• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.205-216
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• 1994

The purpose of this study is to evaluate of apical plug materials for the contral of extrusion and sealing ability of high-temperature thermoplasticized gutta-percha in plastic root canal blocks. Seventy seven plastic blocks with canal preformed were instrumented with # 50K file 1 mm beyond apical foramen. Blocks were randomly divided into 5 groups of 15 blocks each. Group 1 was filled by high-temperature thermoplasticized gutta-percha only. The another 4 groups were placed with apical plug materials each other and then remaining space was back filled with high temperature thermoplasticized gutta-percha Apical plug materials were used as follows; Group 2: Thermoplasticized gutta-percha (Thermoplasticized gutta-percha group) Group 3 :. Calcium hydroxide powder (Calcium hydroxide group) Group 4 : Silver point (Silver point group) Group 5 : Gutta-percha cone softened by chloroform (Gutta-percha cone group) All the blocks were stored in 100 % relative humidor at room temperature for 14 days. Filling material extruded was removed carefully and then weighed in analytic balance. Each block was placed in centrifuge tube filled with India ink, and then centrifuged for 20 minutes at 3,000 rpm. Apical leakage was measured from the apical foramen to the most coronal level of dye leakage in millimeter by two examiners under a stereoscope. The data were analysed statistically by Student's t-test The obtained results were as follows; 1. The amounts of material extruded through the foramen decreased in all of groups used apical plug materials (P<0.01). 2. Silver point group and gutta-percha cone group were similar linear leakage to high-temperature thermoplasticised gutta-percha technique only (P>0..5). 3. Calcium hydroxide group and thermoplasticized gutta-percha group showed more liner leakage than high-temperature thermoplasticized gutta-percha only (P<0.01, P<0.05). 4. High-temperature thermoplasticized gutta-percha technique with silver point and gutta-percha cone as apical plugs showed less linear leakage and less extrusion of filling material.

• Progress in Superconductivity and Cryogenics
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• v.5 no.3
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• pp.6-10
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• 2003

Silver nano-powder was added to Ma $B_2$ to make (Ag)$_{(x)wt.%}$(Mg $B_2$)$_{(l00-x)wt.%}$ (A $g_{x}$-Mg $B_2$) (10 $\leq$ x $\leq$ 50) composite superconductors to investigate the effect of the Ag nano-powder on the vortex pinning. Pellets made out of the mixed powder were put inside stainless steel tubes, which were sintered at 85$0^{\circ}C$ in Ar atmosphere. No impurity phase was identified for as-rolled samples. However, both the Mg $B_2$ and the A $g_{x}$-Mg $B_2$ composite pellets, when sintered, contain small amount of Mg $B_4$ and MgAg impurity phases. From the magnetization study, it was found that the flux pinning was improved in the high magnetic field region (> 3 T) only when 10w/o Ag was added to Mg $B_2$. The "two step" structures in ZFC M(T) curve gradually increased as the amount of Ag added increased. Pinning centers can be created by adding a suitable amount of Ag nano-powder which is not too large to increase the decoupling between the Mg $B_2$ grains.crease the decoupling between the Mg $B_2$ grains.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.366-369
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• 2003

High T$_{c}$ superconducting lines will be applied as key materials in the areas of power transmission line; magnetic levitation of vehicle; magnetic separation; magnetic energy storage and marine propulsion. A combination method of electrophoresis deposition and zone-melting for preparation of YBaCuO tape is proposed. The submicron particle powder of YBaCuO made by sol-gel method is used in the electrophoresis process. A 40~50${\mu}{\textrm}{m}$ thickness of YBaCuO film on Ag plate could be deposited in about three minutes. After deposition the film is rolled and heat treated in order to increase the density and the adhesion of the film to the Ag plate. Silver(Ag) and lead oxide(PbO) were added in the YBaCuO powder in order to reduce its melting point. The YBaCuO coating with controlled Ag and PbO contents was preliminarily zone-melted at about 945$^{\circ}C$.>.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.303-306
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• 1998

Electroluminescence is occurred when phosphor is located in electric field. Object of this research show powder electroluminescent device (PELD) for high brightness compared with conventional PELD. Single layer of PELD structured as follow (ITO/phosphor + dielectric/silver paste). To investigate optical properties of PELDS, EL spectrum, CIE coordinate system, Brightness of PELDs was measured. The suitable ratio between phosphor and dielectric in single layer of PELD was 7:3(phosphor: dielectric). At 200 V4OO Hz, high performance of PELD which had ratio of 7:3

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1594-1597
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• 2008

Carbon nanotube (CNT) cathodes were fabricated using nano-sized silver powders as a bonding material. The effects of powder size on the field emission properties for the CNT cathode were investigated The better emission properties of CNT cathodes using smaller particles are due to a low sintering temperature of the bonding materials.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1382-1384
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• 1998

Electroluminescence is occurred when phosphor is located in electric field. Object of this research show new type of powder electroluminescent device (PELD) for high brightness compared with conventional PELD. New type of PELD structured as follow ITO/phosphor + dielectric/Silver paste). To investigate optical properties of PELDs, EL spectrum, CIE coordinate system, Brightness of PELDs was measured. The suitable ratio between phosphor and dielectric in new type of PELD was 7:3(phosphor:dielectric). At 200 V 400 Hz, new type of PELD which had ratio of 7:3 was 5700 cd/$m^2$.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.908-909
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• 2006

The HTCC based multilayer structure plasma head unit have some difficulties in fabrication due to complicated post-processes, such as heat treatment at reduced atmosphere, re-bonding of each layer, and silver metallization. On the other hand, LTCC based technology provides relatively simple process for multilayer plasma unit except weak mechanical properties. To overcome this problem a combined scheme using both LTCC and HTCC technology has been developed in our group, recently. In this work, we report the structural design, materials selection, joining of LTCC with HTCC substrate, and co-firing process for the fabrication of multilayered atmospheric plasma head unit.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1243-1244
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• 2006

Five kinds of double stacked 385 (55 x7) filamentary Bi2212/Ag round wires and 55 filamentary tapes with different Ag ratios (silver area/superconductor area) have been fabricated via PIT method, and the effects of Ag ratio and processing factors on critical current density were studied. The effects of the maximum temperature and average filament diameter on critical current density were also studied. The wire of 0.74 mm diameter having Ag ratio 3.7 showed critical current density of $2,218\;A/mm^2$ at 4.2 K, 0 T.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.372-373
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• 2006

Modern business trends call for miniaturization of electronic systems. One of the major impedances in this miniaturization is the conductive and inductive components in chips and circuit boards. Direct Write Technology can write these soft magnetic materials, thus allowing for further miniaturization of inductor devices. Another obstacle in electronics fabrication is the size limitations of thick screen-printing and the material limitations in ink jet printing. Direct Write Technologies address both of these limitations by providing feature sizes less than 20 microns with a wide range of materials possibilities. A discussion of the application of these nano-particulate materials by Direct Write Technologies will be presented.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.330-331
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• 2006

Fabrication of a nano-laminar ceramic composite by sintering thin ceramic plates was examined. Silver-coated glass flakes with a thickness of less than $1{\mu}m$ were consolidated by pulsed current sintering or hotpressing to obtain model composites. The samples sintered at the optimum conditions were fairly dense, and the flakes were aligned by uniaxial press. The metal coating remained on the flakes through the sintering process, and became an interface layer between the flakes. No crack propagation through the transverse direction of the lamellar was observed in the indentation test. The possibilities of high resistance against crack propagation was suggested.