• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.327-332
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• 2021

At the package level, semiconductor reliability inspections involves mounting a semiconductor chip package on a test socket. The form of the test socket is basically determined by the form of the chip package. It also acts as a medium to connect with test equipment through mechanical contact of the leads and socket leads in the chip package, and it minimizes signal loss in a signal transmission process so that an inspection signal can be delivered well to the semiconductor. In this study, a technique was applied to examine the interdependence of adjacent electrical transfer routes and the structure of adjacent electrical transfer paths. The goal was to enable short-circuit testing of fewer than 100 silicon test sockets through a single interface for life tests and precision measurements. The test results of the developed device show a test precision of 99% or more and a simultaneous test speed characteristic of 0.66 sec or less.