCr thin films produced by the method of DC magnetron sputtering. In GdFe films, we have observed that the Gd atomic ratio was decreased with the deposition rate, and deposition rate decreased with the pressure of Ar gas and the increased linearly with input power. It was also observed that the coercivity of thin films was increased with input power. In Co films, we have investigated the deposition was increased and the Co thin film became finer structure with the increase in the input power, was increased and the Co thin film became finer structure with the increase in the input power, and the deposition rate was decreased with the pressure of Ar gas. In CoCr films, we have investigated the effects of substrates on the coercivity $(H_c)$ and the microstructure. We have found that the substrates plays a crucial role in the microstructure and the coercivity $(H_c)$.

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Hydrophobic Properties of PTFE Thin Films Deposited on Glass Substrates Using RF-Magnetron Sputtering Method (고주파 마그네트론 스퍼터링 방법을 사용하여 유리 기판 위에 증착된 PTFE 박막의 발수 특성)

  • Kim, Hwa-Min;Kim, Dong-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.11
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    • pp.886-890
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    • 2010
  • The polytetrafluoroethylene (PTFE) films are deposited on glass using conventional rf-magnetron sputtering method. Their hydrophobic properties are investigated for application as an anti-fouling coating layer on the screen of displays. It is found that the hydrophobicity of PTFE films largely depends on the sputtering conditions, such as Ar gas flow and deposition time during sputtering process. These conditions are closely related to the deposition rate or thickness of PTFE film. Thus, it is also found that the deposition rate or the film thickness affects sensitively the geometrical morphology formed on surface of the rf-spluttered PTFE films. In particular, the PTFE film with 1950 nm thickness deposited for 30 minute at rf-power 50 W shows a very excellent optical transmittance of over 90% and a good anti-fouling property and a good durability.

Fabrication of Thin $YBa_{2}Cu_{3}O_{7-\delta}$ Films on $CeO_2$Buffered Sapphire Substrate Using Combined Sputter and Pulsed Laser Deposition (스퍼터링과 펄스 레이저를 이용하여 $CeO_2$완충층 위에 층착된 $YBa_{2}Cu_{3}O_{7-\delta}$박막의 제작)

  • 곽민환;강광용;김상현
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.901-904
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    • 2001
  • For the c-axis oriented epitaxial YBa$_2$Cu$_3$O$_{7-{\delta}}$ thin film on r-cut sapphire substrate it is necessary to deposit buffer layers. The CeO$_2$buffer layer was deposited on sapphire substrate using RF magnetron sputtering system. We investigated XRD pattern of CeO$_2$thin films at various sputtering conditions such as sputtering gas ratio, sputtering power, target to substrate distance, sputtering pressure and substrate temperature. The optimum condition was 15 mTorr with deposition pressure, 1:1.2 with $O_2$and Ar ratio and 9cm with target to substrate distance. The CeO$_2$(200) peak was notable for a deposition temperature above 75$0^{\circ}C$. The YBa$_2$Cu$_3$O$_{7-{\delta}}$ was deposited on CeO$_2$buffered r-cut sapphire substrate using pulsed laser ablation. The YBa$_2$Cu$_3$O$_{7-{\delta}}$CeO$_2$(200)/A1$_2$O$_3$thin film was exhibited a critical temperature of 89K.xhibited a critical temperature of 89K.

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Microstrcture and Mechanical Properties of HfN Films Deposited by dc and Inductively Coupled Plasma Assisted Magnetron Sputtering (직류 및 유도결합 플라즈마 마그네트론 스퍼터링법으로 제조된 HfN 코팅막의 미세구조 및 기계적 물성연구)

  • Jang, Hoon;Chun, Sung-Yong
    • Journal of the Korean institute of surface engineering
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    • v.53 no.2
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    • pp.67-71
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    • 2020
  • For deposition technology using plasma, it plays an important role in improving film deposited with high ionization rate through high density plasma. Various deposition methods such as high-power impulse magnetron sputtering and ion-beam sputtering have been developed for physical vapor deposition technology and are still being studied. In this study, it is intended to control plasma using inductive coupled plasma (ICP) antennas and use properties to improve the properties of Hafnium nitride (HfN) films using ICP assisted magnetron sputtering (ICPMS). HfN film deposited using ICPMS showed a finer grain sizes, denser microstructure and better mechanical properties as ICP power increases. The best mechanical properties such as nanoindentation hardness of 47 GPa and Young's modulus of 401 GPa was obtained from HfN film deposited using ICPMS at ICP power of 200 W.