• Title/Summary/Keyword: Spray-type Cleaning Agent

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Evaluation of Cleanliness and Jet Forces by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 세정제에 대한 분사력 및 세정성 평가)

  • Heo, Hyo Jung;Jung, Young An;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.48 no.3
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    • pp.401-404
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    • 2010
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

Cleanliness Test by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 분사형 세정제에 대한 청정도 평가)

  • Heo, Hyo Jung;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.47 no.6
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    • pp.688-694
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    • 2009
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.