• Laser Solutions
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• v.17 no.1
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• pp.13-16
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• 2014

Indium Tin Oxide (ITO) has been used widely for transparent conducting thin films. In this work, the feasibility of a laser sintering process to fabricate ITO thin films on flexible substrates is examined. Nanoparticles of ~10 nm were spin coated on a Si wafer and then sintered by a KrF excimer laser. The sintered structure was characterized by scanning electron microscopy. Polycrystalline structures were fabricated by the process without thermally damaging the substrate. The electrical resistivity of the film was reduced to ~ 1/1000 of the initial value. This work demonstrates that nanosecond laser sintering of ITO particles can be a useful tool to fabricate ITO films on various flexible substrates.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.121-121
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• 2018

Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.

• Journal of the Korean Ceramic Society
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• v.35 no.12
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• pp.1308-1315
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• 1998

Effects of particle size of alumina on densification behavior during liquid-phase sintering of alumina-talc system were investigated with emphasis on particle rearrangement process. In the case of using coarse alu-mina powder densiication of specimens was rapidly accelerated after formation of liquid phase due to easy particle rearrangement process with addition of talc and increase of sintering temperature. On the contrary when fine alumina powder was used premature densification of alumina matrix region formed before for-mation of liquid phase rigid skeleton structure and then it seemed to inhibit rearrangement process during crease of sintering temperature. As results the densification of specimens using coarse alumina powder was higher than that of the case of using fine one.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.7
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• pp.1-9
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• 2022

Peeling and dimensional deformation that occur during a manufacturing process are accompanied by an increase in the manufacturing cost and production time caused by manufacturing defects. In order to solve this problem, it is essential to predict risk factors at the design stage through computational analysis of the additive manufacturing process and to control shape distortion due to residual stress. In this study, the dimensional characteristics were improved by applying the distortion compensation design through computational analysis to minimize the distortion occurring in the DMLS(Direct Metal Laser Sintering) method of the metal additive manufacturing process.

• Journal of Powder Materials
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• v.5 no.4
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• pp.258-264
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• 1998

The initial sintering behaviour of the powder injection molded (PIMed) W-l5wt%Cu nanocomposite powder was investigated. The W-Cu nanocomposite powder was produced by the mechanochemical process consisting of high energy ball-milling and hydrogen reduction of W blue powder-CuO mixture. Solid state sintering of the powder compacts was conducted at $1050^{\circ}C$ for 2~10 hours in hydrogen at mosphere. The sintering behaviour was examined and discussed in terms of microstructural developments such as W-Cu aggregate formation, pore size distribution and W grain growth. The volume shrinkage of PIM specimen was slightly larger than that of PM(conventional PM specimen), being due to fast local densification in the PIM. Remarkable decrease of carbon and oxygen in the PIM enhanced local densification in the early stage of solid state sintering process with eliminating very fine pores less than 10 nm. In addition, such local densiflcation in the PIM is presumably responsible for mitigating of W-grain growth in the initial stage.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.181-186
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• 2008

In this study, tantalum (Ta) compacts were fabricated in a spark plasma sintering (SPS) process and their microstructure and mechanical properties were investigated. Ta compacts with a density of 99% were successfully fabricated by controlling the sintering conditions of the current and the temperature. The density and hardness were increased as the sintering temperature increased. The $Ta_2C$ compound was observed at the surface of the compacts due to the contact between the Ta powder and graphite mold during the sintering process. The main fracture mode showed a mixed type with intergranular and transgranular modes having some roughness.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.272-273
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• 2006

A new process of pulsed electric current sintering was developed. It combines compaction with activated sintering effectively and can manufacture bulky nano-crystalline materials very quickly. A nano-structured steel is obtained with high relative density and hardness by this process. The average grain size of iron matrix is 58nm and the carbide particulate size is less than 100 nm. The densification temperature of ball-milled powders is approximately $200^{\circ}C$ lower than that of blended powders. When the sintering temperature increases, the density of as-sintered specimen increases but the hardness of as-sintered specimen first increases and then decreases.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.1273-1275
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• 1996

Moisture measurements of s intering materials were performed using the simulator which can simulate various conditions taking place at the belt-conveyor of sintering process. The moisture sensor used in this experiment is NIR moisture meter(JE-330, KETT Electric Lab.). Using the simulator, we measured the moisture contents of sintering materials at different conditions. We found that the moisture content decreased as the rotation speed increased and the size of the sintering materials became smaller.

• Journal of Powder Materials
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• v.9 no.1
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• pp.50-60
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• 2002

SPS(Spark Plasma Sintering ) is known to be an excellent sintering method for porous materials. In the present work an attempt has been made of fabricating porous 316L Stainless steel with good mechanical properties by using controlled SPS process Porosity was 21%~53% at sintering temperature of $600^{\circ}C$~100$0^{\circ}C$ The limit of porosity with available mechanical strength was 30% at given experimental conditions. Porosity can be controlled by manipulating the intial height of the compact by means of the supporter and punch length. The applied pressure can be exerted entirely upon the supporter, giving no influence on the specimen. The specimen is then able to be sintered pressurelessly. In this case porosity could be controlled from 38 to 45% with good mechanical strength at sintering temperature of 90$0^{\circ}C$. As the holding time increased, neck between the particles grew progressively, but shrinkage of the specimen did not occur, implying that the porosity remained constant during the whole sintering process.