• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 2004.05a
• /
• pp.286-289
• /
• 2004

본 연구는 U사의 SMD Wave Soldering 공정을 최적화하기 위해 납땜에 관련된 PCB의 여러 계수형 특성들을 종합하여 계량화한 후 분석한 사례이다. SMD Wave Soldering 공정은 PCB 불량의 80% 이상을 결정하는 중요 공정으로 SMD 작업 불량으로 인한 재작업 등 각종 문제점들을 내포하고 있다. 그러나 검사 결과 미납, 냉납, 과납, 쇼트 등의 발생 건수 형태의 계수형 데이터가 집계되어 이를 체계적으로 분석하여 공정을 개선하는데 어려움이 있어 불량 유형별로 보다 세분화된 평가표를 작성하여 먼저 데이터를 계량화한 후 이를 기초로 공정 개선을 실시하였다.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1063-1068
• /
• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

• Journal of Welding and Joining
• /
• v.13 no.4
• /
• pp.14-23
• /
• 1995

Micro soldering 기술의 응용은 주로 전자제품에 이용되며, 특히 컴퓨터 정보 통신 기기의 집합.접속 기술의 중추적인 역할을 하고 있다. 아울러 이 분야는 일본, 미국이 선구적인 역할을 하고 있으며, 예를 들어 일본 전자산업의 1994년도 생산액이 앤 고의 열쇠에 불구하고 민생용.산업용 전자기기 및 전자 부품의 3부분에서 약 .yen.30조(250조원)에 달한 것으로 보면 그 규모 및 중요성을 알 수 있다. 이것은 기본 적으로 반도체의 집적도가 높아진것(LSI.rarw.VLSI.rarw.ULSI)과 아울러 소자를 접합 접속시키는 기술이 확보되었기 때문에 이루어진 결과라고 말할 수 있다. 따라서 본 기술 해설에서는 접합.접속 기술의 하나인 Micro soldering의 각종 프로세스 중에서 도 특히 기본이 되는 리플로우 프로세스(reflow process)를 중심으로 기술하였으며 아울러 신뢰성의 제반사항에 관하여 간략하게 기술하였다.

• 제어로봇시스템학회:학술대회논문집
• /
• 2001.10a
• /
• pp.180.6-180
• /
• 2001

Welding/soldering automation is one of the most important manufacturing issues in order to lower the cost, increase the quality, and avoid labor problems. An off-line programming, OLP, is one of the powerful methods to solve this kind of diver sity problem, Unless an OLP system is ready for the path optimization in welding/soldering, a waste of time and cost is unavoidable due to an inefficient path in welding/soldering processes. Therefore, this study attempts to obtain path optimization using a genetic algorithm based on artificial intelligences. The problem of the welding path optimization is defined as conventional TSP (traveling salesman problem), but still paths have to go through welding lines. An improved genetic algorithm was suggested and the problem was formulated as a TSP problem considering ...

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.11 no.5
• /
• pp.23-29
• /
• 2002

The soldering is widely used installing the electronic element on circuit board in the common electronic device. Since the flux which improves the liquidity of solder make the electronic and chemical performance worse, the circuit board need to wash clearly. At present however no-washing is required for the cost reduction, the chemical stability, and the protection of environment. In this research, the solder liquidity depending on the power density and the pulse width is comparatively analyzed by the diffusion area method for achieving the no-flux soldering.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2000.04a
• /
• pp.153-158
• /
• 2000

This paper addresses an intelligent robot control system using an off-line programming to teach a precise assembly task of electronic components in a flexible way. The investigated task consists of three job: heat caulking test, soldering on a circuit board, and checking of soldering defects on the back cover of a camera. This study investigates the remodelling of the most complicated cell in terms of the accuracy and fault rate among the twelve cells in a camera back-cover assembly line. We have attempted to enhance back-cover assembly line. We have attempted to enhance soldering quality, to add task flexibility, to reduce failure rate, and to increase product reliability. This study modifies the cell structure, and improves the soldering condition. The developed all system implements the real-time control of assembly with vision data, and realized an easier task teaching on off-line programming.

• Journal of Welding and Joining
• /
• v.19 no.2
• /
• pp.176-181
• /
• 2001

Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.

• Journal of Welding and Joining
• /
• v.15 no.6
• /
• pp.105-115
• /
• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Proceedings of the KWS Conference
• /
• 2005.11a
• /
• pp.231-233
• /
• 2005

Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.

• 전자공학회논문지 IE
• /
• v.47 no.1
• /
• pp.6-11
• /
• 2010

This research is the result for studding about the IR Rework station which is using a multi-wave IR-heater for soldering and de-soldering on the substrate such as PCB. This IR repair and reflow system is increasing the temperature on the target area under stable temperature control following setting point melting point of solder and lead free solder using IR-heater. So this system is not giving any therrna1 damage on the target PCB and components even closed components. The soldering and de-soldering quality is evaluated through the actual test.