• Journal of the Korean Society for Precision Engineering
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• v.26 no.4
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• pp.47-54
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• 2009

In the last few years, lasers have found new applications as tools for ceramic machining which is laser-assisted machining(LAM). LAM process for the machining of difficult-to-machine materials such as structural ceramics, has recently been studied on silicon nitride workpiece for a wide range of operating condition. However, there have been few studies on rake angle in LAM process. In this paper we analyzed difference of machinability between positive and negative rake angle in tools. We have obtained interesting results that we could eliminate chattering, lower specific cutting and cutting ratio in case of positive rake angle. The results suggest that positive rake angled tools can make more plastic deformation and stable cutting of silicon nitride in comparison with negative rake angled one.

• Laser Solutions
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• v.12 no.1
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• pp.25-33
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• 2009

In laser-assisted machining (LAM), laser beam is used to locally increase the temperature of a workpiece and thus to enhance the machinability. In order to set the temperature of the material removal area of a workpiece at an optimal value, process parameters, such as laser power, feed rate, and rotational velocity, have to be carefully controlled. In this work, the effects of laser power and feed rate on the temperature distribution of a silicon nitride rotating at a constant velocity were experimentally investigated. Using a pyrometer, temperatures at various locations of the silicon nitride were measured both in circumferential and axial directions. The measured temperatures were fitted to a quadratic equation to approximate the temperature at the cutting location. The machining results showed that cutting force and tool wear were decreased when the temperature at the cutting location was increased.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3113-3125
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• 1996

The objective of this study is to develop novel method named mechanical and chemical machining technique, which is capable of producing three dimensional patterns of few micrometers in dimension on a silicon wafer without the use of a mask. The strategy is to impart mechanical energy along the path of the pattern to be fabricated on a single crystal silicon by way on introdusing frictional interaction under controlled conditions. Then, the surface is preferentially etched to reveal the areas that have been mechanically energized. Upon completion of the etching process, the three dimensional pattern is produced on the silicon surface. Experiments have been conducted to identify the optimal tool material, geometery, as well as fabrication condition. The new technique introduced in this paper is significantly simpler than the conventional method which require sophisticated equipment and much time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.703-704
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.157-158
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.93-94
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• 2009

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.4
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• pp.27-32
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• 2006

This study aims to find the optimal cutting conditions, when are nonferrous metals(aluminum and silicon) are machined with diamond tool of diamond turning machine. Diamond turning machine has been widely used in manufacturing optical reflectors of nonferrous metals. Such as aluminium and copper are easy to be machined because of their proper ductility. But optical crystals being discussed here are characterized by their high brittleness which makes it difficult to obtain high quality optical surfaces on them. The purpose of this study is to find the optimum machining conditions for ductile cutting of silicon and aluminium.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.481-485
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• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.47-53
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• 2001

Results ar presented of a new process for internal precision finishing of slender fine ceramic pipes using a magnetic field generated by a permanent magnets. For finishing the interior surface of a long pipe, a new type of finishing equipment was developed which can be very easily used in an industrial surrounding. In general, the pipe is so slender that a conventional finishing tool is hardly inserted into the pipe deeply, being impossible to finish. Therefore, a new technology has been considered to finish inside of a slender ceramic pipe by a simple technique. In this experimental, Magnetic Abrasive Machining is applied for the inner surface of silicon nitride fine ceramic pipe using ferromagnetic particles mixed with chromium-oxide powder. It is shown the initial roughness of 2.6㎛ Ry(0.42㎛ Ra) in the inside surface can be precisely finished to the roughness of 0.1㎛ Ry(0.01㎛ Ra). This paper discusses the outline of the processing by the application of magnetic abrasive machining and a few finishing characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.136-144
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• 1992

Recently, Silicon Nitrde ceramic is regarded as the representative engineering ceramic with the excellent mechanical properties and many functions for mechanical components and parts among various kinds of ceramics in the mechanical industry. But, during the manufacturing of engineering ceramics, there is many volumetric shrinkage coupled with a distortion of the parts which is produced. Due to the requirement for high accuracy of size, form, and surface finish of the components, machining is needed surely. Nowdays, grinding with a resin bond type diamond wheels has been generally applied to machining of the engineering ceramics in the whole world because that it can be conveniently proceeded for workers to dress of tool and made with high reliability in producing factories among many bond type super-abrasive wheels yet. It is important task for attaining prescribed mechanical components with high reliability to observe the grinding mechanism of ceramics as like generation of cracks and chipping of material during process. Because they considerably effects on the strength characteristic of machined mechanical components. In this study, various surface grinding experiments using resin bond type diamond wheels are carried out for Silicon Nitride ceramic. Grinding mechanism of ceramics is observed experimentally and the relationship with various conditions is also attained. Form this experimental study, some useful machining data and information to determine proper machining condition for grinding of Silicon Nitride ceramic is obtained.