• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Composites Research
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• v.37 no.5
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• pp.393-401
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• 2024

Epoxy is a thermosetting polymer with excellent properties such as heat and chemical resistance, making them essential in various industrial fields including electronics. The performance of epoxy is highly dependent on the type of curing agent used. Among them, sulfonium-based latent curing agents are notable for their fast curing speed, high curing hardness, and specificity to certain temperatures, making them attractive for manufacturing anisotropic conductive films in electronic materials where single-component epoxy is required. However, sulfonium-based latent curing agents face challenges in industrial application due to issues with low yield and purity. This study optimized the synthesis conditions for benzyl and naphthyl-type sulfonium curing agents (B-Sul⁺SbF6^-, N-Sul⁺NCyF^-, N-Sul⁺NFSI^-). By adjusting reaction time, reaction temperature, and reactant ratios, yield was maximized, significantly reducing both reaction time and temperature. The three optimized curing agents were evaluated for their thermal and mechanical properties to assess curing behavior and storage stability. The results confirmed that stable curing performance was maintained even after mixing. This study aims to expand the industrial applicability of sulfonium curing agents.