• Title/Summary/Keyword: Shear-welding

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Effect of Heat Input of Outside Weld on Low Temperature Toughness of Inside Weld for Multiple Electrode SA Welded API 5L X70 with Sour Gas Resistance (내부식용 API 5L X70 다전극 SAW 용접부의 내면 저온인성에 미치는 외면 입열의 영향)

  • An, Hyun-Jun;Lee, Hee-Keun;Park, Young-Gyu;Eun, Seong-Su;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.32 no.1
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    • pp.93-101
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    • 2014
  • This study aims to investigate the effect of heat input of outside SAW weld on low temperature toughness($-20^{\circ}C$) of inside SAW weld for API 5L X70 with sour gas resistance. As increasing heat input of the outside weld, low temperature toughness of the inside weld was decreased. Especially, in spite of the same heat input, the value of low temperature toughness was fluctuated. On the basis of fracture and microstructure analysis, the low temperature toughness is correlated with the fracture area ratio of shear lips and four kinds of fracture sections. These sections were divided with size and shape of dimple correlated with grain boundary ferrite and cleavage correlated acicular and polygonal ferrite in grain. Therefore, it was seen that these sections were two of final solidification area in the inside weld and the outside weld, no reheated zone and reheated zone in the inside weld. In conclusion, it is thought that the difference of low temperature toughness at the same heat input is due to the fact that each of impact test specimens could have the different microstructure, even though the notch was machined under the error tolerance of 1mm. It is because the final solidification area of the inside weld is very narrow.

Non-contact Ultrasonic Inspection Technology of Fillet Weldments (필렛 용접부의 비접촉 초음파 검사 기법)

  • Park, Ik-Keun;Lee, Chul-Ku;Kim, Hyun-Mook;Park, Tae-Sung;Kim, Yong-Kwon;Cho, Yong-Sang;Song, Won-Joon;Ahn, Houng-Kun
    • Journal of Welding and Joining
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    • v.23 no.5
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    • pp.37-42
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    • 2005
  • The non-destructive Inspection of the fillet weldment has difficulties due to its geometrical complexity and uneasy access. The surface shear horizontal wave (SH-wave), however, has been successfully applied to the detection of cracks on the surface and sub-surface of the filet weldment heel part. The conventional ultrasonic inspection using the surface SH-wave is usually a contact method using piezoelectric transducer. Thus, it is not suitable for a field application because the reliability and repeatability of inspection are significantly affected by test conditions such as couplant, contact pressure and pre-process. In order to overcome this problem, a non-contact SH-wave inspection method using EMAT is propose. The experimental results with this non-contact method are compared with those with a conventional ultrasonic method in fillet weldment with slit type defects. It is shown that the non-contact inspection technique requires simple procedure and less time in the fillet weldment inspection.

Oxidation Effect on the Critical Velocity of Pure Al Feedstock Deposition in the Kinetic Spraying Process (저온분사 공정에서 알루미늄 분말의 산화가 임계 적층 속도에 미치는 영향)

  • Kang, Ki-Cheol;Yoon, Sang-Hoon;Ji, Youl-Gwun;Lee, Chang-Hee
    • Journal of Welding and Joining
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    • v.25 no.4
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    • pp.35-41
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    • 2007
  • In kinetic spraying process, the critical velocity is an important criterion which determines the deposition of a feedstock particle onto the substrate. In other studies, it was experimentally and numerically proven that the critical velocity is determined by the physical and mechanical properties and the state of materials such as initial temperature, size and the extent of oxidation. Compared to un-oxidized feedstock, oxidized feedstock required a greater kinetic energy of in-flight particle to break away oxide film during impact. The oxide film formed on the surface of particle and substrate is of a relatively higher brittleness and hardness than those of general metals. Because of its physical characteristics, the oxide significantly affected the deposition behavior and critical velocity. In this study, in order to investigate the effects of oxidation on the deposition behavior and critical velocity of feedstock, oxygen contents of Al feedstock were artificially controlled, individual particle impact tests were carried out and the velocities of in-flight Al feedstock was measured for a wide range of process gas conditions. As a result, as the oxygen contents of Al feedstock increased, the critical velocity increased.

Resistance Spot Weldability of Surface Roughness Textured Galvannealed Steel Sheets (표면조도처리 된 합금화 용융아연도금강판의 저항 점 용접성)

  • Park, Sang-Soon;Kim, Ki-Hong;Kang, Nam-Hyun;Kim, Young-Seok;Rhym, Young-Mok;Choi, Yung-Min;Park, Yeong-Do
    • Korean Journal of Metals and Materials
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    • v.46 no.8
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    • pp.495-505
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    • 2008
  • With the high proportion of zinc coated steels in body-in-white assembly, newly developed surface roughness textured galvannealed steel sheets have been introduced. In this study, zinc coated and surface roughness textured steel sheets were welded by resistance spot welding to investigate its weldability including electrode wear test. Based on the results of tensile-shear test, nugget diameter changes, and electrode tip growth test, it was clear that both surface roughness textured steels (GA-T and GA-E) showed good weldability. Also, there was no large difference in weldability and electrode wear behavior between GA-T and GA-E steels which have different surface roughness morphology. An analysis of electrode degradation showed Fe and Zn penetration through the electrode tip surface at 2400 welds reached $55{\sim}60{\mu}m$ and $75{\sim}80{\mu}m$, respectively. Therefore, there is no significant effect of surface roughness morphology on spot weldability of surface roughness textured galvannealed steel sheets. However, slight difference in thickness of alloying layers existing on electrode tip was found between GA-T and GA-E steels.

Behavior of the Crack Initiation, Transition and Fatigue Crack Growth of Rail Steel (레일강의 균열발생·천이 및 피로균열진전거동)

  • Lee, Jong Sun;Kang, Ki Weon;Choi, Rin;Kim, Jung Kyu
    • Journal of Korean Society of Steel Construction
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    • v.11 no.1 s.38
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    • pp.33-42
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    • 1999
  • In the present study, crack initiation criteria, static failure and tensile mode fatigue behavior for a rail steel are evaluated to assure the railway vehicle's safety. The transverse fissure, which is the most critical damage in the rail, is initiated by the maximum shear stress and its location is subsurface. In addition, the possibility of transition from the shear mode to the mixed mode increases with increasing the length of subsurface crack. Because of the brittleness by the welding, the fracture toughness of the welded part is lower than of the base metal. For low ${\Delta}K$, the stage II fatigue crack growth rates of the welded part is slower than of the base metal but, for high ${\Delta}K$, this different behavior for fatigue crack growth rate is nearly diminished. These trends are more remarkable for low stress ratio, R=0.1. It is believed that this behavior is caused by the change of the microstructure which that of the welded part is coarser than of base metal.

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Reliability evaluation of Pb-free solder joint with immersion Ag-plated Cu substrate (Immersion Ag가 도금된 Cu기판을 가진 Pb-free solder 접합부의 신뢰성 평가)

  • Yun Jeong-Won;Jeong Seung-Bu
    • Proceedings of the KWS Conference
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    • 2006.05a
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    • pp.30-32
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    • 2006
  • The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

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The Behavior of Anchor Connections of Cold-Formed Steel Roof Truss (경량형강 지붕트러스 앵커부의 거동)

  • Kwon, Young Bong;Kang, Sueng Won;Chung, Hyun Suk;Choi, Young Hyun
    • Journal of Korean Society of Steel Construction
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    • v.15 no.5 s.66
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    • pp.519-529
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    • 2003
  • In recent years, the use of cold-formed steel roof truss has been increased in the steel houses and high-rise apartments. The design of the roof truss anchor connections has been based on the experience and decision of designers. In this paper, the structural behavior of anchor connections based on experimental and decision is described. In the tests, truss members and connection members were jointed directly with self-drilling screw fasteners and the simple shaped connection member with excellent workability and structural capacity was used to connect roof truss and sub-structure. The connecting method was selected according to the construction material of sub-structure: chemical anchor for reinforced concrete structure and welding or DX-Pin for steel structures. The pull-out tests of various type anchor connection were executed to obtain the strength and the stiffness and the result have been compared with AISI(1996) and AlSC(1989) specifications, Simple formulas for the shear strength of screw connections have been propose and compared with tests.

Ultrasonic bonding between Si-wafer and FR-4 at room temperature using Sn-3.5Ag solder (Sn-3.5Ag 무연 솔더를 이용한 Si-wafer와 FR-4기판의 상온접합)

  • Kim, Jeong-Mo;Jo, Seon-Yeon;Kim, Gyu-Seok;Lee, Yeong-U;Jeong, Jae-Pil
    • Proceedings of the KWS Conference
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    • 2005.06a
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    • pp.54-56
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    • 2005
  • Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

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Effect of the Heat Input on the Tensile Properties in Arc Brazing of Ferritic Stainless Steel using Cu-Si Insert Alloy (Cu-Si계 삽입금속을 사용한 페라이트계 스테인리스강의 아크 브레이징에서 인장성질에 미치는 입열량의 영향)

  • Kim, Myung-Bok;Kim, Sang-Ju;Lee, Bong-Keun;Yuan, Xin Jian;Yoon, Byoung-Hyun;Woo, In-Su;Kang, Chung-Yun
    • Korean Journal of Metals and Materials
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    • v.48 no.4
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    • pp.289-296
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    • 2010
  • The effects of heat input and different microstructureswere investigated on the tensile-shear properties of an arc-brazed joint of theferritic stainless steel 429EM using a Cu-Si insert alloy. The brazing speed was fixed at 800 mm/min whilethe brazing current varied from 80 to 120A. For abrazing current lower than 100A, fracturing occurred at the joint root in the direction perpendicular to the tensile load. As the brazing current increased to 120A, fracturing occurred at the base metal or the joint root. The joint and the base metal had very similar yield and tensile load values. However, the amount of elongation was decreased considerably compared to when the base metal was used. The fracturing began at the triple point of the root part and was classified into three types. The difference in the tensile-shear properties was closely related to the three fracture types.

Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module (태양광 접속함 정션박스 모듈 적용을 위한 Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In 솔더링의 공정최적화)

  • Lee, Byung-Suk;Oh, Chul-Min;Kwak, Hyun;Kim, Tae-Woo;Yun, Heui-Bog;Yoon, Jeong-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.13-19
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    • 2018
  • The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.