• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• Journal of Welding and Joining
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• v.16 no.6
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Progress in Superconductivity and Cryogenics
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• v.12 no.1
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• pp.17-21
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• 2010

In the case of designing superconducting power apparatuses using the second generation high temperature superconducting wire, it is necessary to have a tape-splicing technique to achieve low splice resistance between coated conductor (CC) tapes. In this paper, an experimental splice method between YBCO CC tapes is proposed for a coil application. Splices were performed with a 37Pb-63Sn solder. YBCO samples were fabricated with various pressures and cooling rates. Joint resistances of the spliced samples of jointed YBCO CC tapes were measured and evaluated from V-I curves. In addition, optical micrographs were obtained to analyze the cross sectional microstructure of jointed samples.

• Journal of Surface Science and Engineering
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• v.36 no.5
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

• Journal of Conservation Science
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• v.37 no.4
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• pp.340-356
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• 2021

We have tried the experimental research of lost-wax casting to reconstruct Gilt-Bronze Pensive Bodhisattva; preliminary and reconstruction experiment based on ancient texts. Main object to reconstruct is Korean National Treasure No.83, Gilt-Bronze Pensive Bodhisattva (Maitreya), then we measure alloy ratio and casting method based on the scientific analysis. Other impurities were removed from the base metal components(copper : tin : lead) and their ratio was set to 95.5 : 6.5 : 3 where the ratios for tin and lead were increased by 2.5% each. The piece-mold casting method was used, and piece-mold casting experiments were carried out twice in this study but supplementary research on piece-mold casting was necessary. The microstructure was confirmed to be typical cast microstructure and the component analysis result was similar to that of the prior study. Analysis of the chemical composition is confirmed to copper, tin, lead, and zinc, and the chemical composition of the matrix was 87.8%Cu-7.5%Sn-2.7%Pb-2.1%Zn, and similar to previous experimental research. Also resulted in the detection of small impurity in Zn. Analysis of the mould revealed that the mould was fabricated by adding quartz and organic matter for structural stability, fire resistance, and air permeability. We expect that our research will contribute to provide base data for advanced researches in future.

• Journal of Conservation Science
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• v.37 no.6
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• pp.670-678
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• 2021

Anseong Cheonryongsa, a temple located in Anseong Seoun Mountain, is a part of the second Jogye Order of Korean Buddhism, under the Yongju Temple, and enshrines a gilt-bronze seated Avalokitesvara Bodhisattva. In this study, X-ray fluorescence (XRF) analysis revealed that this statue is composed of Cu-27.2 wt%, Sn-12.6 wt% and Pb-48 wt%. A gamma (γ) ray (Ir-192) image confirmed damage on the backside of the statue, which was later repaired with wood. The XRF analysis and visual observation determined the boundary between the metal and wood in the statue. In addition, results of standard X-ray peak intensity of gold foil and correlation with thickness helped to derive an equation for calculating the thickness of the Avalokitesvara Bodhisattva's gold foil. It was determined that the gilded chest (21 ㎛) and face (20.7 ㎛) of the statue were the thickest sections, the wooden substratum (11.9 ㎛) was the next-most thick, and the bronze (7.4 ㎛) was the thinnest layer.

• Microbiology and Biotechnology Letters
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• v.20 no.2
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• pp.150-155
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• 1992

- Some properties of an extracellular cytosine deaminase excreted from an isolate from soil samples were examined after 20~80%' ammonium sulfate fractionation. The enzyme catalyzed the conversion of cytosine and 5-fluorocytosine into uracil and 5-fluorouracil by substrate specificity, respectively. The optimum temperature and storage time on the stability of the enzvme preparation were below $50^{\circ}C$ keeping above 90% of the residual activity and near 4 days keeping above 80% of the residual one in Tris-HCI buffer. The maximum activity was also obtained at 8.0 in pH and 37'C in temperature. The pHs and temperatures for enzyme activity ranged from 8.0~8.5 and from 37~$45^{\circ}C$. respectively. The presence of $Ag^-,Hg^{2-}, Zn^{2-}, Cu^{2-}, Sn^{2-}, \; or\; Pb^{2-}$ in the reaction mixture resulted in the marked inhibition in enzyme activity, but 1 mM of $K^+, Fe^[3+}, Mg^{2+}, \; or \; Na^+$. slightly increased the activity. The enzyme preparation was heavily affected by most of inhibitors tested such as 1 mM of EIITA, NaCN and pentachlorophenol, and completely inactivated by p-CMB and TCA of 1 mM, or 10 mM.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.9 no.1
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• pp.56-72
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• 1999

Airborne concentrations of welding fumes in which 13 different metals such as Al, Cd, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Si, Sn, Ti, and Zn were analyzed were measured at 18 factories including automobile assembly and manufactures, steel heavy industries and shipyards. Air samples were collected by personal sampler at each worker's worksite(n=339). Blood levels of Cd, Cu, Fe, Mn, Pb and Zn were also measured from samples taken from 447 welders by atomic absorption spectrometry and compared with control values obtained from 127 non-exposed workers. The results were as follows ; 1. Among various welding types, $CO_2$ welding 70.2 % were widely used, shielded metal arc welding(SMAW) 22.1 % came next, and rest of them were metal inert gas(MIG) welding, submerged arc welding(SAW), spot welding(SPOT) and tungsten inert gas(TIG) welding. 2. Welding fume concentration was $0.92mg/m^3$($0.02{\sim}15.33mg/m^3$) at automobile assembly and manufactures, $4.10mg/m^3$($0.02{\sim}70.75mg/m^3$) at steel heavy industries and $5.59mg/m^3$($0.30{\sim}91.16mg/m^3$) at shipyards, respectively, showing significant difference among industry types. Workers exposed to high concentration of welding fumes above Korean Permissible Exposure Limit(KPEL) amounted to 7.9 % and 12.5 %, in $CO_2$ welding and in SMAW at automobile assembly and manufactures and 62.7 % in $CO_2$ welding, and 12.5 % in SMAW at shipyards, and 66.2 % in $CO_2$ welding and 70.6 % in SMAW at steel heavy industries. 3. Geometric mean of airborne concentration of each metal released from welding fumes was below one 10th of KPEL in all welding types. Percentage of workers, however, exposed to airborne concentration of metals above KPEL amounted to 16.8 % in Mn and 7.6 % in Fe in $CO_2$ welding; 37.5 % in Cu in SAW, 30 % in Cu in TIG; and 25 % in Pb in SPOT welding. As a whole, 76 Workers(22.4%) were exposed to high concentration of any of the metals above KPEL. 4. There were differences in airborne concentration of metals such as Al, Cd, Cr, Cu. Fe. Mn, Mo, Ni, Pb, Si, Sn, Ti and Zn by industry types. These concentrations were higher in shipyards and steel heavy industries than in automobile assembly and manufactures. Workers exposed to higher concentration of Pb above KPEI amounted to 7.4 % of workers(7/94) in automobile assembly and manufactures. In shipyards, 19.2 % of workers(19/99) were over-exposed to Mn and 7.1 % (7/99) to Fe above KPEL. In steel heavy industries, 14.4 %(21/146), 7.5 %(11/146) and 13 %(19/146) were over-exposed to Mn, Fe and Cu, respectively. As a whole, 76 out of 339 workers(22.4%) were exposed to any of the metals above KPEL. 5. Blood levels of Cd, Cu, Fe, Mn, Pb, and Zn in welders were $0.11{\mu}g/100m{\ell}$, $0.84{\mu}g/m{\ell}$, $424.4{\mu}g/m{\ell}$, $1.26{\mu}g/100m{\ell}$, $5.01{\mu}g/100m{\ell}$ and $5.68{\mu}g/m{\ell}$, respectively, in contrast to $0.09{\mu}g/100m{\ell}$, $0.70{\mu}g/m{\ell}$, $477.2{\mu}g/m{\ell}$, $0.73{\mu}g/100m{\ell}$, $3.14{\mu}g/100m{\ell}$ and $6.15{\mu}g/m{\ell}$ in non-exposed control groups, showing significantly higher values in welders but Fe and Zn.