The Study on Reability of Sn-Ag-Cu Solder for Reflow Temperature Change (리플로어 온도 변화에 따른 Sn-Ag-Cu계 솔더의 신뢰성에 관한 연구)

• 노보인;이보영;이어화;김우영
• • Proceedings of the KWS Conference
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  • 2001.05a
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  • pp.289-291
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  • 2001
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A Study on the Characteristics of Sn-5Pb-1.5Ag-xln Solder Alloys (Sn-5Pb-1.5Ag-xln계 Solder합금의 특성에 관한 연구)

• 주철홍;김인배;강정윤;홍순국
• • Proceedings of the KWS Conference
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  • 1996.10a
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  • pp.54-55
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  • 1996
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A Study on the Characteristics of Sn-2Ag-Bi-(In) Solder Alloys (Sn-2Ag-Bi-(In)계 solder합금의 특성에 관한 연구)

• 박일경;강정윤;홍순국
• • Proceedings of the KWS Conference
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  • 1996.10a
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  • pp.64-65
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  • 1996
• PDF

A Study on Interfacial reaction of Sn-3.5Ag Lead-Free Solder in Cu Substrate (Sn-3.5Ag 무연합금과 Cu 기판에서의 계면반응에 대한 연구)

• 김시중;김주연;배규식
• • Proceedings of the Materials Research Society of Korea Conference
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  • 2000.11a
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  • pp.164-164
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  • 2000
• PDF

Adhesion Properties of Sn-3.5Ag Lead-Free Alloy/Lead Frame Solder Joints (Sn-3.5Ag 무연합금과 리드프레임간의 솔더 접합특성)

• 김시중;정연실;김주연;배규식
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1999.05a
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  • pp.123-123
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  • 1999
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Mechanical Properties and Microstructure of Sn-Ag Solder Alloys with Addition of Bi and Cu (Bi 및 Cu 첨가에 따른 Sn-Ag 솔더합금의 기계적 성질과 미세구조)

• 이광응;차호섭;최진원;오태성
• • Proceedings of the Materials Research Society of Korea Conference
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  • 2000.11a
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  • pp.146-146
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  • 2000
• PDF

A Study on the Solderability of Sn-Ag-Bi-In Solder Bump to Ni/Cu (Ni/Cu-UBM과 Sn-Ag-Bi-In솔더 범프의 솔더링성 연구)

• 문준권;김문일;정재필;곽계환;강춘식
• • Proceedings of the KWS Conference
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  • 2001.10a
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  • pp.156-158
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  • 2001
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Effect of plating layer on the solderability of Sn-3.5Ag-0.7Cu ball (도금층에 따른 Sn-3.5Ag-0.7Cu볼의 솔더링성 연구)

• 정석원;신규식;정재필
• • Proceedings of the KWS Conference
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  • 2001.10a
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  • pp.159-161
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  • 2001
• PDF

A Study on the wettability of Sn-3Ag-5In-8Bi solder (Sn-3Ag-5In-8Bi solder의 젖음특성에 관한 연구)

• 이창용;윤정원;윤의한;정승부
• • Proceedings of the KWS Conference
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  • 2001.10a
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  • pp.168-170
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  • 2001
• PDF

A Study on the Tafel Characteristics of SnAgCu Pb-Free Solder (SnAgCu 계 무연솔더의 타펠 특성에 관한 연구)

• Hong, Won-Sik;Song, Byeong-Seok;Kim, Gwang-Bae
• • Proceedings of the Materials Research Society of Korea Conference
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  • 2005.05a
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  • pp.72-72
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  • 2005
• PDF

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