• Title/Summary/Keyword: Sintered metal wick

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Theoretical Analysis on the Heat Transport Limitation of a Sintered Metal Wick Heat Pipe (소결윅 히트파이프의 열수송 한계에 관한 이론적 해석)

  • Kim Keun-Bae;Kim Yoo
    • Journal of the Korean Society of Propulsion Engineers
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    • v.8 no.4
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    • pp.16-25
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    • 2004
  • Theoretical analysis for predicting the heat transport limitation of a copper powder sintered wick heat pipe was performed. The heat pipe diameter was 8mm and water was used for working fluid. The particle diameter was classified by 5 different meshes, and each capillary pressures and heat transport limitations. thermal resistances were analyzed according to the operating temperatures, wick thicknesses and inclination angles, based on the effective capillary radius($r_c$), porosity($\varepsilon$), Permeability (K). The wick capillary limitation was increased according as the particle diameter and the wick thickness and the operating temperature were increased. As the porosity and the capillary radius were larger. then the heat transport limitation was higher. The thermal resistance was greatly increased according as the wick thickness was increased.

A study on the characteristics of a frozen start up for a variable conductance heat pipe (가변전열 히트파이프의 저온 시동특성에 관한 연구)

  • Hong, Sung-Eun;Kang, Hwan-Kook;Cho, Kwang-Cheal
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.339-345
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    • 2006
  • This these was conducted to investigate tile characteristics of a frozen start up for a VCHP which has water as a working fluid and Nitrogen as a non-condensible gas. The tested heat pipe was made of a copper tube with the outer diameter of 12.7 mm, the length of 340 mm, and the sintered metal wick had the thickness of 0.7 mm. This experiment was conflicted under the thermal load, inclined angle and cooling conditions.

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Cooling Technique for Electronic Equipments using a small scale CPL heat pipe (소형 CPL 히트파이프를 이용한 전자장치 냉각 기술)

  • Kang, Sarng-Woo;Lee, Yoon-Pyo
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1241-1246
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    • 2004
  • The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

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A fundamental Study on the Manufacturing and Operating Characteristics of a Small Scale CPL Heat Pipe (소형 CPL 히트파이프의 제작 및 작동 특성에 관한 기초연구)

  • 안영길;유성열;임광빈;김철주
    • Journal of Energy Engineering
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    • v.12 no.1
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    • pp.17-22
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    • 2003
  • The present study was conducted to obtain the fundamental knowledge on the manufacturing and operating characteristics of a small scale CPL (Capillary Pumped Loop) heat pipe. CPL heat pipes are able to transfer heat effectively at any orientation in a gravitational field over long distances. An experimental model with an evaporator of a circular plate shape was designed and manufactured and its operating performances were tested. A Bronze powder sintered metal plate of 3 mm thick and $\Psi$ 50 mm was used as wick and ethanol was used as working fluid. An experimental apparatus was set up to ascertain the operating conditions oi CPL at different heat load and an surrounding temperature at the condenser was maintained about 13$^{\circ}C$.