• Laser Solutions
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• v.12 no.4
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• pp.12-16
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• 2009

The engineering ceramic is one of the materials advantageous in various conditions with high strength, endurance at high temperature, abrasion resistance and corrosion resistance, etc. However, due to high strength and high brittleness, ceramic incurs high costs and long time on finishing process required after sintering. So a process for obtaining wanted measurements of them has been studied using the high temperature which makes ceramics softened and heat affected recently. This study makes an estimate of laser-assisted machining (LAM) if an economically practical process for manufacturing precision silicon nitride ceramic parts using laser beam. In this study, mechanical properties of silicon nitride at high temperature were observed. And during the LAM, it was observed that cutting force and tool wear were reduced and oxidation of machined surface was increased according to a increase of laser power.

• Journal of the Korean Ceramic Society
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• v.33 no.3
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• pp.269-276
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• 1996

The effect of sintering aids on the sinterability for silcion nitride has been studied by hundreds workers. However the effect of sintering aids on the machinability as the own trobles which is the major barrier for the field applications of the ceramic components has not been fully studied. in this study the contents of Al2O3 and Y2O3 in silicon nitride were varied from 0 to 8 wt% respectively. The physical and mechanical properties of the silcion nitride were measured. The optimal microstructure of silicon nitride balls with the excellent machinability by adding with various contents of sintering aids was studied by MGF(magnetic-fluid grinding)technique. An attempt to figure out how the mechanical properties influence the machinability of silicon-nitride ball was made.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1558-1560
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• 1998

Macroporous silicon diaphragms 20 to $200{\mu}m$ thick have been formed on p-type silicon by anistropic etching in TMAH solution and then by electrochemical etching in HF-ethanol-water solution with an applied current. The pores have a pore diameter of $1.5{\sim}2{\mu}m$, with a depth of $20{\sim}30{\mu}m$ and are not interconnected, which are in sharp contrast to the porous silicon reported previouly for similarly doped p-Si. The fabrication of macroporous silicon and free-standing diaphragms is expected to offer new applications for microsensors, micro-machining, and separators.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.1-7
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• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.203-208
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• 1998

Materials of the Frame hole in fishing trackle reel is made up a number large and small holes. Thus, it is difficult to effective machining. Abrasive flow machining(AFM) is useful to polish a internal or external surface of the 3-dimensional shape parts, which are used in many fields such as aerospace, automative, semi-conductor, and medical component industries. The machining process is that two hydraulic cylinders, which are located face to face, enforce abrasive media to the passage between workpiece and tooling parts alternately, and then the abrasives include in the media pass the passage and polish the surface of workpiece. The media which is made of polymer and abrasives plays the role of the tool for deburring or polishing complex shap workpiece by its viscoelastic characteristics. In this study, the abrasive media for abrasive flow machining was made by mixing viscielastic polymer with alunina and silicon carbide abrasive. Also, we present AFM device design and preliminary results of an investigation in to some aspects of the AFM process performance in fishing trackle reel.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.192-197
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• 1998

Abrasive flow machining is useful to abrasive polish a internal or external surface of the free shape dimensional parts, which are used in many fields such as machine tool parts, semi-conductor, and medical component industries. The machining process is that two hydraulic cylinders, which are located surface to surface, are enforce media to the passage between workpiece and tooling part alternately, and then the abrasives included in the media pass the passage and polish the surface of workpiece. The media which is made of polymer and abrasive plays complex have workpiece by its viscoelastic characteristics. In this study, the media for AMF was made by mixing viscoelastic polymer with alumina and silicon carbide abrasive respectively. As a result, alumina include media is also the experiments of deburring the inside burr of in order to analyse the deburring machinability of abrasive flow machining according to various machining parameters which were media flow rate extrusion pressure, passage gap, media viscosity, abrasive content, and abrasive grain size.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.1033-1034
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• 2009

• Journal of Sensor Science and Technology
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• v.9 no.6
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• pp.424-429
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• 2000

A novel differential pressure sensor has been developed with silicon beams embedded in a silicone rubber membrane. The transducer is usable for most applications involving exposure to harsh media. A piezoresistive differential pressure sensor using silicone rubber membrane has been fabricated on the selectively diffused (100)-oriented n/n+/n silicon substrates by a unique silicon micro-machining technique using porous silicon etching. The pressure sensitivity is about $0.66\;{\mu}V/mmHg$ and the non-linearity is less than 0.1%.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.