• Journal of the Korean institute of surface engineering
• /
• v.33 no.5
• /
• pp.319-328
• /
• 2000

Silver is known to have such characteristics as low shear strength, good transfer-film forming tendency, and good corrosion resistance. Silver thin films have been prepared by ion plating of physical vapour deposition (PVD) using both argon gas pressure and bias voltage of processing condition. After the silver films were prepared, the properties in them were examined by gas pressure and bias voltage of substrate. Their morphology and crystal orientation were investigated by scanning electron microscopy (SEM) and X-ray diffractor. The properties of film were, also, studied to relate with morphology, X-ray diffraction pattern, and friction coefficient at vacuum ambient. The friction coefficient was stabilized remarkably on deposited films with increasing argon pressure for deposition. Also, the effect of increasing of the bias voltage for deposition resulted in lower friction coefficient and stability in $1.7$\times$10^{-4}$ torr. On the contrary, behavior of friction coefficient was stabilized on deposited films with decreasing the bias voltage in $1.7$\times$10^{-5}$ torr for deposition.

• Proceedings of the Membrane Society of Korea Conference
• /
• 1994.10a
• /
• pp.8-11
• /
• 1994

Disposal of hazardous ions in the aqueous streams is a significant industrial waste problem.. Waste streams from electronics, electroplating, and photographic industries contain metal ions such as copper, nickel, zinc, chromium(IV), cadmium, aluminum, silver, and gold, amongst others in various aqueous solutions such as sulfates, chlorides, fluorocarbons, and cyanides. Typical plating solutions having similar compositions are listed in Table 1. Spent process streams in catalyst manufacturing facilities also contain precious metals such as Ag, Pt, and Pd. Developing an effective recovery process of these metal ions for reuse is important.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.05a
• /
• pp.328-328
• /
• 2012

전기도금 중에서 가장 빠른 시기에 공업화된 것이 은도금이며 귀금속으로서 은의 특성은 장식성과 약품에 대한 민감한 화학특성 때문에 식기나 생활용품에 많이 사용되고 있다. 정보산업의 확대와 함께 전자산업에서 은도금의 수요는 비약적으로 늘었지만, 전도성을 주목적으로 하는 전기 전자산업이 뒤를 이으면서 기계적 특성을 이용한 용도를 들 수 있다. 본고에서는 최근의 습식주석도금의 특성을 중심으로 기술하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.3
• /
• pp.51-56
• /
• 2016

To fabricate a copper (Cu)-based fine conductive filler having antioxidation property, submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property was evaluated. After synthesizing the Cu particles of $0.705{\mu}m$ in average diameter by a wet-reduction process, Ag-coated Cu particles were fabricated by successive Ag plating using ethylene grycol solvent. Main process parameters in the Ag plating were the concentration of reductant (ascorbic acid), the injection rate of Ag precursor solution, and the stirring rate in mixed solution. Thus, Ag plating characteristics and the formation of separate fine pure Ag phase were observed with different combinations of process parameters. As a result, formation of the separate pure Ag phase and aggregation between Ag-coated Cu particles could be suppressed by optimization of the process parameters. The Ag-coated Cu particles which were fabricated using optimal conditions showed slight aggregation, but excellent antioxidation property. For example, the particles indicated the weight gain not exceeding 0.1% until $225^{\circ}C$ when they were heated in air at the rate of $10^{\circ}C/min$ and no weight gain until 75 min when they were heated in air at $150^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.11
• /
• pp.88-93
• /
• 2017

It is important to develop a simple method oftuning localized surface plasmon resonance(LSPR) properties, due to their numerous applications. In addition, the careful examination of the shape, size and combination of metal nanoparticles is useful for understanding the relation between the LSPR properties and metal nanostructures. This article describes the dependence of theLSPR properties on the arrays of metal nanoparticles obtained from a block copolymer(BCP) micellar thin film. Firstly, two different Au nanostructures, having a dot and ring shape, were fabricated using conventional block copolymer micelle lithography. Then, Ag was plated on the Au nanostructures through the silver mirror reaction technique to obtain Au/Ag bimetallic nanostructures. During the production of these metallic nanostructures, the processing factors, such as the pre-treatment by ethanol, silver mirror reaction time and removal or not of the BCP, were varied. Once the Au nanoparticles were synthesized, Ag was properly plated on the Au, providing two distinguishable characteristic plasmonic bands at around 525nm for Au and around 420nm for Ag, as confirmed bythe UV-vis measurements. However, when a small amount of Au seed nanoparticles, which accelerate the Ag plating speed,was formed by usinga block copolymer with a relatively highmolecular weight, all of the Au surfaces were fully covered by Ag during the silver mirror reaction, showing only the characteristic peak for Ag at around 420nm. The Ag plating technique on Au nanoparticles pre-synthesized from a block copolymer is useful to study the LSPR properties carefully.

• Journal of Sericultural and Entomological Science
• /
• v.49 no.1
• /
• pp.24-27
• /
• 2007

Silkworm fed on the mulberry leaf mixed with silver nanoparticle to produce silver-nanoparticle embedded cocoon. Comparative analysis of silver content of cocoon shell, percentage of pupation and percentage of cocoon-shell weight showed that the optimum concentration and the feeding period of mulberry leaf mixed with silver nanoparticle were 500 ppm and the period from 3 day 5 instar to mounting of silkworm. The silver content of cocoon was observed variously by silkworm breedings. C212 variety makes pale yellow cocoon with the highest silver content(69%). Using the scanning electron microscope, we showed that the size of silver nanoparticles in silk was observed from 26.98 to 99.81nm. Silver-nanoparticle embedded silk is expected to use as high valuable application owing to the different functional properties including antibiotic characteristics and mechanical and electronic properties. The applicable fields expected is antistatic and/or electronic products with biological degradable natural materials.

• The Journal of Korean Academy of Prosthodontics
• /
• v.34 no.1
• /
• pp.125-142
• /
• 1996

Bond strength of four different cements to dental casting alloys which were treated with #600 emery, tin-plating, and $50{\mu}m$ sandblasting were evaluated. The alloy specimens were Type III Gold alloy(Degulor C), Palladium-Silver alloy(Pors on 4), Nickel-Chromium(Rexillium III) alloy, which were embedded in acrylic resin disc. The specimens were treated with #600 emery and tin plating, #600 emery and sandblasting, then bonded using Fuji I, Ketac Cem(Glass ionomer cements), Poly F, Livcarbo(Polycarboxylate cements). The specimens were immersed in water for 24 hours and shear bond strengths were evaluated by Instron Machine. Tin plated, sandblasted, and debonded alloy surfaces were observed using scanning electron microscope. On the basis of this study, the following conclusions could be drawn. 1. In the tin plated alloy group, increase in bond strength of glass ionomer cements was statistically insignificant. 2. In the tin plated alloy group, increase in bond strength of polycarboxylate cements was statistically significant, except nickel-chromium alloy. 3. Sandblasted alloy group showed higher bond strength than that of tin-plated alloy group.

• Transactions of the Korean hydrogen and new energy society
• /
• v.28 no.1
• /
• pp.70-76
• /
• 2017

To synthesize copper nanoparticle a thermal decomposition was adopted. And to solve the problem of surface oxidation of the synthesized copper powder an electroless Ag plating method was used. The size and shape of synthesized Cu nanoparticle were affected by the size of copper oxalate used as a precursor, reaction solvent, reaction temperature and amount of reducing agent. Especially reaction solvent is dominant factor to control shape of Cu nano-particle which can have the shapes of sphere, polygon and rod. In case of glycerol, it produced spherical shape of about 500 nm in size. Poly ethylene produced uniform polygonal shape in about 700 nm and ethylene glycol produced both of polygon and rod having size range between 500 and 1500 nm. The silver coated copper powder showed a high electrical conductivity.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.97-104
• /
• 2016

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.5
• /
• pp.275-278
• /
• 2014

We deposited TiAgN and ZrAgN nanocomposite coatings on pure Titanium specimens, by using arc ion plating (AIP) with single alloy targets. TiAg ZrAg alloy targets of 5 wt.%, 10 wt.% silver content by vacuum arc remelting (VAR), followed by homogenization for 2 hours at $1,100^{\circ}C$ in non-active Ar gas atmosphere and characterized these samples for morphology and chemical composition. We investigated the biocompatibility of TiAg and ZrAg alloys by examining the proliferation of L929 fibroblast cells by MTT test assay, after culturing the cells ($4{\times}10^4cells/cm^2$) for 24 hours; and exploring the antibacterial properties of thin films by culturing Streptococus Mutans (KCTC3065), using paper disk techniques. Our results showed no cytotoxic effects in any of the specimens, but the antibacterial effects against Streptococus Mutans appeared only in the 10 wt.% silver content specimens.