• 한국세라믹학회지
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• 제36권8호
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• pp.829-834
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• 1999

산화물 첨가에 의한 불투명화 실리카 에어로겔이 졸-겔 초임게 건조법으로 제조 되었으며 그들의 기계적 강도 및 열전도도 특성이 연구되었다. SiO2-10 mol% TiO2와 SiO2-10 mol% Fe2O3 에어로겔의 압축강도는 순수 실리카 에어로겔의 강도(0.025 MPa)에 비해 훨씬 높은 0.11 MPa과 0.047 MPa 정도 이었으며 TiO2에 의한 불투명화 실리카 에어로겔의 열전도도는 $400^{\circ}C$에서 0.0205 W/m · K 정도로 매우 낮은 값이었다. 순수 실리카 에어로겔의 기계적 강도 증진 및 고온 열전도도 증가를 억제하기 위한 불투명화제로는 TiO2가 Fe2O3에 비해 훨씬 효과적임을 알 수 있었다.

• 한국세라믹학회지
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• 제53권4호
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• pp.386-392
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• 2016

Heat insulation plates of fumed silica were prepared by mixing fumed silica, SiC powder and chopped glass fiber by a high speed mixer followed by pressing of the mixture powder in a stainless steel mold of $100{\times}100mm$. Composition of the plates, particle size of SiC, and type of inorganic binder were varied for observation of their contribution to heat insulation of the plate. The plate was installed on the upper portion of an electric furnace the inside temperature of which was maintained at $400^{\circ}C$ and $600^{\circ}C$, for investigation of heat transfer through the plate from inside of the electric furnace to outside atmosphere. Surface temperatures were measured in real time using a thermographic camera. The particle size of SiC was varied in the range of $1.3{\sim}17.5{\mu}m$ and the insulation was found to be most excellent when SiC of $2.2{\mu}m$ was incorporated. When the size of SiC was smaller or larger than $2.2{\mu}m$, the heat insulation effect was decreased. Inorganic binders of alkali silicate and phosphate were tested and the phosphate was found to maintain the heat insulation property while increasing mechanical properties.

• 한국세라믹학회지
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• 제44권12호
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• pp.747-750
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• 2007

The thermal conductivities of nano-sized fumed silica-based insulation media were investigated by varying a mean particle size of the silicon carbide opacifiers and ceramic fiber content. Opacifying effect of ceramic fiber and silicon carbide powders was discussed in terms of their content and the mean particle size of them. As the fiber contents increased from 10 wt% to 30 wt% in a material, its thermal conductivity at temperatures of about $620^{\circ}C$ decreased from 0.171 $Wm^{-1}K^{-1}$ to 0.121 $Wm^{-1}K^{-1}$. Meanwhile, the thermal conductivity at temperatures of about $625^{\circ}C$ decreased from 0.128 $Wm^{-1}K^{-1}$ to 0.092 $Wm^{-l}K^{-1}$ as the mean SiC particle size decreased from $31{\mu}m$ to $10{\mu}m$.