• Journal of Mechanical Science and Technology
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• 제19권3호
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• pp.820-825
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• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Structural Engineering and Mechanics
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• 제15권3호
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• pp.367-378
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• 2003

The magnitude of the plastic zone around the crack tip of DENT (Double Edge Notched Tension) specimen and the crack growth length under cyclic loading were measured by ESPI (Electronic Speckle Pattern Interferometry) system. The measured magnitude of plastic zone was compared with the proposed by Irwin and calculated by a nonlinear static method of MSC/NASTRAN. The measured crack growth length by ESPI system was also compared with the obtained data by the image analysis system. From the study, it is confirmed that the plastic zone and crack growth length can be measured accurately with the high-tech equipment (ESPI System).

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 추계학술대회
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• pp.254-258
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• 2003

Electronic Speckle Pattern for quantitative evaluation of a impact defect inside of composite material plate are described. The impact on composite material makes inside delamination which is difficult to detect visual inspection and ultrasonic testing due to non-homeogenous structure. This paper proposes the quantitative evaluation technique of defects under real impact. Artificial defects are designed inside of composite plate for development of inspection technique and real defects under impact are inspected and compared with results of visual inspection.

• 한국정밀공학회지
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• 제24권7호
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• pp.69-74
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• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2002년도 정기학술대회
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• pp.245-251
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• 2002

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

• 소음진동
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• 제9권3호
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• pp.509-516
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• 1999

The ESPI (Electronic Speckle Pattern Interferometry) algorithm has been simulated to calculate vibrational modes of a thin right-angled STS304 plate. The phase transformation of the reference wave of the ESPI is carried out only one time during vibration in order to clarify ESPI speckle patterns. Two dimensional vibrational modes are calculated from one ESPI pattern before vibration onset and two ESPI patterns during vibrations but with and without the phase transformation. The ESPI harmonic results are compared with those derived from the finite element method (FEM), and they agree very well. Additionally a phase unwrapping algorithm has been newly developed to derive a displacement map from an ESPI phase map.

• 조명전기설비학회논문지
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• 제18권3호
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• pp.15-19
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• 2004

다중모드 광섬유를 이용한 홀로그래픽 메모리 시스템을 제안하였다. 이 시스템에서 다중모드 광섬유에서 나온 빛을 기준빔으로 사용하여 홀로그램을 다중화 하였다. 제안된 시스템은 다중모드에서 나온 스펙클 패턴과 다중모드 광섬유의 위치와 같은 2가지의 다중화 자유도를 가지고 있다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.69-73
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. AS4/PEEK[30/-30/90]s, composite laminate plate was analyzed by ESPI to determine the vibration characteristics with tensile loading and without it. vibration mode shapes are quantitatively compared with the result of numerical analysis. The experimental results agree well with those of numerical analysis. we found that when the composite laminate plate is under the tensile loading, vibration modes can be measured with high accuracy by ESPI.

• 한국생산제조학회지
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• 제8권6호
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• pp.78-83
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1123-1125
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• 1999

In this paper, we report a new scheme of multimode fiber sensor which uses pattern matching method. Fiber speckle pattern allows the wide dynamic range of the intensity based sensor. The proposed method uses pre-built specklegram database which is made by image processing techniques of wavelet transform and edge detection for the sake of compact data storage and fast sensing time. We demonstrate our proposed sensor and the experimental results will do presented.