• 제목/요약/키워드: Solid base

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Bonding Phenomena during Transient Liquid Phase Bonding of CMSX-4, High Performance Single Crystal Superalloy (고성능 단결정 초내열합금 CMSX-4의 액상확산접합현상)

  • 김대업
    • Journal of Welding and Joining
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    • v.19 no.4
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    • pp.423-428
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    • 2001
  • The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

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Solidification Microstructure and Carbide Formation behaviors in the Co-base Superalloy ECY768 (Co기 초합금 ECY768에서 응고 조직 및 탄화물 형성 거동)

  • Lee, J.S.;Kim, H.C.;Lee, J.H.;Seo, S.M.;Jo, C.Y.
    • Korean Journal of Materials Research
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    • v.13 no.6
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    • pp.381-388
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    • 2003
  • Directional solidification experiments were carried out at 0.5-150 $\mu\textrm{m}$/s in the Co-base superalloy ECY 768. As increasing solidification rate, the dendrite length increased and it reached the maximum at 150 $\mu\textrm{m}$/s, where the tip temperature is close to the liquidus. The liquidus and eutectic temperatures could be estimated by comparing the dendrite lengths and the temperature gradients at the solid/liquid interface and those were estimated as $1424.6^{\circ}C$ and $1343^{\circ}C$ respectively. Between the dendrites just below final freezing temperature, MC carbide and $M_{23}$$C_{6}$ carbide were found. It was confirmed that the script or blocky shape was Ta or W-rich MC carbide, and the lamellar shape was Cr-rich eutectic carbide. The solid/liquid interface morphology clearly showed that the Cr-rich eutectic carbide formed just after the script type MC carbide.

Enhanced Occlusiveness of Nanostructured Lipid Carrier (NLC)-based Carbogel as a Skin Moisturizing Vehicle

  • Choi, Woo-Sik;Cho, Hye-In;Lee, Hyun-Young;Lee, Seo-Hyun;Choi, Young-Wook
    • Journal of Pharmaceutical Investigation
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    • v.40 no.6
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    • pp.373-378
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    • 2010
  • In order to develop a topical preparation which has a high occlusive property with skin moisturization, nano-structured lipid carrier (NLC) systems along with solid lipid nanoparticle (SLN) were designed. Various NLC dispersions were successfully formulated with Compritol 888 ATO as a solid lipid, Labrafil M 1944 CS as an oil, and Tween 80 as a surfactant. The increase of oil content (5 to 50%) led to the decrease in the occlusion factor in the order of SLN > NLC-5 > NLC-15 = NLC-30 > NLC-50. Particle size of lipid particulates was in the range of 100 to 160 nm. NLC-based carbogels were prepared by the employment of humectants such as urea, glycerin, and Tinocare GL to carbomer gel. NLC-30 gel formulations containing 4 or 8 % of lipid particles showed improved occlusive effect in vitro, compared to NLC-free gel base. Even though NLC-free gel base revealed comparable occlusion effect by itself, the occlusion factor of 4 % NLC-30 gel was about 2-fold higher than that of NLC-free gel base.

Rheological Behavior of Viscoelastic Semi-Solid Ointment Base (Vaseline) in Oscillatory Shear Flow Fields (진동전단유동장에서 점탄성 반고형 연고기제(바셀린)의 레올로지 거동)

  • Song, Ki-Won;Chang, Gap-Shik
    • Journal of Pharmaceutical Investigation
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    • v.36 no.1
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    • pp.31-38
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    • 2006
  • Using a Rheometries Dynamic Analyzer (RDA II), the dynamic viscoelastic properties of a semi-solid ointment base (vaseline) in large amplitude oscillatory shear flow fields were measured over a temperature range of $25{\sim}45^{\circ}C$ and the linear viscoelastic behavior in small amplitude oscillatory shear flow fields was investigated over a wide range of angular frequencies. In this article, the nonlinear viscoelastic behavior was reported from the experimentally obtained data and the effect of temperature on this behavior was discussed in detail. In addition, the angular frequency and temperature dependencies of a linear viscoelastic behavior were explained. Finally, the applicability of a time-temperature superposition principle originally developed for polymeric materials was examined using a shift factor. Main results obtained from this study can be summarized as follows : (1) At very small strain amplitude region, vaseline shows a linear viscoelastic behavior independent of the imposed deformation magnitudes. Above a critical strain amplitude $({\gamma}_{0}=0.1{\sim}0.2%)$, however, vaseline exhibits a nonlinear viscoelastic behavior ; indicating that both the storage modulus and dynamic viscosity are sharply decreased with increasing deformation magnitude. (2) In large amplitude oscillatory shear flow fields, an elastic behavior (storage modulus) has a stronger strain amplitude dependence and begins to show a nonlinear behavior at a smaller strain amplitude region than does a viscous behavior (dynamic viscosity). (3) In small amplitude oscillatory shear flow fields, the storage modulus as well as the loss modulus are continuously increased as an increase in angular frequency and an elastic nature is always superior to a viscous behavior over a wide range of angular frequencies. (4) A time-temperature superposition principle can successfully be applicable to vaseline. This finding allows us to estimate the dynamic viscoelastic behavior of vaseline over an extraordinarily extended range (11 decades) of angular frequencies inaccessible from the experimentally measured range (4 decades).

Culinary Characteristics of Hwachae in Korean Cookbooks Published in 1600-1940s (1600년대-1940년대 조리서에 등장한 화채류의 종류 및 조리법 특성)

  • Yang, Jihye;Song, Kyunghee;Chang, Yunhee;Lee, Youngmi
    • Korean journal of food and cookery science
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    • v.32 no.6
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    • pp.800-810
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    • 2016
  • Purpose: This study aimed to characterize the recipes of Hwachae in Korean cookbooks published from the 1600's to 1940's. Methods: We conducted a content analysis of thirteen old cookbooks (Eumsikdimibang, Jubangmun, Jeungbosallimgyeongje, Kyugonyoram, Imwonsibyukji, Gyuhapchongseo, Sieuijeonseo, Buinpilji, Chosunyorijebub, Chosunmusangsinsikyorijebub, Ganpyeonchosunyorijebub, Chosunyori, Chosunyoribub). We collected a total of 99 recipes of Hwachae and analyzed the ingredients used and characteristics of the recipes according to five groups of Hwachae: noodle type Hwachae, dumpling type Hwachae, fruit Hwachae, flower Hwachae, and the others. Results: The noodle type Hwachae included Changmeyon, Smyeon, Nanmyeon, and Waemyeon. Mung bean (81.0%) and Schisandra (95.2%) were mostly employed as solid ingredient and as beverage base, respectively. In the noodle type Hwachae, Wonsobyeong and Sudan belonged to the dumpling type Hwachae, in which mung bean (51.7%) was mostly used as solid ingredient and just water without any additive was used as the most popular beverage base (62.1%) unlike in other types of Hwachae. There were various types of fruit Hwachae, which used different fruits as solid ingredient such as pear, peach, cherry, strawberry, etc. Pears (44.4%) have been employed as the most popular ingredient and sweets such as honey and sugar have been used in all the fruit Hwachae. The flower Hwachae included Hwamyeon, Sunchaehwachae, Jangmihwachae, and Bomhwachae. In all the flower Hwachae, schizandra has been used as a beverage base. Conclusion: These findings provide basic information required for developing standard recipes of traditional Hwachae.

Conjugate Analysis of Bubble Growth Involving Conduction in Solid (고체의 전도를 포함한 기포성장의 복합적 해석)

  • Son, Gi-Hun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.27 no.2
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    • pp.265-273
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    • 2003
  • Numerical analysis of bubble motion during nucleate boiling is performed by imposing a constant heat flux condition at the base of a heater which occurs in most of boiling experiments. The temporal and spatial variation of a solid surface temperature associated with the bubble growth and departure is investigated by solving a conjugate problem involving conduction in the solid. The vapor-liquid interface is tracked by a level set method which is modified to include the effects of phase change at the interface, contact angle at the wall and evaporative heat flux in a thin liquid micro-layer. Based on the numerical results, the bubble growth pattern and its interaction with the heating solid are discussed. Also, the effect of heating condition on the bubble growth under a micro-gravity condition is investigated.

A Study on the Solid State Diffusion Bonding of Ti-6Al-4V Alloy (Ti-6Al-4V합금의 고상 확산접합에 관한 연구)

  • 강호정;강춘식
    • Journal of Welding and Joining
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    • v.15 no.6
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    • pp.32-40
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    • 1997
  • Solid state diffusion bonding is the joining process performed by creep and diffusion, which is accelerated by heating below melting temperature and proper pressing, in vacuum or shielding gas atmosphere. By this process we can obtain sufficient joint which can't be expected from the fusion welding. For Ti-6Al-4V alloy, the optimum solid state diffusion bonding condition and mechanical properties of the joint were found, and micro void morphology at bond interface was observed by SEM. The results of tensile test showed sufficient joint, whose mechanical properties are similar to that of base metal. 850$^{\circ}$C, 3MPa is considered as the optimum bonding condition. Void morphology at interface is long and flat at the initial stage. As the percentage of bonded area increases, however, small and round voids are found. Variation of void shape can be explained as follows. As for the void shrinkage mechanism, at the initial stage, power law creep is the dominant, but diffusion mechanism is dominant when the percentage of bonded area is increased.

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A Research on the Development of the 3-dimensional Design Automation System for Progressive Die (Progressive 금형의 3차원 설계 자동화시스템의 개발에 관한 연구)

  • 김대영;성창영;이재원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.303-306
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    • 2000
  • This paper describes a research on the development of the 3D design automation system for progressive die. Based on knowledge base of expert, this system can carry out design tasks, such as feature recognition of product data, layout design, dre set component design. Easy system user mterface and 3-dlmensional solid modeling could result in time and cost saving.

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DNA Sequencing Analysis Technique by Using Solid-State Nanopore (고체상 나노구멍을 이용한 DNA 염기서열 분석기술)

  • Kim, Tae-Heon;Pak, James Jung-Ho
    • Journal of Sensor Science and Technology
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    • v.21 no.5
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    • pp.359-366
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    • 2012
  • Nanopore DNA sequencing is an emerging and promising technique that can potentially realize the goal of a low-cost and high-throughput method for analyzing human genome. Especially, solid-state nanopores have relatively high mechanical stability, simple surface modification, and facile fabrication process without the need for labeling or amplification of PCR (polymerized chain reaction) in DNA sequencing. For these advantages of solid-sate nanopores, the use of solid-state nanopores has been extensively considered for developing a next generation DNA sequencing technology. Solid-state nanopore sequencing technique can determine and count charged molecules such as single-stranded DNA, double-stranded DNA, or RNA when they are driven to pass through a membrane nanopore between two electrolytes of cis-trans chambers with applied bias voltage by measuring the ionic current which varies due to the existence of the charged particles in the nanopore. Recently, many researchers have suggested that nanopore-based sensors can be competitive with other third-generation DNA sequencing technologies, and may be able to rapidly and reliably sequence the human genome for under $1,000.