• 제목/요약/키워드: Sn-1.2Ag-0.7Cu

검색결과 37건 처리시간 0.024초

공정조성의 SnPb 및 SnAgCu 선형 솔더의 electromigration 특성 평가 (Electromigration charateristics of eutectic SnPb and SnAgCu thin stripe lines)

  • 윤민승;이신복;주영창
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.63-67
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    • 2003
  • Electromigration characteristics of $SnAg_3Cu_{0.7}$ and eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure of two solders were observed after electromigration test, in which the temperature and the current density were varied from 90 to $110^{\circ}C$ and from $4.0\times10^4\;A/cm^2\;to\;9.2\times10^4\;A/cm^2$. In SnAgCu solders, hillocks were main]y observed near the anode end. From resistance measurements, it was calculated that the activation energy of the SnAgCu solder for electromigration was 1.04 eV And in eutectic SnPb without the effect of pads, while depleted region was found near cathode end, Sn-rich hillocks were observed near the anode end. During eutectic SnPb electromigration, it were observed that electromigration behavior had two migration modes.

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Sn-1.7Bi-0.7Cu-0.6In 솔더의 특성 연구 (Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder)

  • 박지호;이희열;전지헌;전주선;정재필
    • Journal of Welding and Joining
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    • 제26권5호
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    • pp.43-48
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    • 2008
  • Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.

전기화학적 환원 분석을 통한 무연 솔더 합금의 산화에 대한 연구 (The Oxidation Study of Lead-Free Solder Alloys Using Electrochemical Reduction Analysis)

  • 조성일;유진;강성권
    • 마이크로전자및패키징학회지
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    • 제12권1호
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    • pp.35-40
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    • 2005
  • 전자 부품에 인체에 유해한 납을 사용하지 않기 위해서 Sn을 주 원소로 한 무연 솔더 합금의 개발이 활발히 진행되고 있다. 무연 솔더 합금의 열역학적, 기계적 특성은 많이 연구되었으나 산화 거동에 대해서는 거의 연구가 되어있지 않다. 따라서 본 연구에서는 Sn 및 Sn-0.7Cu, Sn-3.5Ag, Sn-lZn, Sn-9Zn 합금에 대해 $150^{\circ}C$ 산화 거동을 연구하였다. 전기화학적 환원 분석을 통해 표면에 형성된 산화물의 종류와 양을 분석하여 합금 원소에 따른 산화 거동을 비교하였고 XPS 표면분석을 통하여 환원 실험 결과를 뒷받침하였다. 또한 합금 원소에 따른 산화물 성장 속도를 비교하였다. Sn-0.7Cu 와 Sn-3.5Ag의 경우 Sn의 산화와 비슷한 거동을 보였다. 산화 초기에는 SnO가 형성되고 산화가 진행됨에 따라 SnO 와 $SnO_2$가 같이 존재하되 $SnO_2$가 우세하게 성장하였다. Zn를 포함한 Sn 합금의 경우 ZnO와 $SnO_2$가 형성되었다. Zn의 첨가로 인해 $SnO_2$의 형성이 촉진되었고 SnO는 억제하는 것을 발견하였다.

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Sn3.5Ag0.7Cu 솔더의 계면위치에 따른 금속간 화합물과 강도 연구 (A Study on the of Intermetallic compound and shear strength of Sn3.5Ag0.7Cu ball with interface position)

  • 신규식;박지호;정재필
    • 한국표면공학회지
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    • 제35권1호
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    • pp.47-52
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    • 2002
  • Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

PCB 표면처리에 따른 Sn-1.2Ag-0.7Cu-0.4In 무연솔더 접합부의 기계적 신뢰성에 관한 연구 (Effects of PCB Surface Finishes on Mechanical Reliability of Sn-1.2Ag-0.7Cu-0.4In Pb-free Solder Joint)

  • 김성혁;김재명;유세훈;박영배
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.57-64
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    • 2012
  • 표면처리에 따른 Sn-1.2Ag-0.7Cu-0.4In 솔더범프의 접합 강도 평가를 위하여 전단 속도 및 열처리 시간에 따른 볼 전단강도 시험을 실시하였다. 전반적으로, 전단속도가 증가함에 따라 전단강도는 증가하였지만 인성은 감소하는 경향을 나타내었다. 파괴모드 관찰 결과, 전단 속도가 증가함에 따라 파괴모드의 경우, ENIG(electroless nickel immersion gold) 처리는 취성파괴가 대부분 지배적으로 존재하였고, OSP(organic solderability preservative) 처리는 pad open이 주로 발생하였다. 또한, 500 mm/s의 고속전단시험에서는 열처리 시간이 증가함에 따라 표면처리별 전단강도와 인성 값 모두 감소하는 경향을 보였다. ENIG 표면처리가 OSP 표면처리 보다 좋은 접합강도 특성을 보이는 것은 솔더범프 계면의 금속간화합물의 물성 및 두께와 밀접한 연관이 있는 것으로 판단된다.

아말감과 이종(異種)금속의 거리에 따른 부식에 대한 고찰 (A Study on Corrosion according to Distance between Amalgam and Dissimilar Metals)

  • 김주원;정은경
    • 치위생과학회지
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    • 제4권3호
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    • pp.103-109
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    • 2004
  • 본 실험은 제조회사 매뉴얼과 통법에 의해서 Amalgam 합금, Ni-Cr alloy의 Crown용 Verabond, Denture용 Talladium $^{TM}alloy$로 각각 24개의 총 72의 시편을 하악 제1대구치근 원심 치관 폭경과 임상에서의 MOD cavity를 고려하여 제작하였고 인공 타액 80ml를 담은 200ml 용 비이커에 시편을 넣어 0mm, 7mm, 40mm 거리에서 7일 후 갈바닉 부식을 측정하였다. 유리금속은 유도 플라즈마 방출 분광기(Inductively Coupled Plasma - Atomic Emission Spectrometer(ICP-AES, JY-50P, VG Elemental Co. France)로 전해액내의 Cu, Ag, Ni, Cr, Sn, Zn, Hg를 정량 분석했으며 그 결과 다음과 같은 결론을 얻었다. 첫째, Cu, Sn, Ag, Hg, Zn은 아말감이 금 합금과 접촉했을 때가 크라운용 Ni-Cr alloy와 덴쳐용 Talladium alloy 보다 아주 많이 유리 했으며 금 합금이 구강조직과 생체 적합성이 가장 좋다지만 아말감과 함께 있을 때 가장 불리 했슴을 알 수 있었다. 둘째, 아말감이 금 합금과 접촉했을 때, 금 합금의 조성에서 Ni, Cr 같은 중금속이 함유되지 않았기 때문인지 전혀 유리되지 않았으나 Sn은 조성에는 없었지만 $227.1{\pm}18.0035{\mu}g/cm^2$나 유리 되었고 Hg도 유리되었는데 이는 아말감 자체의 유리 물질임을 추측할 수 있었다. 셋째, 아말감 합금과 금 합금 사이에서의 0mm, 7mm, 40mm 거리에서는 Cu, Ag는 유의성이 있었으며 Hg는 유의성이 없었다. 이는 금합금은 절대 아말감과 같이 사용해서 안되며 이종 보철물 사이의 거리에 관계없이 사용을 금해야 하는 것으로 사료된다. 넷째, 아말감합금이 Crown용 Ni-Cr 합금과 접촉했을 때 아말감의 Ag이 유리 되지 않았으며 Zn, Ni, Sn, Hg, Cu의 순으로 유리되었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 다섯째, 아말감합금이 Denture용 Talladium alloy 합금과 접촉했을 때 0mm, 7mm, 40mm 거리에서도 유의성이 있었다. 0mm, 7mm, 40mm 거리에 따라서 유의성이 있었다. Hg는 유리 되지 않았지만 중금속인 Ni, Cr은 유리되었고 반대 악궁이나 거리가 떨어져 있으면 접촉보다 Hg의 유리가 적었다. 여섯째, 인공 타액에서 접촉 시 Amalgam alloy와 Gold, Verabond, Talladium alloy의 Cu, Sn, Ag, Hg, Zn, Ni, Cr의 ICPES 검사 결과 Cu, Hg가 유의성을 있었다. 일곱째, 인공타액에서 아말감합금과 두 비귀금속인 Ni-Cr alloy(crown용), Denture용 Talladium alloy가 접촉한 경우 거리에 따른 Hg, Ni, Cr의 유리 부산물에서 유의성을 확인했다.

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팔라듐 표면처리를 통한 Massive Spalling 현상의 억제 (Retardation of Massive Spalling by Palladium Layer Addition to Surface Finish)

  • 이대현;정보묵;허주열
    • 대한금속재료학회지
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    • 제48권11호
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    • pp.1041-1046
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    • 2010
  • The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

Sn-Bi도금 $Sn-3.5\%Ag$ 솔더를 이용한 Capacitor의 저온 솔더링 (Lower Temperature Soldering of Capacitor Using Sn-Bi Coated $Sn-3.5\%Ag$ Solder)

  • 김미진;조선연;김숙환;정재필
    • Journal of Welding and Joining
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    • 제23권3호
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    • pp.61-67
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    • 2005
  • Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

신안침몰선 인양 중국 동전의 화학조성 (CHEMICAL COMPOS IT80N OF AHCIENT CH INESE COINS RICOVIRID FROM THI SHINAN SHIPWRECK)

  • 이창근;강대일
    • 보존과학연구
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    • 통권10호
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    • pp.1-40
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    • 1989
  • Between 1976 and 1984 approximately 26.7 tons of Chinese coins were recovered from a shipwreck which was found at the seabed of the Shin an area in the south-western coast of the Korean peninsula. Elements, Cu, Pb, Sn, Fe, Sb, As, Zn, Ag, Ni, Co and Mn, of 54 pieces of the coins were determined by Inductively Coupled Plasma Atomic Emission Spectroscopy(ICP-AIS). The result shows that Ch, Pb, and Sn were found to be major elements roughly the coins with the ratio of 7 : 2 : 1, respectively. Trace elements were classified into 3 levels according to the avarage concentration : Fe,As and Sb(0.1-0.5%), Ag, Mi, Co and Zn(100-1000ppm) and Mn(10ppm). Some systematic tendencies are observed in the composition change with a function of their minting ages .The Wuzhu coins(오수전) from the Eastern Han dynasty(A.D.25-219 )are much more abundant in Cu than the coins of Tang dynasty(A.D.618-907) and later periods. Major element compositions of the Kai -tong Vuan-Bao(개통원보) coins from the Tang dynasty, were remarkably variable. In general, however, the Tang dynasty coins were much more abundant in Cu than the Song dynasty(A.S.S60-1279) coins. The amount of major elements Cu and Sn decreases while that of Pb in creasesby passage of age from the Bei Song dynasty(A.D.960-1127) to later Nam Song dynasty (A.D.1127-1279 ). It means that the quality of coins mere degraded. The amounts of trace elemends(Fe, As, Co, Hn) increases with the above age. High amounts of trace elements are supposed to be a reflection of immaturity of minting techniques or use of impurity-rich raw materials. The Jin dynasty(A.D.1125-1234) coins are found to be rich in Sn and thus contain Pb as the third component. It is quite different from the coins of the Song dynasty. The Zhi-dai Tong-Bao(지대통보) coins of the Yuan dynasty from A.0.1310 are much more abundant in Cu and Sn than those of the Nam Song dynasty .

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