• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.1105-1110
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• 2008

An experimental study was performed to control Ice Packing Factor (IPF) of ice slurry in a pipe in a real time. This paper presented the concept that IPF can be adjusted by the amount of the solution contained to ice slurry. Based on this concept, we designed IPF controller consisting of the outlet tube providing ice slurry and the upper tube discharging only a solution through holes, and investigated the technical validity and efficiency of the controller experimentally. As a result, the original proposed IPF controller could not control IPF of ice slurry in a pipe. This is because an ice of ice slurry was drained out into not only the outlet but also the upper of the controller due to the size of the holes relatively large compared to the ice particle. Therefore, we changed the hole size of IPF controller surface using fine meshes and then, observed that IPF in a pipe was increased by $4{\sim}7$ percent when the hole size was $80{\mu}m$ and less.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.11
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• pp.743-750
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• 2007

In this study, ice slurry generator using air cylinder was designed and manufactured to investigate the heat transfer characteristic of the ice slurry generator. The ice slurry generator has the same shape as the shell-and-tube type heat exchanger. Refrigerant is flowing in the shell side and ethylene glycol solution in the tube side. The experiment was conducted on performance of ice slurry generator using air cylinder with standard condition and the results are plotted on the time scale. The experimental tests on the various concentration of ethylene glycol solution, the various solution velocity in the tube side and the various tube size have been carried. For the above experimental conditions, ice making characteristics of the ice slurry generator are evaluated in terms of the overall heat transfer coefficient. And the experimental results show that the overall heat transfer coefficient of the system is increased as the tube size and the concentration of ethylene glycol decreases.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.12
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• pp.825-832
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• 2008

The ice slurry maker which can produce the ice slurry well for the ice particle in-flowing condition was revised. We removed the stagnant region at the top of the ice slurry maker, and IPF 40% could be realized. The IPF controller with 6 mm diameter holes at the bottom was designed. But the IPF controller with only 6 mm diameter holes could not control IPF in a pipe. This is because the ice particles at ice slurry flow exist homogeneously not only at the upper part but also at the bottom part. We changed the hole size of IPF controller surface using fine meshes and then, IPF in a pipe was increased by 70% when the hole size was $80{\mu}m$ and less.

• Tribology and Lubricants
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• v.34 no.6
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• pp.226-234
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• 2018

Copper chemical mechanical planarization (CMP) has become a key process in integrated circuit (IC) technology. The results of copper CMP depend not only on the mechanical abrasion, but also on the slurry chemistry. The slurry used for Cu CMP is known to have greater chemical reactivity than mechanical material removal. The Cu CMP slurry is composed of abrasive particles, an oxidizing agent, a complexing agent, and a corrosion inhibitor. Citric acid can be used as the complexing agent in Cu CMP slurries, and is widely used for post-CMP cleaning. Although many studies have investigated the effect of citric acid on Cu CMP, no studies have yet been conducted on the interfacial friction characteristics and step height reduction in CMP patterns. In this study, the effect of citric acid on the friction characteristics and step height reduction in a copper wafer with varying pattern densities during CMP are investigated. The prepared slurry consists of citric acid ($C_6H_8O_7$), hydrogen peroxide ($H_2O_2$), and colloidal silica. The friction force is found to depend on the concentration of citric acid in the copper CMP slurry. The step heights of the patterns decrease rapidly with decreasing citric acid concentration in the copper CMP slurry. The step height of the copper pattern decreases more slowly in high-density regions than in low-density regions.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.4
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• pp.618-623
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• 2004

This paper has dealt with the heat storage characteristics of gel type micro size latent heat storage material slurry. The heat release operation to the gel type micro size latent heat storage material slurry was carried out using hot air bubbles by direct contact heat exchange. This experiment was carried out using phase change material of n-paraffin so the heat release amount is higher than cold water system. The parameters of this experiment were concentration of latent heat phase change material, height of heat release bath and inlet velocity of hot air. The main results obtained are as follows : (1) The effect of concentration of latent heat phase change material dispersed with water is very affective to the direct contact heat exchange between hot air and gel type micro size latent heat storage material slurry. (2) It is clarified that the most effective concentration of latent heat phase change material dispersed with water exists around 20mass% at this type of direct heat exchange model experiment.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• Korean Journal of Food Science and Technology
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• v.33 no.2
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• pp.205-208
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• 2001

The bitterness of brewers yeast slurry decreased by washing with mild caustic soda solution followed by washing with 0.85% (w/v) NaCl solution The higher concentration of caustic soda was, the lower the bitterness unit(BU) of washed yeast slurry was. The lethal rate of yeast cells increased. When the concentration of caustic soda solution increased from 0.05%(w/v) to 0.25%(w/v), the BU of brewers yeast slurry was decreased from 45 to 3, but yeast cells viability decreased from 93% to 0%. The optimum washing conditions of brewers yeast slurry were as follows: the concentration of caustic soda solution was $0.07{\sim}0.1%$(w/v) and the contact time of brewers yeast slurry with caustic soda was $10{\sim}20$ minutes. The similar washing effect was obtained when the brewers yeast slurry was washed with 20%(v/v) ethanol solution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.38-41
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• 2004

The oxidizer plays an important role in the metal chemical mechanical polishing(CMP) slurry. Currently, the oxidizer used in CMP slurry is nearly divided into several kinds such as $Fe(NO_3)_3$, $H_2O_2$, $KIO_3$, and $H_5IO_6$. It is generally known that oxidizer character of $H_2O_2$ is more effective than other oxidizers. In this work, we have been studied the characteristics for the $H_2O_2$ concentration of copper slurry, which can applicable in the recent semiconductor manufacturing process. Also, it plays an important role in the planarization of copper films using copper slurries during micro-electronic device fabrication. In this work, we confirmed that removal rate of Cu/TaN changed by $H_2O_2$ concentration on copper slurry. And we used $KMnO_4$ in the measurement method of $H_2O_2$. In analysis results, we confirmed that the difference of results is large. We thought that the difference was due to organic component existence. So in titration method of $H_2O_2$ concentration, we used $Na_2S_2O_3$ instead of $KMnO_4$ as solution. Consequently, using the titration method, we could calculate correct data reduced error. And $H_2O_2$ concentration has been adjusted to the target concentration of 0.1 wt%.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.807-812
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• 2015

A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.1
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• pp.56-61
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• 2002

Porous clay ceramics was fabricated using the surfactant as a foaming agent in the secondary-clay produced at Young-Am area in Chun-Nam province. The concentration of surfactant in ceramic slurry was the key factor controlling the pore characteristics and physical properties of the porous ceramics. The more increase of the surfactant concentration increase the more foaming ability and the stability of foamed layer were improved, but the foaming ability was limited within 6.0 wt% of surfactant because the initial viscosity of the slurry increased with increasing the amounts of surfactant. The formed specimen were sintered at both $1150^{\circ}C$ and $1200^{\circ}C$, the porous ceramics showed 0.9 of specific gravity, 50% of water absorption, 45% of apparent porosity, 14% of shrinkage and 70 kg/$\textrm{cm}^2$ of compressive strength.