• 제목/요약/키워드: Silicon solar wafer

검색결과 198건 처리시간 0.032초

A study on the oxide semiconductor $[(I_{n2}O_3)_x{\cdot}(S_nO_2)_{1-x}]_{(n)}/Silicon(p)$, solar cells fabricated by two source evaporation (이가열원(二加熱源) 증착법(蒸着法)에 이한 산화물(酸化物) 반도체(半導體) $[(I_{n2}O_3)_x{\cdot}(S_nO_2)_{1-x}]_{(n)}/Silicon(p)$, 태양전지(太陽電池)에 관한 연구(硏究))

  • Jhoon, Choon-Saing;Kim, Yong-Woon;Lim, Eung-Choon
    • Solar Energy
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    • 제12권2호
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    • pp.62-78
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    • 1992
  • The solar cells of $ITO_{(n)}/Si_{(p)}$, which are ITO thin films deposited and heated on Si wafer 190[$^{\circ}C$], were fabricated by two source vaccum deposition method, and their electrical properties were investigated. Its maximum output is obtained when the com- position of the thin film consist of indium oxide 91[mole %] and thin oxide 9[mole %]. The cell characteristics can be improved by annealing but are deteriorated at temperature above 600[$^{\circ}C$] for longer than 15[min]. Also, we investigated the spectral response with short circuit current of the cells and found that the increasing of the annealing caused the peak shifted to the long wavelength region. And by experiment of the X-ray diffraction, it is shown to grow the grains of the thin film with increasment of annealing temperature. The test results from the $ITO_{(n)}/Si_{(p)}$ solar cell are as follows. short circuit current : Isc= 31 $[mW/cm^2]$ open circuit voltage : Voc= 460[mV] fill factor : FF=0.71 conversion efficiency : ${\eta}$=11[%]. under the solar energy illumination of $100[mW/cm^2]$.

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후열 처리 조건에 따른 a-Si/c-Si 이종접합 태양전지 특성 분석

  • Kim, Kyung Min;Jeong, Dae Young;Song, Jun Yong;Kim, Chan Seok;Koo, Hye Young;Oh, Byung Sung;Song, Jinsoo;Lee, Jeong Chul
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.58.2-58.2
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    • 2010
  • 본 연구에서는 n-type wafer에 비정질 실리콘을 증착한 이종접합 태양전지를 열처리 방법을 이용하여 열처리의 효과를 분석함으로써 이종접합 태양전지에 효율적인 열처리 효과에 대하여 연구하였다. P, N-layer는 PECVD(Plasma-enhanced chemical vapor deposition) I-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 동일한 조건에서 제작하였고 rapid thermal process를 이용하여 진공 중에서 $150^{\circ}C$, $200^{\circ}C$, $220^{\circ}C$, $250^{\circ}C$까지 열처리를 하였다. 열처리 전과 후 QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수 등의 변화를 조사하였다. 열처리 후 Minority carrier life time, Voc 및 광변환 효율이 증가하였다.

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PC1D 기반의 2스텝 도핑을 통한 실리콘 태양전지의 최적화

  • Kim, Yeong-Pil;Jeong, U-Won;Lee, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.256-256
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    • 2009
  • This paper presents a proper condition to achieve above 17 % conversion efficiency using PC1D simulator. Crystalline silicon wafer with thickness of $240{\mu}m$ was used as a starting material. Various efficiency influencing parameters such as rear surface recombination velocity and minority carrier diffusion length in the base region, front surface recombination velocity, junction depth and doping concentration in the Emitter layer. Among the investigated variables, we learn that 2nd doping concentration as a key factor to achieve conversion efficiency higher than 17 %.

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A Study on the Application of Ag Nano-Dots Structure to Improve the Light Trapping Effect of Crystalline Silicon Solar Cell (단결정 실리콘 태양전지의 광 포획 효과 개선을 위한 Ag nano-dots 구조 적용 연구)

  • Choi, Jeong-Ho;Roh, Si-Cheol;Seo, Hwa-Il
    • Journal of the Semiconductor & Display Technology
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    • 제18권3호
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    • pp.19-24
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    • 2019
  • In this study, the Ag nano-dots structure was applied to the textured wafer surface to improve the light trapping effect of crystalline silicon solar cell. The Ag nano-dots structure was formed by the annealing of Ag thin film. Ag thin film deposition was performed using a thermal evaporator. The effect of light trapping was compared and analyzed through light reflectance measurements. The optimization process of the Ag nano-dots structure was made by varying the thickness of Ag thin film, the annealing temperature and time. The thickness of Ag thin films was in the range of 5 ~ 20 nm. The annealing temperature was in the range of 450~650℃ and the annealing time was in the range of 30 ~ 60 minutes. As a result, the light reflectance of 10 nm Ag thin film annealed at 650℃ for 30 minutes showed the lowest value of about 9.67%. This is a value that is about 3.37% lower than the light reflectance of the sample that has undergone only the texturing process. Finally, the change of the light reflectance by the HF treatment of the sample on which the Ag nano-dots structure was formed was investigated. The HF treatment time was in the range of 0 ~ 120 seconds. As a result, the light reflectance decreased by about 0.41% due to the HF treatment for 75 seconds.

Development on New Laser Tabbing Process for Modulation of Thin Solar Cell (박형 태양 전지 모듈화를 위한 레이져 태빙 자동화 공정(장비) 개발)

  • No, Donghun;Choi, Chul-June;Cho, Hyun Young;Yu, Jae Min;Kim, JungKeun
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.58.1-58.1
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    • 2010
  • In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

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Research on Minimizing Output Degradation in HJT Cell Separation Using IR Laser Scribing (IR 레이저 스크라이빙에 의한 HJT 셀 분할 시 출력 감소율 최소화에 대한 연구)

  • Eunbi Lee;Sungmin Youn;Minseob Kim;Jinho Shin;Yu Jin Kim;Jeonghun Kim;Min-Joon Park;Chaehwan Jeong
    • Current Photovoltaic Research
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    • 제12권2호
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    • pp.37-40
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    • 2024
  • One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.

Formation of lotus surface structure for high efficiency silicon solar cell (고효율 실리콘 태양전지를 위한 lotus surface 구조의 형성)

  • Jung, Hyun-Chul;Paek, Yeong-Kyeun;Kim, Hyo-Han;Eum, Jung-Hyun;Choi, Kyoon;Kim, Hyung-Tae;Chang, Hyo-Sik
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제20권1호
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    • pp.7-11
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    • 2010
  • The reduction of optical losses in mono-crystalline silicon solar cell by surface texturing is a critical step to improve the overall cell efficiency. In this study, we have changed the sub-micrometer structure on the micrometer pyramidal structure by 2-step texturing. The Ag particles were coated on the micrometer pyramid surface in $AgNO_3$ solution, and then the etching with hydrogen fluoride and hydrogen peroxide created even smaller nano-pyramids in these pyramids. As a result, we observed that the changes of size and thickness of nano structure on pyramidal surface were determined by $AgNO_3$ concentration and etching time. Using 2-step texturing, the surface of wafers is etched to resemble the rough surface of a lotus leaf. Lotus surface can reduce average reflectance from 10% to below 3%. This reflectance is less than conventional textured wafer including anti-reflection coating.

Fabrication and Characteristics of High Efficiency Silicon PERL (passivated emitter and rear locally-diffused cell) Solar Cells (PERL (passivated emitter and rear locally-diffused cell) 방식을 이용한 고효율 Si 태양전지의 제작 및 특성)

  • Kwon, Oh-Joon;Jeoung, Hun;Nam, Ki-Hong;Kim, Yeung-Woo;Bae, Seung-Chun;Park, Sung-Keoun;Kwon, Sung-Yeol;Kim, Woo-Hyun;Kim, Ki-Wan
    • Journal of Sensor Science and Technology
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    • 제8권3호
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    • pp.283-290
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    • 1999
  • The $n^+/p/p^+$ junction PERL solar cell of $0.1{\sim}2{\Omega}{\cdot}cm$ (100) p type silicon wafer was fabricated through the following steps; that is, wafer cutting, inverted pyramidally textured surfaces etching by KOH, phosphorus and boron diffusion, anti-reflection coating, grid formation and contact annealing. At this time, the optical characteristics of device surface and the efficiency of doping concentration for resistivity were investigated. And diffusion depth and doping concentration for n+ doping were simulated by silvaco program. Then their results were compared with measured results. Under the illumination of AM (air mass)1.5, $100\;mW/cm^2$ $I_{sc}$, $V_{oc}$, fill factor and the conversion efficiency were 43mA, 0.6 V, 0.62. and 16% respectively.

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A Study on Feasibility of the Phosphoric Acid Doping for Solar Cell Using Newly Atmospheric Pressure Plasma Source (새로운 대기압 플라즈마 소스를 이용한 결정질 실리콘 태양전지 인산 도핑 가능성에 관한 연구)

  • Cho, I-Hyun;Yun, Myoung-Soo;Jo, Tae-Hoon;Kwon, Gi-Chung
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • 제27권6호
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    • pp.95-99
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    • 2013
  • Furnace is currently the most important doping process using POCl3 in solar cell. However furnace need an expensive equipment cost and it has to purge a poisonous gas. Moreover, furnace typically difficult appling for selective emitters. In this study, we developed a new atmospheric pressure plasma source, in this procedure, we research the atmospheric pressure plasma doping that dopant is phosphoric acid($H_3PO_4$). Metal tube injected Ar gas was inputted 5 kV of a low frequency(scores of kHz) induced inverter, so plasma discharged at metal tube. We used the P type silicon wafer of solar cell. We regulated phosphoric acid($H_3PO_4$) concentration on 10% and plasma treatment time is 90 s, 150 s, we experiment that plasma current is 70 mA. We check the doping depth that 287 nm at 90 s and 621 nm at 150 s. We analysis and measurement the doping profile by using SIMS(Secondary Ion Mass Spectroscopy). We calculate and grasp the sheet resistance using conventional sheet resistance formula, so there are 240 Ohm/sq at 90 s and 212 Ohm/sq at 150 s. We analysis oxygen and nitrogen profile of concentration compared with furnace to check the doped defect of atmosphere.

Fabrication of high-quality silicon wafers by hot water oxidation (Hot water oxidation 공정을 이용한 고품위 실리콘 기판 제작)

  • Park, Hyo-Min;Tark, Sung-Ju;Kang, Min-Gu;Park, Sung-Eun;Kim, Dong-Whan
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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    • pp.89-89
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    • 2009
  • 높은 소수반송자 수명(life-time)을 가지는 고품위 실리콘 기판은 고효율 실리콘 이종접합 태양전지 제작을 위한 중요 요소 기술 중 하나이다. 본 연구에서는 n-type c-Si 기판을 이용한 고효율 실리콘 이종접합 태양전지제작을 위해 hot water oxidation(HWO) 공정을 이용하여 고품위 실리콘 기판을 제작하였다. 실리콘 기판의 특성 분석은 Qusi-steady state photoconductance (QSSPC)를 이용하여 소수반송자 수명을 측정하였으며, 기판의 면저항 및 wetting angle을 측정하여 공정에 따른 특성변화를 분석하였다. Saw damage etching 된 기판을 웨이퍼 표면으로부터 particle, 금속 불순물, 유기물 등의 오염을 제거하기 위해 $60{\sim}85^{\circ}C$로 가열된 Ammonia수, 과산화수소수($NH_4OH/H_2O_2/H_2O$), 염산 과산화수소수($HCL/H_2O_2/H_2O$) 및 실온 희석불산(DHF) 중에 기판을 각각 10분 정도씩 침적하여, 각각의 약액 처리 후에 매회 10분 정도씩 순수(DI water)에서 rinse하여 RCA 세정을 진행한 후 HWO 공정을 통해 기판 표면에 얇은 산화막 을 형성시켜 패시베이션 해주었다. HF를 이용하여 자연산화막을 제거시 HWO 공정을 거친 기판은 매끄러운 표면과 패시베이션 영향으로 기판의 소수 반송자 수명이 증가하며, 태양전지 제작시 접촉저항을 감소시켜 효율을 증가 시킬수 있다. HWO 공정은 반응조 안의 DI water 온도와 반응 시간에 따라 life-time을 측정하여 진행하였으며, 이후 PE-CVD법으로 증착된 a-Si:H layer 및 투명전도 산화막, 금속전극을 증착하여 실리콘 이종접합 태양전지를 제작하였다.

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