• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.109-115
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• 2022

The demand for metal 3D printing technology is increasing in various industries. The materials commonly used for metal 3D printing include aluminum alloys, titanium alloys, and stainless steel. In particular, for applications in the aviation and defense industry, aluminum alloy 3D printing parts are being produced. To improve the corrosion resistance in the 3D printed aluminum alloy outputs, a post-treatment process, such as chromate coating, should be applied. However, powdered materials, such as AlSi7Mg and AlSi10Mg, used for 3D printing, have a high silicon content; therefore, a suitable pretreatment is required for chromate coating. In the desmut step of the pretreatment process, the chromate coating can be formed only when a smut composed of silicon compounds or oxides is effectively removed. In this study, suitable desmut solutions for 3D printed AlSi7Mg and AlSi10Mg materials with high silicon contents were presented, and the chromate coating properties were studied accordingly. The smut removal effect was confirmed using an aqueous desmut solution composed of sulfuric, nitric, and hydrofluoric acids. Thus, a chromate coating was successfully formed. The surfaces of the aluminum alloys after desmut and chromate coating were analyzed using SEM and EDS.

• Restorative Dentistry and Endodontics
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• v.20 no.2
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• pp.487-507
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• 1995

Composite resin repair requires strong bond strength between the new and old materials. The objective of the current study was to identify the optimal treatments for sufficient bond strengths. Bondings between same kinds of materials and cross bondings using chemical curing composites and light curing composites were tested. Surface treatments included the methods of sand-blasting, acid etching and coating of bonding agent. Seven kinds cases of combinations from three kinds of methods were experimented and compared with a control group of which surfaces were highly polished. Measurements of shear bond strength and observations of surface morphologic changes using a scanning electron microscope were done. Following conclusions were drawn : 1. The highest bond strength among composite resins were exhibited by the treatment of the sand-blasting and the coating of bonding agent. 2. Acid etched surfaces showed the lowest bond strength. Bond strengths obtained from experimental groups including acid etching were lower than those obtained from same kinds of experimental groups without acid etching. 3. Simple method of the coating of bonding agent produced the slightly increased bond strength on chemical curing composite and reduced bond strength on light curing composite. 4. Bonding surfaces of chemical curing composite resin showed slightly higher bond strengths than light curing composite resin, however significant differences were not confirmed statistically. 5. More significant irregular surfaces were created by sand-blasting method than acid etching method. 6. A principal component of fillers of both resins was silicon. Acid etching method produced the seperations and degradations of fillers, these were significant on light curing composite resins which containing barium fillers.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.59.1-59.1
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• 2015

In the Linford group at Brigham Young University we have recently developed three new sets of materials for three different areas of separations science: thin layer chromatography (TLC), high performance liquid chromatography (HPLC), and solid phase microextraction (SPME). First, via microfabrication we have grown patterned carbon nanotube (CNT) forests on planar substrates that we have infiltrated with inorganic materials such as silicon nitride. The coatings on the CNTs are conformal and typically deposited in a process like low pressure chemical vapor deposition. The resulting materials have high surface areas, are porous, and function as effective separation devices, where separations on our new TLC plates are typically significantly faster than on conventional devices. Second, we used the layer-by-layer (electrostatically driven) deposition of poly (allylamine) and nanodiamond onto carbonized poly (divinylbenzene) microspheres to create superficially porous particles for HPLC. Many interesting classes of molecules have been separated with these particles, including various cannabinoids, pesticides, tricyclic antidepressants, etc. Third, we have developed new materials for SPME by sputtering silicon onto cylindrical fiber substrates in a way that creates shadowing of the incoming flux so that materials with high porosity are obtained. These materials are currently outperforming their commercial counterparts. Throughout this work, the new materials we have made have been characterized by X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, scanning electron microscopy, transmission electron microscopy, etc.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• Tribology and Lubricants
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• v.12 no.1
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• pp.56-65
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• 1996

The result of wear test for ceramic materials was assessed by Scf parameter to verify the usefulness of the proposed Scf parameter. Friction and wear tests were carried out with ball on disk type. The materials used in this study were HIPed Alumina $(Al_2O_3)$, Silicon carbide (sic), Silicon nitride $(Si_3N_4)$ and Zirconia $(ZrO_2)$. The tests were carried out at room temperature with self mated couples of ceramic materials under lubricated condition. Turbine oil was used as a lubricant. In this test, increasing the load, specific wear rates and wear coefficients of four kinds of ceramic materials had a tendency to increase. The wear coefficients of ceramic materials were in order of $Al_2O_3, SiC, Si_3N_4, ZrO_2$. Worn surfaces investigated by SEM had residual surface cracks and wear particles caused by brittle fracture. As the fracture toughness of ceramic materials was higher, wear resistance more increased. The roughness of worn surface had correlation with wear rate. The wear rate(W$_{s}$) and Scf parameter showed linear relationship in log-log coordinates and the wear equation was given as $W_s = 5.52 $\times$ Scf^{5.01}$.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.687-687
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• 2013

In rearpoint contact solar cell and the PERC (passivated emitter rear contact) type cell, surfaces were passivated by SiO2 or Al2O3 to increase solar cell efficiency. Therefore, we have investigated the effect of surface passivation for crystalline silicon solarcell using mass-production atomic layer deposited (ALD) Al2O3. The patttern which consists of cylinders with 100um diameter and 5um height was formed by PR patterning on Si (100) substrate and then Al2O3 of about 10nm and 20nm thickness was deposited by ALD. The pattern in 10 nm Al2O3 film was removed by dipping in aceton solution for about 10 min but the pattern in 20 nm Al2O3 film was not. The influences of process temperature and heat treatment were investigated using microwave photoconductance decay (PCD) and Quasi-Steady-State photoconductance (QSSPC). The solar cell process used in this work combines the advantage of using the applicability of a selective deposition associated with a ALD passivation and the use of low-cost screen print for the contacts formation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.58-61
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• 2012

In our report a relatively simple process for fast nano-texturing of p-type(100) CZ- silicon surface using silver catalyzed wet chemical etching in aqueous hydrofluoric acid (HF) and hydrogen peroxide solution($H_2O_2$) at room temperature. The wafers were saw-damaged by NaOH(6 wt%) at $60^{\circ}C$ for 150s. To obtain a nano-structured black surface, a thin layer of silver with thickness of 1 - 10 nm was deposited on the surfaces by evaporation system. After this process the samples were etched in HF : $H_2O_2$ : $H_2O$ = 1:5:10 at room temperature for 80s - 220s. Due to the local catalytic of the Ag clusters, this treatment results in the nano-scale texturing on the surface. This resulted in average reflectance values less than 9% after the silver on the surface of the wafers were removed.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.107-114
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• 2017

In this investigation, we describe a metrological technique for surface and thickness profiles of a silicon (Si) wafer by using a 6 degree of freedom (DOF) stitching method. Low coherence scanning interferometry employing near infrared light, partially transparent to a Si wafer, is adopted to simultaneously measure the surface and thickness profiles of the wafer. For the large field of view, a stitching method of the sub-aperture measurement is added to the measurement system; also, 6 DOF parameters, including the lateral positioning errors and the rotational error, are considered. In the experiment, surface profiles of a double-sided polished wafer with a 100 mm diameter were measured with the sub-aperture of an 18 mm diameter at $10\times10$ locations and the surface profiles of both sides were stitched with the sub-aperture maps. As a result, the nominal thickness of the wafer was $483.2{\mu}m$ and the calculated PV values of both surfaces were $16.57{\mu}m$ and $17.12{\mu}m$, respectively.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.04a
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• pp.809-809
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• 2013

We report a new method for highly controllable local patterning of a hydrogel on microfabricated cantilevers and fabrication of all hydrogel microcantilevers. We constructed a dynamic mask based photolithography setup using a commercial beam projector, a 3-axis microstage and other optical components. Dynamic masks generated from the beam projector controlled the shape, size, and position of hydrogel patterns while the 3-axis microstage mainly controlled the thickness of hydrogel patterns and hydrogel microcantilevers. Using the constructed setup, polyethyleneglycol diacrylate (PEGDA) was patterned on microfabricated cantilevers in a highly controlled manner. Currently, the smallest PEGDA patternable is a 5-${\mu}m$-diameter circle with a thickness of ~$10{\mu}m$. To confirm thicknesses of patterned PEGDAs on silicon microcantilevers, resonance frequencies of microcantilevers were measured before and after each PEGDA patterning. Thicknesses extracted from resonance measurements showed good agreement with measurements using an optical microscope. In addition, PEGDA microcantilevers with various dimensions and thicknesses were fabricated on glass and silicon substrates. Surfaces of fabricated all hydrogel microcantilevers were flat enough to facilitate other post processing and to be used for various sensing applications.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.3_1spc
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• pp.544-550
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• 2013

A grooved surface with anisotropic wettability was fabricated on a silicon substrate using photolithography, reactive ion etching, and a KOH etching process. The contact angles (CAs) of water droplets were measured and compared with the theoretical values in the Cassie state and Wenzel state. The experimental results showed that the contact area between a water droplet and a solid surface was important to determine the wettability of the water. The specimens with native oxide layers presented CAs ranging from $71.6^{\circ}$ to $86.4^{\circ}$. The droplets on the specimens with a native oxide layer could be in the Cassie state because they had relatively smooth surfaces. However, the CAs of the specimens with thick oxide layers ranged from $33.4^{\circ}$ to $59.1^{\circ}$. This indicated that the surface roughness for a specimen with a relatively thick oxide layer was higher, and the water droplet was in the Wenzel state. From the CA measurement results, it was observed that the wetting on the grooved surface was anisotropic for all of the specimens.