• Title/Summary/Keyword: SiH^* optical emission spectroscopy (OES)

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The study of SiON thin film for optical properties. (SiON 박막의 광학적 특성에 대한 연구)

  • Kim, D.H.;Im, K.J.;Kim, K.H.;Kim, H.S.;Sung, M.Y.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.247-250
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    • 2001
  • We studied optical properties of SiON thin-film in the applications of optical waveguide. SiON thin-film was grown in $300^{\circ}C$ by PECVD(plasma enhanced chemical vapor deposition) system. The change of SiON thin-film composition and refractive Index was studied as a function of varying $NH_3$ gas flow rate. As $NH_3$ gas flow rate was increased, Quantity of N and refractive index were increased at the same time. By the results, we could form the SiON thin-film to use of a waveguide with refractive index of 1.6. We analyzed the conditions of the thin-film with FTIR(fourier transform infrared) and OES (optical emission spectroscopy). N-H bonding($3390cm^{-1}$ ) can be removed by thermal annealing. And we could observe the SiH bonding state and quantity by OES analysis in $SiH_4$

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Thin Film Characterization on Refractive Index of PECVD SiO2 Thin Films

  • Woo Hyuck Kong;In Cheon Yoon;Seung Jae Lee;Yun Jeong Choi;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.35-39
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    • 2023
  • Silicon oxide thin films have been deposited by plasma-enhanced chemical vapor deposition in SiH4 and N2O plasma along the variation of the gas flow ratio. Optical emission spectroscopy was employed to monitor the plasma and ellipsometry was employed to obtain refractive index of the deposited thin film. The atomic ratio of Si, O, and N in the film was obtained using XPS depth profiling. Fourier Transform Infrared Spectroscopy was used to analyze structures of the films. RI decreased with the increase in N2O/SiH4 gas flow ratio. We noticed the increase in the Si-O-Si bond angles as the N2O/SiH4 gas flow ratio increased, according to the analysis of the Si-O-Si stretching peak between 950 and 1,150 cm-1 in the wavenumber. We observed a correlation between the optical emission intensity ratio of (ISi+ISiH)/IO. The OES intensity ratio is also related with the measured refractive index and chemical composition ratio of the deposited thin film. Therefore, we report the added value of OES data analysis from the plasma related to the thin film characteristics in the PECVD process.

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The study of SiON thin film for optical properlies (SiON 박막의 광학적 특성에 대한 연구)

  • 김도형;임기주;김기현;김현석;김상식;성만영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.247-250
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    • 2001
  • We studied optical properties of SiON thin-film in the applications of optical waveguide. SiON thin-film was grown in 300$^{\circ}C$ by PECVD(plasma enhanced chemical vapor deposition) system. The change of SiON thin-film composition and refractive Index was studied as a function of varying NH$_3$ gas flow rate. As NH$_3$ gas flow rate was increased, Quantity of N and refractive index were increased at the same time. By the results, we could form the SiON thin-film to use of a waveguide with refractive index of 1.6. We analyzed the conditions of the thin-film with FTIR(fourier transform infrared) and OES(optical emission spectroscopy). N-H bonding(3390cm$\^$-1/) can be removed by thermal annealing. And we could observe the SiH bonding state and quantity by OES analysis in SiH$_4$

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Relationship between Secondary Electron Emissions and Film Thickness of Hydrogenated Amorphous Silicon

  • Yang, Sung-Chae;Chu, Byung-Yoon;Ko, Seok-Cheol;Han, Byoung-Sung
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.4
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    • pp.185-189
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    • 2004
  • The temporal variation of a secondary electron emission coefficient (${\gamma}$ coefficient) of hydrogenated amorphous silicon (a-Si:H) was investigated in a dc silane plasma. Estimated ${\gamma}$ coefficients have a value of 2.73 ${\times}$ 10$^{-2}$ on the pure aluminum electrode and 1.5 ${\times}$ 10$^{-3}$ after 2 hours deposition of -Si:H thin films on a cathode. It showed an abrupt decrease for about 30 minutes before saturation. The variation of the ${\gamma}$ coefficient was estimated as a function of the thin film thickness, and the film thickness was about 80 nm after 30 minutes deposition time. These results are compared with the results of a computer simulation for ion penetration into a cathode.

Roll-to-Roll Barrier Coatings on PET Film by Using a Closed Drift Magnetron Plasma Enhanced Chemical Vapor Deposition

  • Lee, Seunghun;Kim, Jong-Kuk;Kim, Do-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.124-125
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    • 2012
  • Korea institute of materials science (KIMS) use a linear deposition source called as a closed drift linear plasma source (CDLPS) as well as dual magnetron sputtering (DMS) to deposit SiOxCyHz films in $HMDSO/O_2$ plasma. The CDLPS generates linear plasma using closed drifting electrons and can reduce device degradations due to energetic ion bombardments on organic devices such as organic photovoltaic and organic light emission diode by controlling an ion energy. The deposited films are investigated by Fourier transform infrared (FT-IR) spectroscopy, X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Optical emission spectroscopy (OES) is used to measure relative radical populations of dissociation and recombination products such as H, CH, and CO in plasma. And SiOx film is applied to a barrier film on organic photovoltaic devices.

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Synthesis of SiNx:H films in PECVD using RF/UHF hybrid sources

  • Shin, K.S.;Sahu, B.B.;Lee, J.S.;Hori, M.;Han, Jeon G.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.136.1-136.1
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    • 2015
  • In the present study, UHF (320 MHz) in combination with RF (13.56 MHz) plasmas was used for the synthesis of hydrogenated silicon nitride (SiNx:H) films by PECVD process at low temperature. RF/UHF hybrid plasmas were maintained at a fixed pressure of 410 mTorr in the N2/SiH4 and N2/SiH4/NH3 atmospheres. To investigate the radical generation and plasma formation and their control for the growth of the film, plasma diagnostic tools like vacuum ultraviolet absorption spectroscopy (VUVAS), optical emission spectroscopy (OES), and RF compensated Langmuir probe (LP) were utilized. Utilization of RF/UHF hybrid plasmas enables very high plasma densities ~ 1011 cm-3 with low electron temperature. Measurements using VUVAS reveal the UHF source is quite effective in the dissociation of the N2 gas to generate more active atomic N. It results in the enhancement of the Si-N bond concentration in the film. Consequently, the deposition rate has been significantly improved up to 2nm/s for the high rate synthesis of highly transparent (up to 90 %) SiNx:H film. The films properties such as optical transmittance and chemical composition are investigated using different analysis tools.

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A Formation of the $Fluorocarbonated-SiO_2$ Films on Si(100) ASubstrate by $O_2/FTES-High$ Density Plasma CVD

  • Oh, Kyoung-Suk;Kang, Min-Sung;Lee, Kwang-Man;Kim, Duk-Soo;Kim, Doo-Chul;Choi, Chi-Kyu;Yun, Seak-Min;Chang, Hong-Young
    • Journal of the Korean Vacuum Society
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    • v.7 no.s1
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    • pp.106-117
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    • 1998
  • Fluorocarbonated-SiO2 films were deposited on p-type Si(100) substrate using FSi$(OC_2H_5)_3$ (FTES), and $O_2$ mixture gases by a helicon plasms source. High density $O_2$/FTES/Ar plasma of ~$10^{12} \textrm{cm}^{-3}$ is obtained at low pressure (<3mTorr) with RF power above 900 W in the helicon plasma source. Optical emission spectroscopy (OES) is used to study the relation between the relative densities of the radicals and the film properties. The FTES and $O_2$ gases are greatly dissociated at the helicon mode that is launched at the above threshold plasma density. FTIR and XPS spectra shows that the film has Si-F, and C-F bonds during the formation process of the film which may lower the dielectric constant greatly. The relative dielectric constant, leakage current density, and dielectric breakdown voltage are about 2.8, $8\times10^{-9}\textrm{A/cm}^2$, and > 12 MV/cm, respectively.

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He-SiH4혼합가스를 이용하여 RF-PECVD에 의해 증착된 수소화된 나노결정질 실리콘 박막의 재료적 특성에 관한 연구

  • Kim, In-Gyo;Jeong, Ho-Beom;Im, Jong-Hyeok;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.170-170
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    • 2011
  • 태양전지와 박막 트랜지스터를 위한 유망한 재료로서 수소화된 비정질 실리콘과 나노결정 실리콘 박막이 관심을 받아 왔다. 특히, 수소화된 나노결정 실리콘 박막은 비정질 대비 높은 방향성과 조밀한 구조 덕에 박막 태양전지나 TFT(Thin film transistor) 소자의 성능 향상에 기여할 수 있는 물질로 연구되고 있다. 이러한 박막들은 보통 $SiH_4$같은 Si을 포함한 가스에 다량의 $H_2$를 희석시켜 플라즈마 화학 증착법(PECVD, Plasma Enhanced Chemical Vapor Deposition)에 의해 성장된다. 이러한 CVD증착 방식을 이용하여 결정화된 박막을 얻기 위해서는 대개 높은 수소 희석비를 이용하는 것이 일반적이나, 이러한 공정 방식은 실리콘이 결합되어야 할 결합위치에 bonding energy가 더 높은 수소의 결합을 촉진하게 된다. 이러한 특성은 박막 태양전지에서 효율을 떨어뜨리는 주요 요소로 작용하고 있다.(1) 본 연구에서는 수소의 결합 확률을 낮춘 결정화된 박막을 성장시키기 위해 수소를 대신하여 헬륨을 희석가스로 사용하여 박막을 증착하고 그 특성을 분석해 보았다. 박막의 구조적 특성, 결정화도(Xc), 플라즈마 내 활성 라디칼(Active radical in plasma), Si-H결합 특성, 전도도(Conductivity)와 같은 박막 특성을 알아보기 위해 주사전자현미경(SEM, Scanning Electron Microscopy), 라만 분광기(Raman spectroscopy), 광 방출 분광기(OES, Optical Emission Spectrocopy), 적외선 분광기(FT-IR, Fourier Transform-Infrared Spectroscopy), Keithley measurement kit이 사용되었다. 수소를 대신하여 헬륨을 사용함으로써 동일 결정화도 대비 10%이상 낮은 microstructure factor 값을 얻을 수 있었으며 인가되는 RF 전력을 140W까지 증가시켰을 때 약 80%의 결정화도를 관찰할 수 있었다.

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Physical properties of TiN thin films deposited by grid-assisted magnetron sputtering

  • Jung, Min J.;Nam, Kyung-H.;Han, Jeon-G.;Shaginyan, Leonid-R.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2002.05a
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    • pp.46-46
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    • 2002
  • It is well known that thin film growth and surface morphology can be substantially modified by ion-bombardment during the deposition. This is particularly important in case of thin-film deposition at low temperatures where the film growth occurs under highly nonequilibrium conditions. An attractive way to promote crystalline growth and surface morphology is deposition of additional energy in to the surface of the growing film by bombardment with hyperthermal particles. We were deposited crystalline Ti and TiN thin films on Si substrate by magnetron sputtering method with grid. Its thin films were highly smoothed and dense as increasing grid bias. In order explore the benefits of a bombardment of the growing film with high energetic particles. Ti and TiN films were deposited on Si substrates by an unbalanced magnetron sputter source with attached grid assembly for energetic ion extraction. Also, we have studied the variation of the plasma states by Langmuir probe and Optical Emission Spectroscopy (OES). The epitaxial orientation. microstructual characteristics. electrical and surface properties of the films were analyzed by XRD. SEM. Four point probe and AFM.

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Si 함유 다이아몬드상 카본 필름의 환경 변화에 따른 마찰거동 연구

  • 박세준;이광렬;공호성;양승호
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.126-126
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    • 2000
  • 다이아몬드상 카본(DLC) 필름은 경도가 높고, 마찰계수가 낮다는 장점을 가지고 있기 때문에 내마모성 코팅이나 윤활성코팅에 응용을 위한 연구가 활발히 진행중이다. 하지만 마찰계수가 주변환경에 매우 큰 영향을 받는다는 단점이 있다. 이러한 단점은 DLC필름의 응용에 대한 저해 요인이 되며, 이 점을 보완하기 위해서 DLC 필름에 Si을 첨가하는 연구들이 진행되고 있다. 본 실험에서는 r.f-PACVD 법을 이용하여 Si이 첨가된 DLC 필름의 주위 환경 변화에 따른 마찰특성의 변화를 연구하였다. 사용한 반응 가스는 벤젠(C6H)과 희석된 Silane(SiH4 : H2 = 10 : 90)이며, 희석된 Silane과 벤젠의 첨가비율을 조절하여 필름내 Si의 함량을 조절하였고, 증착시 바이아스의 전압은 -400V로 하였다. 마찰테스트는 Ball-on-Disk type의 조건에서 대기, 건조공기, 진공의 세가지 분위기에서 마찰테스트를 실행하였다. 실험결과 마찰계수는 건조공기, 대기, 진공의 순으로 증가하였고, 필름내에 포함되어 있는 Si의 양이 증가할수록 마찰계수는 낮고 안정한 값을 나타내었다. Tribochemiacal 분석과, ball과 track의 전자현미경 사진 분석 결과, 진공에 비해서 건조공기와 대기중에서 마찰계수가 낮은 것은 DLC 필름내에 마모 track 중심부에 Si-C-O 계의 화합물이 형성되어, 이 화합물이 마찰계면에 존재하여 마찰계수를 낮추었음을 확인하였다. 그리고 대기중에서 실험한 경우, 습기의 존재로 인해 마모입자가 볼의 표면에서 엉김으로써 건조공기의 상태에서 보다 높은 마찰저항을 갖게 됨으로 인하여 마찰계수가 높아짐을 알 수 있었다.a)는 as-deposit 상태이며, 그림 1(b)는 45$0^{\circ}C$, 60min 열처리한 plan-view TEM 사진이다.dical의 영향을 조사하였으며 oxygen radical의 rf power에 따른 변화는 OES(Optical emission spectroscopy)를 사용하였다. 너무 적은 oxygen ion beam flux나 oxygen radical은 film의 전도도 및 투과도를 저하시켰고 반면 너무 과도한 flux의 증가 시는 전도도는 감소하였고 투과도는 증가하는 경향을 보였다. 기판에 도달하는 oxygen ion flux는 faraday cup을 이용하여 측정하였으며 증착된 ITO film은 XPS, UV-spectrometer, 4-point probe를 이용하여 분석하였다. 때문으로 생각되어진다. 또한, 성장 온도가 낮아짐에 따라 AlGaN의 성장을 저해하기 때문으로 판단된다. 성장 온도 변화에 따라 성장된 V의 구조적 특성 및 표면 거칠기 변화를 관찰하여 AlGaN의 성장 거동을 논의하겠다.034, 0.005 정도로 다시 감소하였다. 박막의 유전율은 약 35 정도의 값을 나타내었으며 X-선 회절 data로부터 분석한 박막의 변형은 증온도에 따라 7.2%에서 0.04%로 감소하였고 이 이경향은 유전손실은 감소경향과 일치하였다.는 현저하게 향상되었다. 그 원인은 SB power의 인가에 의해 활성화된 precursor 분자들이 큰 에너지를 가지고 기판에 유입되어 치밀한 박막이 형성되었기 때문으로 사료된다.을수 있었다.보았다.다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품

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