• Proceedings of the Materials Research Society of Korea Conference
• /
• 1994.11a
• /
• pp.124-124
• /
• 1994

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.9
• /
• pp.488-493
• /
• 2004

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.9
• /
• pp.196-203
• /
• 2004

SL(Stereolithography) part is made by piling up thin layers which causes the stair stepping effect at the surface of SL parts. The effect brings about excessive surface roughness and cuts down the merits of using SL part. Hence, additional post-machining finishing such as traditional grinding is required. But the traditional post-machining is detrimental to part geometry and time consuming. In this study, therefore, a paraffin coating and grinding post-machining is newly proposed to improve the surface quality of SL fart. The paraffin which has suitable properties for the proposed post-machining is coated all over the part surface. By grinding the only over-coated paraffin based on boundary of the SL part surface, the surface roughness can be improved without any damage on the part. Also, it is verified that SL part finished by the proposed post-machining process can be applied for rapid tooling as pattern through manufacturing silicon rubber molding and casting test.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.4
• /
• pp.1-5
• /
• 2019

This study has been focused on properties of surface technology for large diameter upper electrode using in high density plasma process as like semi-conductor manufacturing process. The experimental studies have been carried out to get mirror surface for upper electrode. For a formation of high surface quality upper electrode, single crystal silicon upper electrode has been mechanical and chemical machining worked. Mechanical machining work of the upper electrode is carried out with varying mesh type using diamond wheel. In case of chemical machining work, upper electrode surface roughness was observed to be strongly dependent upon the etchant. The different surface roughness characteristics were observed according to etchant. The machining result of the surface roughness and surface morphology have been analyzed by use of surface roughness tester, laser microscope and ICP-MS.

• Journal of Welding and Joining
• /
• v.28 no.6
• /
• pp.35-39
• /
• 2010

Generally, ceramic material is very difficult to machine due to high strength and hardness. However, ceramic material can be machined at high temperature by plastic flow as metallic material due to the deterioration of the grain boundary glassy phase. Recently, a new method was developed to execute cutting process with CBN cutting tool by local heating of surface with laser. There are various parameters in LAM because it is a complex process with laser treatment and machining. During laser assisted machining, high power results in reducing of cutting force and increasing tool life, but excessive power brings oxidation of the surface. The effect of laser power, feed rate, cutting depth and etc. were investigated on the life of cutting tool. Chips were observed to find out suitable machining conditions. Chips of SSN had more flow-types than HIPSN. It means SSN is easier to machining. The life of cutting tool was increased with increasing laser power and decreasing feed rate and cutting depth.

• Proceedings of the KIEE Conference
• /
• 2003.10a
• /
• pp.297-299
• /
• 2003

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.12
• /
• pp.2279-2286
• /
• 1992

A hypereutectic Aluminum-Silicon Alloy is widely used in the parts of autombile because of high-resistance and good strength. In this study, the cutting of a hypereutectic Al-Si alloy (A390) for extraction of Si particle was experimentally investigated. By proper selection of cutting tool materials and optimization of cutting conditions, economical machining of this alloy is achieved. The surface roughness relates closely with the feed rate and cutting speed.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.3
• /
• pp.35-42
• /
• 2011

This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

• Design & Manufacturing
• /
• v.17 no.2
• /
• pp.15-21
• /
• 2023

In this study, a diamond turning machine and a laser-assisted machining module were utilized for the complex combined cutting of aspheric shapes and fine patterns on the surface of high-hardness brittle material, silicon. The analysis of material's form accuracy and corrective machining was conducted based on key factors such as laser output, rotational speed, feed rate, and cutting depth to achieve form accuracy below 1 ㎛ and surface roughness below 0.1 ㎛. The cutting condition and corrective machining methods were investigated to achieve the desired form accuracy and surface roughness. The rotational speed of the spindle and the linear feed rate of the diamond turning machine were varied in five stages for the cutting condition test. Surface roughness and form accuracy were measured using both a contact surface profilometer and a non-contact surface profilometer. The experimental results revealed a tendency of improved surface roughness with increased rotational speed of the workpiece, and the best surface roughness and form accuracy were observed at a feed rate of 5 mm/min. Furthermore, based on the cutting condition experiments, corrective machining was performed. The experimental results demonstrated an improvement in form accuracy from 0.94 ㎛ to 0.31 ㎛ and a significant reduction in the average value of the surface roughness curve from 0.234 ㎛ to 0.061 ㎛. This research serves as a foundation for future studies focusing on the machinability in relation to laser output parameters.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.04a
• /
• pp.660-665
• /
• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.